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April 02, 2015 6:28 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Pac Tech - Packaging Technologies GmbH

Company Overview

Pac Tech - Packaging Technologies GmbH provides wafer bumping, packaging, and solder ball placement equipment. It offers electroless Ni plating equipment that includes electroless plating, plasma descum and etch, spin coating and developer, and ultrasonic cleaning tools; and solder balling and solder ball rework equipment, such as solder jetting, wafer level solder balling, and wafer level solder rework/reballing equipment. The company also offers backend and assembly equipment, which comprises flip chip assembly, capacitor bonding, cantilever bonding, backside laser marking, and wafer level reflow oven equipment; and photovoltaic equipment, such as automatic laser soldering machines for ass...

Am Schlangenhorst 15 - 17

Nauen,  14641

Germany

Founded in 1995

Phone:

49 3321 4495100

Fax:

49 3321 44 95 110

Key Executives for Pac Tech - Packaging Technologies GmbH

Chief Executive Officer of Pactech Group and President of Pactech Group
President of Pac Tech USA Inc and Chief Technology Officer of Pac Tech USA Inc
Chief Technology Officer
Age: 57
Vice President of Global Sales & Marketing
Compensation as of Fiscal Year 2014.

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