October 25, 2016 5:51 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Pac Tech - Packaging Technologies GmbH

Company Overview

Pac Tech - Packaging Technologies GmbH provides wafer bumping, packaging, and solder ball placement equipment. It offers electroless Ni plating equipment that includes electroless plating, plasma descum and etch, spin coating and developer, and ultrasonic cleaning tools; and solder balling and solder ball rework equipment, such as solder jetting, wafer level solder balling, and wafer level solder rework/reballing equipment. The company also offers backend and assembly equipment, which comprises flip chip assembly, capacitor bonding, cantilever bonding, backside laser marking, and wafer level reflow oven equipment; and photovoltaic equipment, such as automatic laser soldering machines for ass...

Am Schlangenhorst 15 - 17

Nauen,  14641


Founded in 1995


49 3321 4495100


49 3321 44 95 110

Key Executives for Pac Tech - Packaging Technologies GmbH

Chief Financial Officer
Chief Executive Officer of Pactech Group and President of Pactech Group
President of Pac Tech USA Inc and Chief Technology Officer of Pac Tech USA Inc
Vice President of Global Sales & Marketing
Compensation as of Fiscal Year 2016.

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Recent Private Companies Transactions

No transactions available in the past 12 months.

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