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September 01, 2015 6:12 AM ET

Professional Services

Company Overview of IBM Research, Inc

Company Overview

IBM Research, Inc offers technology research and consulting services. The company provides technology analysis, algorithm, and system integration services. Additionally, it offers project management and technical consulting services. IBM Research, Inc is based in Yorktown Heights, New York. IBM Research, Inc operates as a subsidiary of International Business Machines Corporation.

P.O. Box 218

Yorktown Heights, NY 10598

United States

Key Executives for IBM Research, Inc

Director
Age: 61
Vice President
Vice President of Industry Solutions and Emerging Business
Executive Director
Vice President of Services Research and Global Labs
Compensation as of Fiscal Year 2015.

IBM Research, Inc Key Developments

IBM Research in Partnership with GLOBALFOUNDRIES and Samsung Produces 7nm Node Test Chips

An alliance led by IBM Research announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything from smartphones to spacecraft. To achieve the higher performance, lower power and scaling benefits promised by 7nm technology, researchers had to bypass conventional semiconductor manufacturing approaches. Among the novel processes and techniques pioneered by the IBM Research alliance were a number of industry-first innovations, most notably Silicon Germanium (SiGe) channel transistors and Extreme Ultraviolet (EUV) lithography integration at multiple levels. Industry experts consider 7nm technology crucial to meeting the anticipated demands of future cloud computing and Big Data systems, cognitive computing, mobile products and other emerging technologies. Part of IBM's $3 billion, five-year investment in chip R&D (announced in 2014), this accomplishment was made possible through a unique public-private partnership with New York State and joint development alliance with GLOBALFOUNDRIES, Samsung and equipment suppliers. The team is based at SUNY Poly's NanoTech Complex in Albany. Microprocessors utilizing 22nm and 14nm technology power servers, cloud data centers and mobile devices, and 10nm technology is well on the way to becoming a mature technology. The IBM Research-led alliance achieved close to 50% area scaling improvements over today's most advanced technology, introduced SiGe channel material for transistor performance enhancement at 7nm node geometries, process innovations to stack them below 30nm pitch and full integration of EUV lithography at multiple levels. These techniques and scaling could result in at least a 50% power/performance improvement for next generation mainframe and POWER systems that will power the Big Data, cloud and mobile era. The 7nm node milestone continues IBM's legacy of historic contributions to silicon and semiconductor innovation. They include the invention or first implementation of the single cell DRAM, the Dennard Scaling Laws, chemically amplified photoresists, copper interconnect wiring, Silicon on Insulator, strained engineering, multi core microprocessors, immersion lithography, high speed SiGe, High-k gate dielectrics, embedded DRAM, 3D chip stacking and Air gap insulators.

IBM Research, Inc Presents at MMTA's International Minor Metals Conference, Apr-29-2015 09:30 AM

IBM Research, Inc Presents at MMTA's International Minor Metals Conference, Apr-29-2015 09:30 AM. Venue: Fairmont Royal York Hotel, Toronto, Ontario, Canada. Speakers: Ho-Cheol Kim, Manager, Energy Research, Master Inventor.

IBM Research and Semtech Announces New Technology Based on Low-Power, Wide-Area Networks

IBM Research and Semtech announced a new technology based on low-power, wide-area networks (LPWANs) that offer significant advantages over cellular networks and Wifi for providing machine-to-machine (M2M) communications. The technology, called LoRaWAN (Long Range wide-area networks), overcomes these hurdles. Based on a new specification and protocol for low-power, wide-area networks that taps an unlicensed wireless spectrum, the technology can connect sensors over long distances, while offering optimal battery life and requiring minimal infrastructure. This allows it to deliver such benefits as improved mobility, security, bi-directionality, and localization/positioning, as well as lower costs. In support of LPWAN technology, IBM, Semtech, and other companies also announced the LoRa Alliance, a new association to support and develop the standardization LoRaWAN. The LoRa Alliance aims to combine hardware and software based on the LoRaWAN standard for telecom operators and network operators, enabling them to offer IoT services to both businesses and consumers. From sensors and machines to monitors and wearables, soon connecting billions of devices together could be as seamless as sending an SMS to your local telecom provider. LoRaWAN sensors can communicate over distances of more than 100 km (62 miles) in favorable environments, 15 km (9 miles) in typical semi-rural environments and more than 2 km (1.2 miles) in dense urban environments at data rates from 300 bit/s up to 100 kbit/s. This makes them well suited for sending small amounts of data, such as GPS coordinates and climate readings, where broadband can't reach. The sensors also require very little energy to operate; most can run for 10 years or more on a single AA battery, and AES128 keys make communication tampering and eavesdropping virtually impossible.

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