May 30, 2016 6:51 PM ET

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Company Overview of IBM Research, Inc

Company Overview

IBM Research, Inc offers technology research and consulting services. The company provides technology analysis, algorithm, and system integration services. Additionally, it offers project management and technical consulting services. IBM Research, Inc is based in Yorktown Heights, New York. IBM Research, Inc operates as a subsidiary of International Business Machines Corporation.

P.O. Box 218

Yorktown Heights, NY 10598

United States

Key Executives for IBM Research, Inc

Director
Age: 61
Vice President
Vice President of Industry Solutions and Emerging Business
Executive Director
Vice President of Services Research and Global Labs
Compensation as of Fiscal Year 2015.

IBM Research, Inc Key Developments

IBM and University of Maryland, Baltimore County Collaborate to Create the Accelerated Cognitive Cybersecurity Laboratory

IBM Research announced plans for a multi-year collaboration to create the Accelerated Cognitive Cybersecurity Laboratory (ACCL), which will be housed within the College of Engineering and Information Technology at UMBC. Opening in the fall of 2016, the lab will work to advance scientific frontiers in the application of cognitive computing to cybersecurity via analytics and machine learning, while also exploring specialized computer power optimized for these new intensive computing workloads. Cybersecurity threats are growing in both volume and sophistication. This issue is compounded by a growing shortage of security professionals, expected to reach 1.5 million unfilled positions by 2020. With the ACCL, IBM and UMBC will explore new ways to apply cognitive technologies which are able to digest, learn from, and reason over vast amounts of structured and unstructured data to help cybersecurity professionals gain an advantage in the battle against cybercrime. UMBC researchers will collaborate with IBM scientists to push the frontiers of research and develop innovative technology that will be able to, with a human analyst in the loop, detect, analyze and mitigate sophisticated threats quickly. This collaboration is part of IBM's ongoing academic initiatives that help students develop skills and understanding of cognitive computing to meet the increasing demand for high-skilled technology professionals. UMBC is one of eight leading universities in North America working to train IBM'sWatson for application in the cybersecurity space. Watson uses natural language processing to understand the vague and imprecise nature of human language in unstructured data. It can provide insights into emerging threats, as well as recommendations on how to stop them, increasing the speed and capabilities of security professionals.

IBM Research and CMU Announce Open Platform to Create Smartphone Apps

IBM Research and Carnegie Mellon University, or CMU, have announced an open platform to support the creation of smartphone apps that can enable the blind to navigate his surroundings. The IBM and CMU researchers used the platform to create a pilot app, called NavCog, that draws on existing sensors and cognitive technologies to inform blind people on the CMU campus about their surroundings by "whispering" into their ears through earbuds or by creating vibrations on smartphones. The app analyzes signals from Bluetooth beacons located along walkways and from smartphone sensors to help enable users to move without human assistance, whether inside campus buildings or outdoors. Researchers are exploring additional capabilities for future versions of the app to detect who is approaching and what is their mood.

IBM Research in Partnership with GLOBALFOUNDRIES and Samsung Produces 7nm Node Test Chips

An alliance led by IBM Research announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything from smartphones to spacecraft. To achieve the higher performance, lower power and scaling benefits promised by 7nm technology, researchers had to bypass conventional semiconductor manufacturing approaches. Among the novel processes and techniques pioneered by the IBM Research alliance were a number of industry-first innovations, most notably Silicon Germanium (SiGe) channel transistors and Extreme Ultraviolet (EUV) lithography integration at multiple levels. Industry experts consider 7nm technology crucial to meeting the anticipated demands of future cloud computing and Big Data systems, cognitive computing, mobile products and other emerging technologies. Part of IBM's $3 billion, five-year investment in chip R&D (announced in 2014), this accomplishment was made possible through a unique public-private partnership with New York State and joint development alliance with GLOBALFOUNDRIES, Samsung and equipment suppliers. The team is based at SUNY Poly's NanoTech Complex in Albany. Microprocessors utilizing 22nm and 14nm technology power servers, cloud data centers and mobile devices, and 10nm technology is well on the way to becoming a mature technology. The IBM Research-led alliance achieved close to 50% area scaling improvements over today's most advanced technology, introduced SiGe channel material for transistor performance enhancement at 7nm node geometries, process innovations to stack them below 30nm pitch and full integration of EUV lithography at multiple levels. These techniques and scaling could result in at least a 50% power/performance improvement for next generation mainframe and POWER systems that will power the Big Data, cloud and mobile era. The 7nm node milestone continues IBM's legacy of historic contributions to silicon and semiconductor innovation. They include the invention or first implementation of the single cell DRAM, the Dennard Scaling Laws, chemically amplified photoresists, copper interconnect wiring, Silicon on Insulator, strained engineering, multi core microprocessors, immersion lithography, high speed SiGe, High-k gate dielectrics, embedded DRAM, 3D chip stacking and Air gap insulators.

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