February 20, 2017 8:56 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Kinsus Interconnect Technology Corp.

Company Overview

Kinsus Interconnect Technology Corp. provides various IC package substrates in Taiwan. The company offers plastic BGA substrates, which are applied on plastic over molded products with die-up configuration, as well as used for chipsets, graphic chips, ASIC, FGPA, etc.; CSP, a wire bond version of substrate in a matrix form for IC chips, which require small package footprint and low profiles, such as SRAM, DRAM, flash memory, etc.; and enhanced BGA substrates for the IC chips, which require thermal dissipation. It also provides system-in-package, an IC package containing various die that is applicable for the IC chip modules for amplifiers, FETs, filters, duplexers, memory modules, etc.; flip...

1245, Junghua Road

Shin-Wu District



Founded in 2000


886 3 487 1919

Key Executives for Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp. does not have any Key Executives recorded.

Kinsus Interconnect Technology Corp. Key Developments

Kinsus Interconnect Technology Corp., Board Meeting, Feb 08, 2017

Kinsus Interconnect Technology Corp., Board Meeting, Feb 08, 2017. Agenda: To approve cash dividends to shareholders.

Kinsus Interconnect Technology Corp. Proposes Amendments to the Articles of Incorporation

Kinsus Interconnect Technology Corp. will propose amendments to the company's articles of incorporation at its Annual Shareholders' Meeting to be held on May 26, 2017.

Kinsus Interconnect Technology Corp. Announces Resignation of Lu, Jing as Assistant CEO Effective October 31, 2016

Kinsus Interconnect Technology Corp. announced the resignation of Ms. Lu, Jing as Assistant CEO effective October 31, 2016.

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Recent Private Companies Transactions

Private Placement
April 25, 2016
Kinsus Investment Co., Ltd.

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