February 27, 2015 8:13 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Kinsus Interconnect Technology Corp.

Company Overview

Kinsus Interconnect Technology Corp. provides various IC package substrates in Taiwan. The company offers plastic BGA substrates, which are applied on plastic over molded products with die-up configuration, as well as used for chipsets, graphic chips, ASIC, FGPA, etc.; CSP, a wire bond version of substrate in a matrix form for IC chips, which require small package footprint and low profiles, such as SRAM, DRAM, flash memory, etc.; and enhanced BGA substrates for the IC chips, which require thermal dissipation. It also provides system-in-package, an IC package containing various die that is applicable for the IC chip modules for amplifiers, FETs, filters, duplexers, memory modules, etc.; flip...

No. 1245, Junghua Road

Shin-Wu Shiang

Taoyuan,  

Taiwan

Founded in 2000

Phone:

886 3 487 1919

Fax:

886 3 467 1920

Key Executives for Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp. does not have any Key Executives recorded.

Kinsus Interconnect Technology Corp. Key Developments

Kinsus Interconnect Technology Corp. Presents at 11th Annual dbAccess Taiwan Conference 2015, Jan-15-2015

Kinsus Interconnect Technology Corp. Presents at 11th Annual dbAccess Taiwan Conference 2015, Jan-15-2015 . Venue: Grand Hyat, Taipei, Taiwan.

Kinsus Interconnect Technology Corp. Presents at Taiwan Corporate Day 2014, Jun-23-2014

Kinsus Interconnect Technology Corp. Presents at Taiwan Corporate Day 2014, Jun-23-2014 . Venue: The Mayfair Hotel, Stratton Street, London W1J 8LT, United Kingdom.

Kinsus Interconnect Technology Corp. Presents at Daiwa Taiwan Growth Focus Corporate Day in Tokyo, Jun-12-2014

Kinsus Interconnect Technology Corp. Presents at Daiwa Taiwan Growth Focus Corporate Day in Tokyo, Jun-12-2014 . Venue: Gran Tokyo North Tower 1-9-1, Marunouchi, Chiyoda-ku, Tokyo, Japan. Speakers: Jack Mu, Associate Vice President.

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