Electronic Equipment, Instruments and Components
Company Overview of InvenSense, Inc.
InvenSense, Inc. designs, develops, markets, and sells micro-electro-mechanical system (MEMS) gyroscopes for motion tracking devices in consumer electronics. The company delivers motion interface solutions based on its multi-axis technology that target smartphones and tablets, console and portable video gaming devices, digital still and video cameras, smart TVs, navigation devices, toys, and health and fitness accessories. It offers MEMS motion sensors, such as gyroscopes, accelerometers, compasses, and pressure sensors, as well as microphones. Its products include 6-axis MotionTracking System-on-a-Chip (SoC) devices for handheld and wearable consumer electronics products; ICM-20728 device, ...
1745 Technology Drive
San Jose, CA 95110
Founded in 2003
Key Executives for InvenSense, Inc.
Chief Executive Officer
Total Annual Compensation: $400.0K
Total Annual Compensation: $168.3K
Vice President of Engineering and New Product Development
Total Annual Compensation: $250.6K
Total Annual Compensation: $279.6K
Vice President of Worldwide Sales
Total Annual Compensation: $329.2K
Compensation as of Fiscal Year 2014.
InvenSense, Inc. Key Developments
InvenSense, Inc. Appoints Usama Fayyad to Serve as Member of its Board of Directors
Jan 15 15
On January 9, 2015, InvenSense, Inc. appointed Usama Fayyad to serve as a member of its Board of Directors. Mr. Fayyad was designated a Class II director and will stand for re-election at the 2016 Annual Meeting of Stockholders. Mr. Fayyad was also appointed to the Compensation Committee.
Robbins Geller Rudman & Dowd LLP Files Class Action Suit Against InvenSense, Inc
Jan 8 15
Robbins Geller Rudman & Dowd LLP announced that a class action has been commenced in the United States District Court for the Northern District of California on behalf of purchasers of InvenSense, Inc. common stock during the period between July 29, 2014 and October 28, 2014. The complaint charges InvenSense and certain of its officers and directors with violations of the Securities Exchange Act of 1934. InvenSense designs, develops, markets and sells Micro-Electro-Mechanical Systems sensors, such as accelerometers, gyroscopes and microphones, for use in smartphones and tablets, console and portable video gaming devices, and other types of consumer electronics. The complaint alleges that during the Class Period, defendants issued materially false and misleading statements regarding the Company's financial performance and outlook. Specifically, defendants concealed the adverse effects the Company would experience as a result of its agreement with Apple to supply sensors for the iPhone 6 and iPhone 6 plus at heavily discounted prices. The low prices charged to Apple, along with the low prices charged to one of its other customers, had negatively impacted, and would continue to negatively impact, the Company's margins. Instead of revealing the Company's true condition and prospects, defendants concealed these adverse facts from investors and chose to issue strong guidance. As a result of defendants false and misleading statements and/or omissions, InvenSense common stock traded at artificially inflated prices during the Class Period, reaching a high of $25.85 per share, allowing certain of the Company's insiders to sell their personally held stock at artificially inflated prices for aggregate proceeds of over $5.3 million. Then, on October 28, 2014, InvenSense announced disappointing financial results for the quarter ended September 28, 2014, and revealed a substantial drop-off in margins due in large part to the low prices it had charged its customers, operational inefficiencies with the iPhone 6 rollout, and a charge related to old inventory. The Company's announcements caused InvenSense shares to plummet more than 25% in one day. Plaintiff seeks to recover damages on behalf of all purchasers of InvenSense common stock during the Class Period.
Invensense, Inc. Announces ICM-30630 -Integrated Motion Sensor and Multi-Core Processing Sensor System-On-Chip
Jan 6 15
InvenSense, Inc. announced the Sensor System on Chip integrating a 6-axis MEMS sensor, tri-core sensor hub, embedded Flash and SRAM, and software framework. The ICM-30630 disrupts the traditional discrete sensor subsystem in many applications by providing a true turn-key and open solution in the same footprint as competitive sensor only devices (3 mm x 3 mm x 1 mm LGA package). The ICM-30630 consists of three distinct processors; an ARM Cortex-M0 microcontroller and InvenSense's next generation Digital Motion Processors; DMP3 and DMP4. The DMP3 offloads all motion processing tasks from the CPU and provides ready-to-use physical and virtual sensors at ultra-low power, while the DMP4's processing capabilities complements the CPU by offloading computationally-intensive operations, drastically reducing power consumption. In tandem, the InvenSense ICM-30630 sensor software framework and Cortex-M0 handle vital sensor management tasks through an integrated RTOS and provides an 'Open Platform' that is programmable by any OEM allowing for custom software features, ease of programming and quick time-to-market. The resulting solution supports the acquisition and processing of sensor data from the integrated 6-axis gyroscope and accelerometer, as well as external sensors, which in turn significantly reduces system power consumption and improves 'AlwaysOn' performance. The ICM-30630 is fully compliant with Android Lollipop, and other operating systems, while supporting multiple application processor platforms. The ICM-30630 solution is footprint compatible with InvenSense's existing devices and will sample first half year of 2015. InvenSense is exhibiting in booth #35806 in South Hall 4 at the 2015 Consumer Electronics Show taking place in Las Vegas, Nevada from January 6 - 9, 2015.
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