July 25, 2017 11:26 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of ClariPhy Communications, Inc.

Company Overview

ClariPhy Communications, Inc. is a semiconductor company that develops mixed signal advanced digital signal processing system-on-chips targeting multi-mode and multi-rate high performance optical network applications. The company’s products include coherent single chip quadrature amplitude modulation (QAM) transceivers, coherent single chip QAM/QPSK system-on-chips, coherent evaluation boards, and coherent single chip dual polarization quadrature phase shift keying transceivers. Its products are used for data centers, transport infrastructure, Internet backbone, cloud-based networks, enterprise networks, and submarine and telecom applications, as well as for metro, long haul, and ultra-long ...

7585 Irvine Center Drive

Suite 100

Irvine, CA 92618

United States

Founded in 2002





Key Executives for ClariPhy Communications, Inc.

Chief Executive Officer, President and Director
Age: 54
Co-founder, Chief Technology Officer and Director
Chief Financial Officer
Age: 75
Vice President of Operations
Age: 58
Chief Systems Architect and Vice President
Compensation as of Fiscal Year 2017.

ClariPhy Communications, Inc. Key Developments

49 Industry Leaders Collaborate to Define New 400G OSFP Transceiver Module for Next-Generation Cloud Datacenter Networks

Arista Networks, together with Acacia Communications, Accelink, Adva Optical Networking, Amphenol, AppliedMicro, Applied Optoelectronics, Barefoot Networks, Broadcom, Cavium, ClariPhy Communications, ColorChip, Coriant, Corning, Dell EMC, Finisar, Foxconn Interconnect Technology, Fujitsu Optical Components, Google, Hewlett Packard Enterprise, Hitachi Cable Systems, Huawei Technologies, Infinera, Innolight, Innovium, Inphi, Intel, Ixia, Juniper Networks, Kaiam, Lorom, Lumentum, Luxtera, Macom, Marvell, Mellanox Technologies, Molex, MultiLane, NeoPhotonics, NEL America, Nokia, Oclaro, PHY-SI, SAE, Senko, Source Photonics, Sumitomo Electric Industries, TE Connectivity, and Yamaichi Electronics announced the formation of the OSFP (Octal Small Form-factor Pluggable) Multi-Source Agreement. OSFP offers a unique combination of high front panel density and thermal performance that enables system designs with 32 400G ports per 1U that support the full range of 400G optics technologies, from datacenter to metro reach.

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