ultratech inc (UTEK) Key Developments
Ultratech, Inc. Presents at Barrington Research Spring Investment Conference, May-13-2015
May 1 15
Ultratech, Inc. Presents at Barrington Research Spring Investment Conference, May-13-2015 . Venue: Four Seasons Hotel, 120 East Delaware Place, Chicago, IL 60611, United States.
Ultratech, Inc. Reports Unaudited Consolidated Earnings Results for the First Quarter Ended April 4, 2015; Provides Financial Guidance for the Second Quarter of 2015
Apr 23 15
Ultratech, Inc. reported unaudited consolidated earnings results for the first quarter ended April 4, 2015. For the quarter, total net sales were $41.886 million against $31.609 million a year ago. Operating loss was $1.435 million against $7.188 million a year ago. Loss before income taxes was $1.327 million against $6.873 million a year ago. Net loss was $1.687 million or $0.06 per basic and diluted share against $6.971 million or $0.25 per basic and diluted share a year ago.
The company outlook for the second quarter of 2015 is an anticipated sequential revenue growth of 5% to 10% and an EPS of around breakeven. With the projected second quarter 2015 product mix, gross margin could increase slightly compared to the first quarter of 2015. Operating expenses look to be, sequentially, to be up modestly. Cash flow is anticipated to be positive for the second quarter of 2015.
Memory Manufacturer Places Follow-On Order for Ultratech's Superfast High-Volume Inspection System
Apr 15 15
Ultratech, Inc. announced that a major memory manufacturer from Asia placed a follow-on order for Ultratech's Superfast high-volume inspection system. Following the success of the Superfast 3G+ system in R&D, this customer ordered Ultratech's 4G inspection system to facilitate the yield ramp of its latest memory technology. Ultratech has shipped the Superfast 4G system in the first quarter of 2015. Ultratech's 4G system builds on the field-tested capability of the Superfast 3G+, providing the industry's high productivity and lowest-cost 3-D topography inspection solution compared to competing systems. With a displacement repeatability of 0.2nm 1 sigma, an edge exclusion of 1.5mm and throughput of 125 wafers-per-hour, the Superfast 4G inspection system was selected as the lithography distortion control solution. To ensure a smooth transition from the 3G+ to the 4G model for high-volume production, the two inspection systems have identical optical modules insuring excellent tool-to- tool matching. Building on the field-proven Superfast 3G+, Ultratech's 4G Inspection System provides the industry with a 3D topography solution for advanced lithography applications with the flexibility to measure front-side of patterned wafers anywhere in the production line. Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G inspection system for patterned wafers provides the industry's higher throughput, with the lowest cost-of-ownership (3x to 5x lower) compared to competing systems. Its direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as feed-forward overlay distortion control, 3D topography measurement for focus control, and high-stress process control. The Ultratech Superfast 4G inspection system provides leading technology to address the critical needs of its global customers in a cost-effective solution.
Ultratech, Inc. Presents at 16th Annual B. Riley & Co. Investor Conference, May-14-2015 11:30 AM
Apr 9 15
Ultratech, Inc. Presents at 16th Annual B. Riley & Co. Investor Conference, May-14-2015 11:30 AM. Venue: Loews Hollywood Hotel, Los Angeles, California, United States. Speakers: Bruce R. Wright, Chief Financial Officer, Principal Accounting Officer, Senior Vice President of Finance, Secretary and Treasurer.
Ultratech, Inc. to Report Q1, 2015 Results on Apr 23, 2015
Apr 2 15
Ultratech, Inc. announced that they will report Q1, 2015 results at 9:00 AM, Eastern Standard Time on Apr 23, 2015