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Last $7.23 USD
Change Today -0.02 / -0.28%
Volume 410.2K
STM On Other Exchanges
New York
As of 1:10 PM 10/8/15 All times are local (Market data is delayed by at least 15 minutes).

stmicroelectronics nv-ny shs (STM) Key Developments

STMicroelectronics In Talks To Sell Digital Product Division

STMicroelectronics NV (ENXTPA:STM) is reportedly in talks with potential buyer, Yazid Sabeq, to sell ST's digital products division, reports the French business magazine, Challenges.

STMicroelectronics and Autotalks to Release Second-Generation V2X Chipset

STMicroelectronics and Autotalks are preparing to release their second-generation V2X chipset and will begin design-ins with the vendors of Smart-Driving systems in 2016. V2X technology connects vehicles to other vehicles (V2V) and infrastructure (V2I) within wireless range for safety and mobility applications, such as sharing advanced warnings of unseen hazards or coordinating with traffic signals to minimize queuing. Using advanced cryptographic engines, the chipset introduces uncompromised verification capacity for 100% of all messages sent over the air, assuring the processing of all required safety messages, while minimizing security risks from unauthorized access. The ST/Autotalks solution is agile and upgradable to support even more complex security schemes as these emerge in the future. The new chipset achieves low power consumption, high temperature range, high integration and efficiency, and is designed to meet the rigorous requirements for safety-critical systems and autonomous vehicles.

STMicroelectronics Drives the Pace of Sat-Nav Progress with Enhanced Support for 3D Apps on TESEO Navigation Engines

STMicroelectronics is bringing next-generation satellite navigation to drivers with the launch of enhanced, always-available, always-accurate 3D positioning on its TESEO III automotive-navigation ICs. The new TESEO DRAW firmware for ST's multi-constellation positioning chips enables navigation devices to provide continuous, accurate location and turn-by-turn instructions even when satellite signals are poor or unavailable, such as in tunnels, covered car parks, or multi-level highways. TESEO DRAW also enhances performance in built-up areas, such as in urban canyons, where conventional navigation systems can lose accuracy. TESEO DRAW merges the satellite information with data from vehicle sensors such as the gyroscope, accelerometer, and wheel-speed sensors, to calculate location accurately in three dimensions including elevation. If the satellite signal is poor, TESEO DRAW compensates for the loss of accuracy, and if the signal becomes unavailable, navigation continues uninterrupted based on calculated location (dead reckoning). Road tests carried out by ST in difficult under-cover and urban environments have demonstrated continuous tracking from entry to exit in complex multi-level car parks, and at street level between tall buildings, where conventional systems have been unable to track the vehicle. GNSS has revolutionized activities such as commercial logistics, asset management, and personal mobility. Over four billion GNSS devices are now in use worldwide. By enabling high-accuracy 3D dead reckoning, TESEO DRAW expands the opportunities for developers to commercialize new applications. TESEO DRAW firmware has multiple modes and is capable of referring to sensors on the vehicle's CAN bus or discrete sensors such as the odometer, reverse sensor, MEMS accelerometer and gyroscope, or MEMS inertial module connected to the TESEO III IC.

STMicroelectronics Introduces New Microcontroller Development Ecosystem

STMicroelectronics has introduced a new microcontroller development ecosystem comprising prototype boards for all budgets and STM32Cube software support for the STM32L4 series now entering full production. The STM32L4 prototype boards include the fully featured Evaluation Board (STM32L476G-EVAL) priced at $289 and the $19.90 Discovery Kit (STM32L476G-DISCO) with features including a MEMS microphone and motion sensors, Digital-to-Analog Converter, 96-segment LCD, and 16Mbyte QSPI Flash memory. Users are free to fine-tune hardware and software on-the-fly throughout development, which helps reduce design risk. The STM32L4 MCU devices feature the 80MHz ARM® Cortex®-M4 core with DSP extensions and floating-point unit, and achieve aggressive power savings through features such as smart architecture with FlexPowerControl, dynamic voltage scaling, and seven power-management modes with sub-mode options. Among these, Batch Acquisition Mode (BAM) allows capturing data from peripherals even while the core is powered down. STM32L4 microcontrollers are available immediately, priced from $3.40 in the LQFP64 package for orders of 10,000 pieces.

STMicroelectronics Introduces the World's Most Advanced Six-Axis Motion-Sensing Device Fully Supporting Image Stabilization in Smartphones, Tablets, and Digital Still Cameras

STMicroelectronics has introduced the world's most advanced six-axis motion-sensing device fully supporting image stabilization in Smartphones, Tablets, and Digital Still Cameras. The latest addition to ST's iNEMO range of inertial motion sensors, the LSM6DS3H combines a 3-axis gyroscope, a 3-axis accelerometer, and an ultra-low-power processing circuit in a System-in-Package solution that offers the industry's lowest power consumption and smallest package size. Electronic Image Stabilization (EIS) and Optical Image Stabilization (OIS) techniques help minimize image blurring caused by camera motion while the snapshot is being captured. Initially developed for professional cameras, these techniques are being increasingly deployed in smartphones and tablets, where blurring is most likely to occur when the user takes a photograph with an outstretched arm. The LSM6DS3H builds on ST's expertise in designing high-end gyroscopes for OIS and the Company's pioneering role in providing dual-core gyroscopes capable of simultaneously handling both user motion and gesture recognition and camera image stabilization. The tiny, ultra-low-power MEMS module allows equipment manufacturers to minimize size, system complexity, and cost, while extending battery life in mobile imaging applications, due to a power consumption of less than 1mA, compared to the 5mA required by systems that employ two single-function gyroscopes. Key technical features of the LSM6DS3H include: Ultra-low power consumption of the motion sensors (0.85mA in normal mode, 0.4mA in low power mode), allowing the gyroscope to be "always on"; Accelerometer power consumption in low-power mode down to 10 uA, 60% less compared with the previous-generation 6-axis module (LSM6DS3); Supports both EIS and OIS applications with a choice of I2C or SPI for the primary interface and a dedicated auxiliary SPI interface to the camera module; Compact package measuring 2.5mm X 3mm X 0.83mm; Accelerometer ODR (Output Data Rate) up to 6.66 kHz, Gyroscope ODR up to 3.33kHz; Smart FIFO for dynamic data batching and smarter power management: 4kbyte FIFO + 4kbyte flexible (FIFO or programmable); Full-scale acceleration range +/- 2 /+/- 4 /+/- 8 /+/- 16g; Full-scale angular rate range +/- 125 /+/- 245 /+/- 500 /+/- 1,000 /+/- 2,000 dps; Supply voltage from 1.71 to 3.6V, independent IOs supply down to 1.62V; SPI/I2C serial interface data synchronization feature; and Embedded temperature sensor. The LSM6DS3H is available now in volume production at a price of $1.61 in quantities of 1ku.


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