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Last $9.43 USD
Change Today +0.09 / 0.96%
Volume 1.2M
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stmicroelectronics nv-ny shs (STM) Key Developments

STMicroelectronics and iPanel Cooperate on Solutions for Digital Migration in China

STMicroelectronics NV announced that its Palma (STiH273) HD cable chipsets and its Cannes/Monaco family of UltraHD Devices (STiH314/318 and STiH414/418) have been integrated and optimized with iPanel's complete set of middleware solutions. The solutions, which will be shown during CCBN, will allow Chinese cable operators to broadcast the best-in-class high-quality HD and UltraHD content and deliver a wide range of innovative value-added services, including interactive TV shopping, education services, and banner advertisements.

STMicroelectronics NV Reports Cash Dividend of 2015

STMicroelectronics announced that its Supervisory Board has approved the Managing Board proposal to the 2015 Annual General Meeting (AGM) of Shareholders to declare this year a cash dividend of $0.40 per outstanding share of the company's common stock to be distributed in quarterly installments of $0.10 in each of the second, third and fourth quarters of 2015 and first quarter of 2016 to shareholders of record at each respective date.

STMicroelectronics Announces and Demonstrates its Ultra-HDp60 STB Chips for the Chinese Market

STMicroelectronics is addressing the Chinese Ultra HDp60 market with its newly revealed quad-core system-on-chip ICs (STiH314/318 and STiH414/418), part of its well-established and accepted Cannes/Monaco family. Several major equipment OEMs have already selected these SoCs for next-generation Ultra-HD products. This new family benefits from the support of a rich 3rd-party ecosystem, and consequently gives ST customers the edge for designing compelling solutions. Key performance capabilities of these chipsets enable: decoding up to Ultra HD HEVC at 60 frames/sec with 10-bit color-depth streams coming from all main video-encoder providers; also decoding AVS+ and VP9 at 60 frames/sec. All these video streams are displayed using the latest-generation HDMi2.0 at 6Gbps; distribution of Ultra HD video throughout the home via pre-integration of up to 4x4 802.11ac Wi-Fi and MoCA 2.0; delivering the latest Android L version, optimized with ST's ARM-based CPU/GPUs, that supports all the features provided by Android TV; providing all the necessary components to support China-driven TVOS; supporting live feeds alongside user-friendly features, including fast channel change (FCC) & transcoding, via numerous third-party middlewares; integrating the latest security IP for advanced Conditional Access (CA) with extended support for China; downloadable CAS (DCAS) and Digital Rights Management (DRM), while also supporting the multi-TEE4 implementation; forensic watermarking that complies with MovieLabs' latest requirements and raises the bar in high-value Ultra-HD content protection; and high Dynamic Range (HDR) that delivers darker darks and brighter whites with smooth transitions from highlights to shadows, which contributes to the stunning impact of 4K content. These quad-core SoCs are software compatible and pin coherent with the other members of the Cannes (STiH3) and Monaco (STiH4) families to allow customers to reuse their development efforts across the entire family and manage a smooth transition between Full HD and Ultra HD installations while leveraging a large ecosystem of middleware and 3rd-party applications.

STMicroelectronics Unveils New Automotive Serial EEPROM's Offering

STMicroelectronics unveiled new automotive Serial EEPROMs offering industry’s best choice of densities in tiny 2x3mm outline. Automotive-qualified serial EEPROMs from STMicroelectronics provide the industry’s largest selection of densities in the tiny 2mm x 3mm WFDFPN8 package, giving engineers maximum flexibility when designing highly integrated body controllers and gateways, as well as radar and camera modules for Advanced Driver Assistance Systems (ADAS). Using a discrete serial EEPROM for data and parameter storage can help simplify design while offering maximum upgrade flexibility. Limited memory package and density options have prevented taking full advantage of this approach in the most space-constrained applications, but ST is now offering its new automotive-qualified WFDFPN8 package at all densities from 2KB to 512KB. In addition, both I2C and SPI serial interfaces are supported. The WFDFPN8 outline has already proved popular in consumer-electronics applications, and ST has now created a rugged version capable of withstanding automotive environments. The devices have passed AEC-Q100 grade 0 reliability criteria tests and operate up to 125°C. Further advantages include 4ms write time allowing fast parameter storage; clock frequency up to 20MHz allowing rapid data exchanges; and built-in traceability and security features. These include a dedicated page for software identification and a write-lockable page to keep sensitive data secure. ST’s newest Automotive EEPROM devices are available immediately to fulfill sample or production orders. Budgetary pricing is from $0.156 for the 2KB M24C02-DRMF3TG/K with I2C interface, in quantities of 5,000 units.

STMicroelectronics Introduces New DLPF-GP-01D3 Integrated Dual Differential Filter

STMicroelectronics’ new DLPF-GP-01D3 integrated dual differential filter can replace up to 16 discrete surface-mount components and save 35mm2 of pc-board area in ZigBee® RF4CE remotes and equipment such as set-top boxes, TVs, home gateways, alarms, and lighting. The extra space gives designers freedom to simplify board layout, reduce product size, or add new functions. The DLPF-GP-01D3 is an impedance-matched companion chip for the popular GreenPeak GP540 and GP561 RF4CE communication controllers. These controllers enable low-cost single-layer pc-board integration, supported by the DLPF-GP-01D3 pinning that allows short, straight tracks for signal, ground, and common connections between the two devices. The two integrated filter channels provide high attenuation outside the 2,400-2,500MHz frequency range and have low in-bandwidth insertion and return loss. ST has achieved this high performance, which helps designers meet the ZigBee RF4CE specifications, by leveraging its Integrated Passive Device (IPD) technology with non-conductive glass substrate for superior signal integrity. By enabling a single-chip solution, the DLPF-GP-01D3 also simplifies circuit design and saves Bill Of Materials (BOM) costs. The tiny 1.2mm x 3.4mm footprint, and height of less than 560µm after reflow, make this the smallest dual low-pass filter solution on the market, for the GreenPeak GP540 and GP561. The entire filter can now be built in less than 1/10th the pc-board space of a conventional discrete circuit. The DLPF-GP-01D3 is available immediately, in an 11-bump flip-chip package, priced from $0.23 for 5,000 units.


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