renesas electro-unspon adr (RNECY) Key Developments
Renesas Electronics Corporation Appoints Hideto Hidaka as Chief Technology Officer and Senior Vice President
Jul 1 15
Renesas Electronics Corporation announced the appointment, effective as of July 1, 2015, of Hideto Hidaka as the
newly-established Chief Technology Officer (CTO), reporting directly to Takao Endo, Representative Director,
Chairman & CEO. Hidaka will also serve concurrently as a Senior Vice President. In addition to carrying
through the ongoing structural reforms, Renesas has been implementing a variety of measures designed to achieve
future revenue growth. In order to establish a strong position in Renesas focus growth markets, it is essential
to bolster the core technologies that are crucial to market growth. Hidaka, who assumes the title of Senior Vice President and CTO, will lead the technology strategy and technology development work of the entire Renesas Group in his role as CTO. In addition, as Senior Vice President, he will work from the management side to strengthen technology at Renesas, enable efficient utilization of development resources, and facilitate concentration on and strengthening of core
Renesas Electronics Delivers Power Efficiency and Digital Filtering Capabilities for Industrial Sensor and Healthcare Design with RX231 Microcontrollers
Jun 30 15
Renesas Electronics Corporation announced the development of the RX231 Group of 32-bit microcontrollers (MCUs), which offers industrial and healthcare designers an optimal combination of high performance with digital signal processing (DSP) and floating point unit (FPU), and low power consumption. The RX231 Group is ideal for applications that require high processing performance in environments with low current supply capacity, such as industrial sensors, healthcare devices, and wearable devices, and building automation devices such as thermostats. The new RX231 Group provides an optimal combination of power-efficient MCU technology and the high-performance RXv2 CPU core with powerful DSP/FPU operation capabilities.
Renesas Electronics Corporation Launches R-IN32M4-CL2
Jun 25 15
Renesas Electronics Corporation announced the launch of the R-IN32M4-CL2 industrial Ethernet communication application specific standard product (ASSP) with integrated Gigabit PHY to support the increasing network and factory productivity needs of Industry 4.0. In the era of Industrial IoT (Internet of Things), the industry trend is toward increased connectivity, autonomous and interactive machines, and flexible manufacturing to improve operation and reduce costs. With Industry 4.0, the number of sensor nodes in the factory will increase exponentially, driving the need for more bandwidth in the network in order to move more data and improve analytics. Gigabit-level industrial networks will become the norm, as the current standard industrial network of 100 Mbps will be inadequate for next-generation networks, and transition to a 1 Gigabit standard is under consideration. The new R-IN32M4-CL2 extends the family of the industry-proven R-IN32M3 platform that incorporates hardware accelerators supporting real-time operating system (RTOS) performance as well as Ethernet packet handling and it improves network performance by up to five times faster than conventional implementations. The new R-IN32M4-CL2 is enhanced with a new ARM Cortex-M4 processor with FPU core running at 100 MHz (megahertz), and a single precision Floating Point Unit (FPU) ideal for computationally demanding and complex requirements to support process controllers, gateways, and IO controllers. Dual channel Gigabit Ethernet with built-in PHY: The R-IN32M4-CL2 supports Gigabit Ethernet connectivity with built-in dual Gigabit Ethernet PHYs to reduce the complexity in designing the analog circuits typically required for gigabit communication. Simplifying the PHY peripheral high-frequency analog circuit design contributes to reduced development time, risk and lower overall BOM footprint and costs. Multi-protocol support including CC-Link IE Field: CC-Link IE is a industrial Ethernet protocol for high-speed/high-capacity field network that supports Gigabit communication as well as mixed transmission of both equipment control data and management data. This technology will be able to provide the performance required to support the large numbers of sensors and actuators expected with the Industry 4.0 network. The R-IN32M4-CL2 includes the CCLink IE Field slave controller in hardware. Wide range of peripherals including analog: The explosion of sensor nodes will be expected to read many different types of signals from process data such as temperature, pressure, and flow, to digital signals from many IO points. To respond to these needs, the R-IN32M4-CL2 includes an FPU in the CPU core, an 8-channel 10-bit A/D converter, a 16-channel 16-bit timer and other functions.
Renesas Electronics Corporation Announces Executive Changes
Jun 24 15
Renesas Electronics Corporation announced at its General Shareholders Meeting held on June 24, 2015, approved the appointment of Nobuyuki Nakano as Managing Director, Post Investment Group Innovation Network Corporation of Japan. Also approved the retirement of Haruyasu Asakura as outside director and Toshihide Suzuki as Executive Vice President of the company.
Renesas Electronics Appoints Takao Endo as Representative Director, Chairman and CEO
Jun 24 15
Renesas Electronics Corporation announced that following the approval at the meeting of Board of Directors held on June 24, 2015, Takao Endo has officially assumed his role as Representative Director, Chairman and CEO.