nxp semiconductors nv (NXPI) Key Developments
NXP Semiconductors N.V. Introduces PN7120 for Linux and Android Developers
Jun 23 15
NXP Semiconductors N.V. introduced the PN7120 to accelerate NFC adoption in the Internet-of-Things. The highly integrated PN7120 helps create innovative NFC solutions and enables fast exploration of new applications and use cases for IoT and the Smart Home including a variety of appliances and consumer electronics such as home network gateways and routers, Set-Top-Boxes (STBs), audio devices, printers, gaming consoles and more. The integrated solution includes all RF communication protocols for NFC, NFC controller interface (NCI) and Linux and Android drivers to ease development. The PN7120 features an NFC contactless reader IC and embedded firmware with integrated communication protocols relevant for NFC. Through its drivers and software, the solution is optimized for Linux and Android, and easy to integrate in any other embedded operating system (OS). It uses the standardized NFC controller interface (NCI) maintained by the NFC Forum, to speed integration with the system's main controller. The PN7120 comes with a Single Board Computer Demo Kit, including interface boards for the latest Raspberry Pi releases and for BeagleBone, which both belong to the standard equipment of developers.
NXP Semiconductors and Stora Enso Announces Joint Development of Intelligent Packaging Solutions
May 28 15
NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions. The development will focus on integrating RFID (Radio frequency identification) into packages for consumer engagement and supply chain purposes. The collaboration will also focus on brand protection and the development of tamper evidence applications. These solutions will benefit both consumers and brand owners. By using NXP RFID technology such as near field communication (NFC) and ultra-high frequency (UHF), Stora Enso smart packages can be easily tracked and traced through the entire supply chain providing full end-to-end transparency. The integrated technology is also able to detect if the smart package has been tampered with en route to the consumer and, once in the hands of the consumer, can provide additional information and interaction through (the tap of) an NFC-enabled smart phone. This visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold; the smart packaging can verify the authenticity of the product and also provide care, usage and other important information via the NFC-enabled tag.
NXP Semiconductors NV, Annual General Meeting, Jun 02, 2015
May 21 15
NXP Semiconductors NV, Annual General Meeting, Jun 02, 2015., at 12:00 Central European Standard Time. Location: Conference Center of the Sheraton Amsterdam Airport Hotel.
NXP Semiconductors Introduces New Plug-and-Play Evaluation Tools to Accelerate Applications in RF Energy
May 18 15
NXP Semiconductors N.V. unveiled new plug-and play evaluation tools designed to enable fast and easy testing of new RF energy applications. Applications range from solid-state cooking, RF sparkplugs, RF plasma lighting to RF heating/drying, medical therapy and more. The evaluation tools will be demonstrated alongside NXP's new RF energy power amplifier in copper flange package (air cavity plastic third generation, ACP-3) with breakthrough thermal performance and NXP's ninth generation of LDMOS (laterally diffused metal oxide semiconductor) which can be suited for S-band radar applications at the IEEE MTT International Microwave Symposium (IMS) 2015, booth #1141, at the Phoenix Convention Center. Designed from the ground up to enable engineers with simple plug-and-play testing for RF energy applications, the NXP evaluation tools feature control and measurement functions efficiently viewable from one screen. It also saves development time by eliminating the need for low-level programming and enabling all possible algorithms be set and tested at once. To further shorten time to market, the evaluation kit allows developers to use LabVIEW codes as example codes for final programming. This added functionality allows design teams to test without interrupting lab design workflows. Power Amplifier in ACP-3 package, BLC2425M9XS250: Delivering breakthrough thermal performance management with 30% improvement compared to existing products, NXP's new amplifier enables product designers to improve, simplify and reduce cost for RF designs by saving board space. S-Band Radar Applications - Gen9 LDMOS RF power transistors, BLS9G2934LS400: NXP announced that its ninth generation (Gen9) LDMOS RF power transistors can achieve required power and efficiency levels in S-band radar applications. S-band radar applications is a fast growing sub-segment in RF power applications. S-band radar applications include weather radar, surface ship radar and some communications satellites.
NXP Semiconductors NV Presents at Bank of America Merrill Lynch 2015 Global Technology Conference, Jun-02-2015 03:35 PM
May 14 15
NXP Semiconductors NV Presents at Bank of America Merrill Lynch 2015 Global Technology Conference, Jun-02-2015 03:35 PM. Venue: The Ritz Carlton, 600 Stockton Street, San Francisco, California, United States. Speakers: Jeff Palmer, Vice President of Investor Relations, Peter Kelly, Chief Financial Officer, Principal Accounting Officer and Executive Vice President.