nxp semiconductors nv (NXPI) Key Developments
NXP Semiconductors, B.M. Holding Group and Digital China Holdings Ltd. Sign Strategic Cooperation Agreement for Shanghai Smart City Project
Mar 27 15
NXP Semiconductors announced the signing of a Memorandum of Understanding with B.M. Holding Group and Digital China Holdings Ltd. The Memorandum officially establishes the parties as strategic partners in the construction of a large-scale 'smart' business district in the center of Shanghai, incorporating innovative wireless networking technology. The long-term, comprehensive agreement will see NXP supply B.M. Holding with the latest in secure Internet of Things (IoT) technology. When construction completes on the new business district in 2017, it will represent a landmark complex that will help drive local economic development. The project will consist of a 1km² smart commercial complex constructed in Shanghai's Zhabei District, on the north bank of the Suzhou Creek. The development will use Near Field Communication (NFC), smart furniture, community illumination, resource control, safety monitoring, and numerous other cutting edge technologies. These technologies will be used in every office, hotel, apartment block, shopping mall, and residential property within the area, creating a new, secure IoT experience and 'Smarter World' for its residents.
Huawei and NXP Semiconductors to Jointly Explore the Chinese and Global Industry 4.0 Market
Mar 19 15
Huawei Technologies Co., Ltd. and NXP Semiconductors N.V. decided to jointly explore the Chinese and global Industry 4.0 market at the Industry 4.0 Roundtable held at Hanover CeBIT 2015 (Hanover Consumer Electronics, Information and Communication Expo). Through technical cooperation and joint innovation, the two companies will create an open, robust and secure Industry 4.0 Information and Communication Technology platform. Huawei and NXP have entered a strategic partnership to further expand their business in the Chinese and global Industry 4.0 market. Huawei offers a wide range of ICT products and solutions in the Industry 4.0 field. For industrial IoT connectivity, Huawei applies LTE-M technology and the industrial Ethernet gateway to deliver the core value of Industry 4.0, which includes IoT connections, security, and device management and operations. Huawei provides customers with key applications such as automated production, energy utilization optimization, parts management, real-time fault diagnosis, and on-demand production. Huawei and NXP will collaborate in the following areas: physical layer, network layer, and cyber security. The partnership will fully integrate Huawei's ICT infrastructure and connectivity solutions and NXP's secure connectivity solutions for Industry 4.0. Collaboration will focus on Industry 4.0 applications, such as factory automation, logistics 4.0, wireless secure connections, and sensor networks. The two companies will develop a global leading Industry 4.0 networking solution that creates sustainable value for customers in Greater China region and potentially across the globe.
NXP Launches JN5169 Wireless Microcontroller and Accompanying Smart Home and Smart Lighting Solutions
Mar 18 15
NXP Semiconductors announced the launch of its new best-in-class, low power and long range JN5169 wireless microcontroller and accompanying smart home and smart lighting solutions, featuring certified ZigBee LightLink, Home Automation, GreenPower software stacks and, the first in the market, a NFC-commissioning option that allows users to connect systems intuitively with just one tap. An on-chip +10dBm power amplifier within JN5169 doubles the connectivity range of NXP's existing smart home products. The solution features the ability to connect with 250 nodes allowing for it to be deployed in a wide range of uses in homes and industrial environments. ZigBee 3.0 and Thread ready, JN5169 also features a new toolchain for software development allows up to 15% code size reductions and features extensive debugging capabilities. Intuitive one-touch commissioning using NFC connectivity ensures that the devices can be easily yet securely paired without sending network details 'over-the-air', thus strongly reducing the threat of hacking. To support JN5169, NXP is launching three new design references for white, tunable white and RGB(W) color lamps, which reduce the total build cost of smart lighting solutions up to 25%. With 512kB embedded flash memory, there is enough memory available on the product to enable Over-The-Air software upgrades, meaning that expensive external flash memory is no longer required, leading to additional cost savings. The lamp reference designs are complemented by wireless switches, remotes, wall panels, sensors, smart plugs and gateways as well as control by cloud services from NXP and its eco-system partners. Other key features of JN5169 include: 14mA receive current allowing to reduce the standby power of bulbs down to an ultralow 100mW - Only 20mA transmit current at +10dBm which is at least 40% lower than other products in the market thus maximizing battery life of wireless nodes - The use of low cost 85°C crystals for smart bulbs instead of more expensive 125°C specified crystals enabled by innovative circuit and software techniques.
NXP Presents Ultra Low Component Count, 5 volt Qi Low Power Wireless Charging Transmitter Reference Design
Mar 16 15
NXP Semiconductors N.V. announced the availability of a new and highly optimized reference design for 5 volt low power Qi wireless charging transmitters, compliant with the Wireless Power Consortium (WPC) 1.1 Qi specification. The design is based on NXPs single-chip 5V wireless power transmitter IC, the NXQ1TXA5 that was launched in 2014. It is the latest addition to NXP's portfolio of GreenChip power solutions, known for their world class performance for power efficient applications. Building on NXP's success as the market leader in GreenChip power ICs, the NXQ1TXA5 reference design has an unrivalled standby power consumption of less than 10 mW. NXP recommends combining its NXQ1TXA5 ultra low standby power wireless power transmitter solution with another GreenChip device, its high efficiency TEA1720 SMPS IC with a standby power of less than 20mW. The NXQ1TXA5 device combines: NXPs patented high efficiency Class D amplifier technology for outstanding EMI performance. NXPs ultra low power CoolFluxTM DSP technology for superior communication with smartphones placed on the charger. Dedicated low power mixed signal circuitry to check for smartphone presence three times per second, enabling fast startup of charging, while keeping the standby power very low if there is no smartphone on the charger. Due to the low power consumption of the NXQ1TXA5 device itself, the reference design also has a high efficiency for low transmitted powers, making it suitable for applications ranging from smartphone charging to deliver 5W to the smartphone battery when used with a Qi compliant wireless charging receiver, to chargers for wearables that need less than 2W charging power. The NXQ1TXA5 reference design needs only 15 to 20 low cost passive components and uses a standard 2-layer PCB, with the components mounted on a single side. Depending on customer requirements, the complete application can be designed on a board space as small as 3x3 or 4x4 cm. The new NXQ1TXA5 wireless charging transmitter reference design will be available in second quarter of 2014.
NXP Semiconductors N.V. Announces New Resonant LLC Greenchip Platform with Low-Load Efficiency and Ease-of-Design
Mar 16 15
NXP Semiconductors N.V. announced its new GreenChip power solution, the TEA1916+TEA1995 platform – a easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs. The new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially at light loads of 10-30% -- easily meeting energy efficiency regulations including Energy Star v6, CoC tier 2, 80+ platinum and EuP Iot6. The TEA1916 additionally features low no-load power below 75mW, meeting and exceeding requirements of Energy STAR, DoE, CoC tier 2, etc. The LLC resonant topology also makes it easier to meet common mode noise requirements and 200% peak power requirements when compared to a flyback topology. Power supplies built on Resonant LLC topologies are often considered difficult to design and expensive. The TEA1916+TEA1995 Platform reverses this trend. Based on company's novel cycle-by-cycle architecture, the TEA1916+TEA1995 Platform provides an easy-to-design power supply that comes closer to flyback with all the added advantages of Resonant LLC. The energy transfer from primary side to the output is controlled every switching cycle, offering a linear relationship between the control parameter and the required output power. The new cycle-by-cycle.