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Last $99.73 USD
Change Today -1.90 / -1.87%
Volume 2.1M
As of 8:10 PM 04/17/15 All times are local (Market data is delayed by at least 15 minutes).

nxp semiconductors nv (NXPI) Key Developments

NXP Semiconductors N.V. Announces the Introduction of its Latest UCODE Product, UCODE DNA

NXP Semiconductors N.V. announced the introduction of its latest UCODE product, UCODE DNA, the first UHF (ultra-high frequency) RAIN RFID tag IC to combine long-range read performance with cryptographic authentication. With this new tag IC developers no longer have to choose between contactless performance and the need for security in their applications; UCODE DNA enables them to have access to both in a single RAIN RFID tag IC. The new tag IC is ideal for use in a wide variety of applications, such as electronic road tolling, electronic vehicle registration, license plate authentication, access control, asset tracking, brand protection, parking, and fast visitor processing and special service offering at large scale venues, sports stadiums or entertainment parks. Cryptographic authentication provides dynamic security with each transmission being different from the one before therefore minimizing the ability for data to be emulated. The new UCODE DNA provides ISO/IEC 29167-10 standardized cryptographic security using 128-bit key based on AES (advanced encryption standard) algorithms and is also designed in accordance with GS1 EPC Gen 2 V2 air interface standard, which supports cryptographic authentication in RFID systems operating in the UHF range (860 MHz to 960 MHz). UCODE DNA offers developers a service for Trust Provisioning, which generates and inserts the cryptographic keys into the UCODE DNA tag IC during the manufacturing process. This not only speeds up the time to deploy an RAIN RFID system but also enables developers with no prior experience with cryptography to get a head start on new applications. As well as offering RAIN RFID system developers unprecedented cryptographic protection UCODE DNA also provides a large user memory (up to 3Kbit) with BlockPermalock functionality, up to 448-bit EPC (electronic product code), and -19 dBm read sensitivity.

NXP Semiconductors N.V. Adds Mesh Capability in Bluetooth Smart Solution

NXP Semiconductors N.V. announced it added low power mesh compatibility into its Bluetooth® Smart portfolio. The new capabilities will enhance the company's Bluetooth offerings which are subset solutions from the company's low power connectivity standards relevant to the IoT, including NFC, ZigBee and Bluetooth Smart. With mesh capability in its Bluetooth Smart solutions, NXP offers developers and manufacturers multi-node communication when developing devices and appliances for the smart home which include lighting, sensors, thermostats or other home Bluetooth Smart devices. In contrast to flooding in mesh networks, a technique which can generate broadcast storms and increase energy consumption, the NXP low power solution fully synchronizes and routes protocols for efficient end-to-end connection between nodes. The NXP solution achieves order of magnitude improvement on energy efficiency for the whole network. The solution will also feature enhanced security and self-constructed networks with self-healing capability, and future proof layered-mesh architecture to support on top of standard Bluetooth Smart devices as well as over-the-air update capability for upgrading network after deployment. The company will showcase its new enhanced features with other Bluetooth demonstrations at Bluetooth World, booth #24, April 14-15 at the Santa Clara Convention Center in California.

NXP Semiconductors N.V. and Nanyang Technology University Launch Smart Mobility Test Bed to Accelerate the Introduction of Life-Saving Vehicle Communications

NXP Semiconductors N.V. announced it signed an agreement with Singapore’s Nanyang Technology University (NTU) to establish a living, real-world smart mobility test bed on the NTU campus. Supported by Singapore Economic Development Board, the joint initiative paves the way for Singapore’s Smart Mobility 2030 vision, making the city-state a global innovation hub for intelligent transport systems. It is also an important step to accelerate the introduction of life-saving vehicle communications globally. NXP joined forces with NTU students and professors to develop and test Smart Mobility solutions in high-pressure real-life scenarios with a focus on secure Vehicle-to-Everything (V2X) communications. V2X are intelligent systems integrated into vehicles, which are capable of wirelessly collecting and analyzing data from other vehicles and surrounding smart infrastructure over a distance of up to two kilometers. Secure V2X will be critical to enable widespread adoption of fully autonomous driving and to improve road safety and traffic flow by giving drivers advanced warning of upcoming hazards such as dangerous road conditions, unexpected traffic jams, approaching emergency vehicles or road works long before they enter their field of vision or become detectable by other Advanced Driver Assistance System (ADAS) sensors. According to a study conducted by the U.S. Department of Transportation, secure V2X safety functions can reduce multi-vehicle accident figures by more than 80%. V2X-capable vehicles will also be capable of receiving information from intelligent road signs and automatically recognizing the operating cycle of traffic lights.

NXP Semiconductors, B.M. Holding and Digital China Sign Strategic Cooperation Agreement for Shanghai Smart City Project

NXP Semiconductors announced the signing of a Memorandum of Understanding with B.M. Holding Group and Digital China Holdings Ltd. The Memorandum officially establishes the parties as strategic partners in the construction of a large-scale 'smart' business district in the center of Shanghai, incorporating innovative wireless networking technology. The long-term, comprehensive agreement will see NXP supply B.M. Holding with the latest in secure Internet of Things (IoT) technology. When construction completes on the new business district in 2017, it will represent a landmark complex that will help drive local economic development. The project will consist of a 1km-2 smart commercial complex constructed in Shanghai's Zhabei District, on the north bank of the Suzhou Creek. The development will use Near Field Communication (NFC), smart furniture, community illumination, resource control, safety monitoring, and numerous other cutting edge technologies. These technologies will be used in every office, hotel, apartment block, shopping mall, and residential property within the area, creating a new, secure IoT experience and 'Smarter World' for its residents.

NXP Semiconductors, B.M. Holding Group and Digital China Holdings Ltd. Sign Strategic Cooperation Agreement for Shanghai Smart City Project

NXP Semiconductors announced the signing of a Memorandum of Understanding with B.M. Holding Group and Digital China Holdings Ltd. The Memorandum officially establishes the parties as strategic partners in the construction of a large-scale 'smart' business district in the center of Shanghai, incorporating innovative wireless networking technology. The long-term, comprehensive agreement will see NXP supply B.M. Holding with the latest in secure Internet of Things (IoT) technology. When construction completes on the new business district in 2017, it will represent a landmark complex that will help drive local economic development. The project will consist of a 1km² smart commercial complex constructed in Shanghai's Zhabei District, on the north bank of the Suzhou Creek. The development will use Near Field Communication (NFC), smart furniture, community illumination, resource control, safety monitoring, and numerous other cutting edge technologies. These technologies will be used in every office, hotel, apartment block, shopping mall, and residential property within the area, creating a new, secure IoT experience and 'Smarter World' for its residents.

 

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