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Last $20.31 USD
Change Today +0.355 / 1.78%
Volume 67.8K
INFN On Other Exchanges
Symbol
Exchange
Berlin
NASDAQ GS
As of 9:33 AM 04/21/15 All times are local (Market data is delayed by at least 15 minutes).

infinera corp (INFN) Key Developments

Infinera Corporation, Transmode AB (publ) - M&A Call

To discuss acquisition agreement between Infinera Corporation and Transmode AB (publ)

Infinera Corporation to Report Q1, 2015 Results on Apr 21, 2015

Infinera Corporation announced that they will report Q1, 2015 results at 5:00 PM, US Eastern Standard Time on Apr 21, 2015

Infinera Corporation, Q1 2015 Earnings Call, Apr 21, 2015

Infinera Corporation, Q1 2015 Earnings Call, Apr 21, 2015

Infinera Corporation Unveils Two new PICs for optical transport applications

Infinera Corporation has unveiled ePIC-500 and oPIC-100, two photonic integrated circuits, or PICs, for new optical transport applications as scale and virtualization drive change in network architectures. Network Function Virtualization (NFV) provides a means to address these needs for the upper layers of the network through the migration of network functions from dedicated appliances to software services on x86 hardware within Cloud data centers. This Cloud services layer supports NFV plus other Cloud delivered services (Layer C). In order to support Layer C, Cloud data centers and end users need to be interconnected by a highly scalable and flexible transport network (Layer T). PICs are integral to the evolution of the transport network providing significant benefits when integrated into a packet-optical DWDM transport system for an efficient Layer T, ultimately allowing Layer C to thrive. The new Infinera sliceable photonics technology provides a large pool of capacity in a PIC that can be divided at a granular optical level with each slice capable of being routed in a different direction as it exits the line card or the system housing it, usually at the hub. The recipient of the individual slice is a line card or system that matches the capacity, usually at the spoke. The new ePIC-500 provides sliceable 500G capacity at the hub location, while the new oPIC-100 provides 100G capacity at the spoke location. While these two new PICs are applicable across all network locations they were developed specifically to support Layer T in the metro.

Infinera Introduces Two New Photonic Integrated Circuits to Support New Layer C and Layer T Network Model

Infinera introduced two photonic integrated circuits (PICs) for new optical transport applications as scale and virtualization drive change in network architectures. The new PICs being introduced include the sliceable enhanced PIC, ePIC-500, and the application-optimized PIC, oPIC-100. Network Function Virtualization (NFV) provides a means to address these needs for the upper layers of the network through the migration of network functions from dedicated appliances to software services on x86 hardware within Cloud data centers. The new ePIC-500 provides sliceable 500G capacity at the hub location, while the new oPIC-100 provides 100G capacity at the spoke location. While these two new PICs are applicable across all network locations they were developed specifically to support Layer T in the metro. Infinera modeled a wide range of applications from metro aggregation to regional long-haul where hub-and-spoke, mesh or ring topologies are common. When using the new PICs, these models showed an estimated average reduction of 28% in modules, 31% in power and 45% in bandwidth inefficiencies as compared to conventional, commercial off the shelf technologies that deliver single-wavelength or super-channel solutions for 100G, 200G or 400G. The new Infinera PICs are being developed for line cards and systems which are scheduled for delivery later 2015.

 

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INFN

Industry Average

Valuation INFN Industry Range
Price/Earnings 100.0x
Price/Sales 3.7x
Price/Book 5.1x
Price/Cash Flow 184.2x
TEV/Sales 3.1x
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