- Exchange: GreTai Sec M
- Sector: Technology
- Industry: Semiconductors
- Sub-Industry: Semicon Compo-Intg Circu
Chipbond Technology Corp
+ Add to Watchlist6147:TT
79.00 TWD 0.20 0.25%As of 02:32:52 ET on 05/24/2013.
Snapshot for Chipbond Technology Corp (6147)
| Open: | 79.20 | Day's Range: | 78.50 - 79.80 | Volume: | 2,898,712 |
|---|---|---|---|---|---|
| Previous Close: | 79.20 | 52wk Range: | 34.50 - 83.30 | 1-Yr Rtn: | +115.24% |
Key Statistics for 6147
| Current P/E Ratio (ttm) | 18.2638 |
|---|---|
| Estimated P/E(12/2013) | 14.0795 |
| Relative P/E vs. TWOTCI | 0.5565 |
| Earnings Per Share (TWD) (ttm) | 4.3255 |
| Est. EPS (TWD) (12/2013) | 5.6110 |
| Est. PEG Ratio | - |
| Market Cap (M TWD) | 47,034.67 |
| Shares Outstanding (M) | 595.38 |
| 30 Day Average Volume | 4,941,787 |
| Price/Book (mrq) | 2.5589 |
| Price/Sale (ttm) | 3.0009 |
| Dividend Indicated Gross Yield | 2.03% |
| Cash Dividend (TWD) | 1.0000 |
| Last Dividend | |
| 5 Year Dividend Growth | 15.94% |
| Next Earnings Announcement | - |
mrq = Most Recent Quarter; ttm = Trailing Twelve Months
Income Statement for 6147
Company Profile & Key Executives for 6147
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
| Wu Fei-ChienChairman/CEO | Kao Huo-WenPresident |
| Lo Shih-WeiChief Financial Officer | Hsu Chih-ChengVP:Sale & Planning |
Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.
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