• Exchange: GreTai Sec M
  • Sector: Technology
  • Industry: Semiconductors
  • Sub-Industry: Semiconductor Mfg

Chipbond Technology Corp

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6147:TT

57.30 TWD 0.70 1.21%

As of 23:09:35 ET on 12/25/2014.

Snapshot for Chipbond Technology Corp (6147)

Open: 58.20 Day's Range: 56.30 - 58.70 Volume: 2,359,000
Previous Close: 58.00 52wk Range: 41.99 - 61.70 1-Yr Rtn: +29.79%

Stock Chart for 6147

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  • 6147:TT 57.30
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58.00
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Key Statistics for 6147

Current P/E Ratio (ttm) 17.3057
Estimated P/E(12/2014) 15.5288
Relative P/E vs. TWOTCI 0.6416
Earnings Per Share (TWD) (ttm) 3.3515
Est. EPS (TWD) (12/2014) 3.7350
Est. PEG Ratio 0.7764
Market Cap (M TWD) 37,650.40
Shares Outstanding (M) 649.14
30 Day Average Volume 5,121,810
Price/Book (mrq) 1.6774
Price/Sale (ttm) 2.1666
Dividend Indicated Gross Yield 4.48%
Cash Dividend (TWD) 1.6000
Dividend Ex-Date 07/24/2014
5 Year Dividend Growth -
Next Earnings Announcement 03/20/2015
mrq = Most Recent Quarter; ttm = Trailing Twelve Months

Income Statement for 6147

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  • Net Income (M/TWD)
  • Profit Margin (%)

Company Profile & Key Executives for 6147

CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.

Wu Fei-ChienChairman/CEOKao Huo-WenPresident
Hsu Chih-ChengVP:Sales & Corporate Planning CenterYeh Tsung-ChiVP:Kaohsiung Operations Center
More Company Profile & Key Executives for 6147

Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.

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