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Chipbond Technology Corp

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6147:TT
Taipei
46.80
TWD
2.70
6.12%
As of 02:32:37 ET on 08/28/2015.
Open
45.15
Day Range
44.60 - 46.90
Volume
9,689,802
Previous Close
44.10
52Wk Range
39.40 - 74.82
1 Yr Return
-5.46%
Open
45.15
Day Range
44.60 - 46.90
Volume
9,689,802
Previous Close
44.10
52Wk Range
39.40 - 74.82
1 Yr Return
-5.46%
YTD Return
-14.75%
Current P/E Ratio (TTM)
11.88
Earnings per Share (TWD) (TTM)
3.94
Market Cap (b TWD)
30.382
Shares Outstanding (m)
649.187
Price/Sales (TTM)
1.71
Dividend Indicated Gross Yield
5.56%
Sector
Technology
Industry
Semiconductors
Sub-Industry
Semiconductor Mfg

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Profile
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
ADDRESS
3 Li-Hsing 5th Road
Science-Based Industrial Park
Hsin-Chu
Taiwan
PHONE
886-3-567-8788
  • Fei-Chien Wu
    Chairman/CEO
  • Huo-Wen Kao
    President
  • Chih-Cheng Hsu
    VP:Sales & Corporate Planning Center
  • Tsung-Chi Yeh
    VP:Kaohsiung Operations Center
  • Sheng-Jen Wu
    VP:Manufacturing Center
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