Key Statistics for 6147
|Current P/E Ratio (ttm)
Relative P/E vs.
|Earnings Per Share (TWD) (ttm)
|Est. EPS (TWD) (12/2013)
|Est. PEG Ratio
|Market Cap (M TWD)
|Shares Outstanding (M)
|30 Day Average Volume
|Dividend Indicated Gross Yield
|Cash Dividend (TWD)
|5 Year Dividend Growth
|Next Earnings Announcement
mrq = Most Recent Quarter; ttm = Trailing Twelve Months
Income Statement for 6147
- Net Income (M/TWD)
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
More Company Profile & Key Executives for 6147
|Wu Fei-ChienChairman/CEO||Kao Huo-WenPresident|
|Hsu Chih-ChengVP:Sale & Planning||Yeh Tsung-ChiVP:Kaohsiung Operations Center|
Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.