• Exchange: Shenzhen
  • Sector: Technology
  • Industry: Hardware
  • Sub-Industry: Office Electronics

Shenzhen Danbond Technology Co Ltd

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002618:CH

38.080 CNY 1.130 3.06%

As of 03:00:26 ET on 09/23/2014.

Snapshot for Shenzhen Danbond Technology Co Ltd (002618)

Open: 36.820 Day's Range: 36.750 - 38.660 Volume: 2,004,731
Previous Close: 36.950 52wk Range: 26.660 - 42.200 1-Yr Rtn: +2.93%

Stock Chart for 002618

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  • 002618:CH 38.080
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36.950
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Key Statistics for 002618

Current P/E Ratio (ttm) 119.0000
Estimated P/E(12/2014) -
Relative P/E vs. SZASHR 3.5101
Earnings Per Share (CNY) (ttm) 0.3200
Est. EPS (CNY) (12/2014) -
Est. PEG Ratio -
Market Cap (M CNY) 6,954.93
Shares Outstanding (M) 182.64
30 Day Average Volume 1,337,399
Price/Book (mrq) 4.6075
Price/Sale (ttm) 22.0022
Dividend Indicated Gross Yield 0.08%
Cash Dividend (CNY) 0.0290
Dividend Ex-Date 06/26/2014
5 Year Dividend Growth -
Next Earnings Announcement 10/27/2014
mrq = Most Recent Quarter; ttm = Trailing Twelve Months

Income Statement for 002618

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  • Net Income (M/CNY)
  • Profit Margin (%)

Company Profile & Key Executives for 002618

Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.

Liu PingChairman/President/Director:Research&DevWang LiyiVice President
Mo ShanjieSecretaryGuo XinmeiPrincipal:Financial
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Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.

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