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  • Exchange: Shenzhen
  • Sector: Technology
  • Industry: Hardware
  • Sub-Industry: Office Electronics

Shenzhen Danbond Technology Co Ltd

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002618:CH

38.500 CNY 0.510 1.34%

As of 03:00:23 ET on 03/27/2015.

Snapshot for Shenzhen Danbond Technology Co Ltd (002618)

Open: 38.480 Day's Range: 37.530 - 38.750 Volume: 3,584,940
Previous Close: 37.990 52wk Range: 24.450 - 39.600 1-Yr Rtn: +25.27%

Stock Chart for 002618

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  • 002618:CH 38.500
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37.990
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Key Statistics for 002618

Current P/E Ratio (ttm) 120.3125
Estimated P/E(12/2014) 79.3814
Relative P/E vs. SZASHR 2.4718
Earnings Per Share (CNY) (ttm) 0.3200
Est. EPS (CNY) (12/2014) 0.4850
Est. PEG Ratio -
Market Cap (M CNY) 7,031.64
Shares Outstanding (M) 182.64
30 Day Average Volume 4,427,478
Price/Book (mrq) 4.6583
Price/Sale (ttm) 22.2449
Dividend Indicated Gross Yield 0.08%
Cash Dividend (CNY) 0.0290
Dividend Ex-Date 06/26/2014
5 Year Dividend Growth -
Next Earnings Announcement 04/22/2015
mrq = Most Recent Quarter; ttm = Trailing Twelve Months

Income Statement for 002618

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Company Profile & Key Executives for 002618

Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.

Liu PingChairman/President/Director:Research&DevWang LiyiVice President
Mo ShanjieSecretaryGuo XinmeiPrincipal:Financial
More Company Profile & Key Executives for 002618

Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.

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