- Exchange: Shenzhen
- Sector: Technology
- Industry: Hardware
- Sub-Industry: Printing & Imaging
Shenzhen Danbond Technology Co Ltd
+ Add to Watchlist002618:CH
25.000 CNY 1.000 3.85%As of 02:55:25 ET on 06/20/2013.
Snapshot for Shenzhen Danbond Technology Co Ltd (002618)
| Open: | 25.670 | Day's Range: | 24.580 - 26.000 | Volume: | 3,215,914 |
|---|---|---|---|---|---|
| Previous Close: | 26.000 | 52wk Range: | 9.380 - 27.310 | 1-Yr Rtn: | +90.40% |
Key Statistics for 002618
| Current P/E Ratio (ttm) | 72.5714 |
|---|---|
| Estimated P/E(12/2013) | 45.9313 |
| Relative P/E vs. SZASHR | 2.4467 |
| Earnings Per Share (CNY) (ttm) | 0.3500 |
| Est. EPS (CNY) (12/2013) | 0.5530 |
| Est. PEG Ratio | - |
| Market Cap (M CNY) | 4,064.00 |
| Shares Outstanding (M) | 160.00 |
| 30 Day Average Volume | 6,174,231 |
| Price/Book (mrq) | 4.5301 |
| Price/Sale (ttm) | 16.4187 |
| Dividend Indicated Gross Yield | 0.14% |
| Cash Dividend (CNY) | 0.0350 |
| Last Dividend | |
| 5 Year Dividend Growth | - |
| Next Earnings Announcement | 08/13/2013 |
mrq = Most Recent Quarter; ttm = Trailing Twelve Months
Income Statement for 002618
Company Profile & Key Executives for 002618
Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.
| Liu PingChairman/President/Director:Research&Dev | Wang LiyiVice President |
| Ling YoudiVP/Secretary |
Quotes delayed, except where indicated otherwise. All prices in local currency. Time is ET.
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