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Shenzhen Danbond Technology Co Ltd

002618:CH
Shenzhen
42.95
CNY
2.99
7.48%
As of 3:00 AM EDT 4/29/2016
Open
39.65
Day Range
39.45 - 43.88
Volume
4,057,331
Previous Close
39.96
52Wk Range
16.97 - 62.89
1 Yr Return
-1.87%
Open
39.65
Day Range
39.45 - 43.88
Volume
4,057,331
Previous Close
39.96
52Wk Range
16.97 - 62.89
1 Yr Return
-1.87%
YTD Return
-11.73%
Current P/E Ratio (TTM)
116.08
Earnings per Share (CNY) (TTM)
0.37
Market Cap (b CNY)
7.844
Shares Outstanding (m)
182.640
Price/Sales (TTM)
18.66
Dividend Indicated Gross Yield
0.09%
Sector
Technology
Industry
Hardware
Sub-Industry
Office Electronics

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Profile
Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.
Address
Danbond Tech Bldg,1st Langshan
High Tech Park,Nanshan Distric
Shenzhen
China
Phone
86-755-2651-1518
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