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Shenzhen Danbond Technology Co Ltd

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002618:CH
Shenzhen
30.70
CNY
0.85
2.85%
As of 22:25:27 ET on 07/29/2015.
Open
30.80
Day Range
30.22 - 31.68
Volume
1,709,131
Previous Close
29.85
52Wk Range
24.45 - 62.89
1 Yr Return
6.32%
Open
30.80
Day Range
30.22 - 31.68
Volume
1,709,131
Previous Close
29.85
52Wk Range
24.45 - 62.89
1 Yr Return
6.32%
YTD Return
17.76%
Current P/E Ratio (TTM)
61.26
Earnings per Share (CNY) (TTM)
0.50
Market Cap (b CNY)
5.594
Shares Outstanding (m)
182.640
Price/Sales (TTM)
11.17
Dividend Indicated Gross Yield
0.16%
Sector
Technology
Industry
Hardware
Sub-Industry
Office Electronics

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Profile
Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.
ADDRESS
Danbond Tech Bldg,1st Langshan
High Tech Park,Nanshan Distric
Shenzhen
China
PHONE
86-755-2651-1518
  • Ping Liu
    Chairman/President/Director:Research&Dev
  • Hu Ren
    Vice President
  • Xinmei Guo
    Principal:Financial
  • Shanjie Mo
    Secretary
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