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Shenzhen Danbond Technology Co Ltd

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002618:CH
Shenzhen
34.37
CNY
3.82
10.00%
As of 03:00:27 ET on 07/02/2015.
Open
38.00
Day Range
34.37 - 38.00
Volume
5,701,142
Previous Close
38.19
52Wk Range
24.45 - 62.89
1 Yr Return
7.67%
Current P/E Ratio (TTM)
68.74
Earnings per Share (CNY) (TTM)
0.50
Market Cap (b CNY)
6.277
Shares Outstanding (m)
182.640
Price/Sales (TTM)
12.50
Dividend Indicated Gross Yield
0.15%
Sector
Technology
Industry
Hardware
Sub-Industry
Office Electronics

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Profile
Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.
ADDRESS
Danbond Tech Bldg,1st Langshan
High Tech Park,Nanshan Distric
Shenzhen
China
PHONE
0755-26511518
  • Ping Liu
    Chairman/President/Director:Research&Dev
  • Liyi Wang
    Vice President
  • Shanjie Mo
    Secretary
  • Xinmei Guo
    Principal:Financial
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