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Kingboard Chemical Agrees to HK$4.8 Billion Loan Facility

April 3 (Bloomberg) -- Kingboard Chemical Holdings Ltd., a Hong Kong-based maker of laminates and industrial materials, agreed a HK$4.8 billion ($617 million) loan facility from banks.

The five-year syndicated loan was “fully underwritten” by three arrangers and bookrunners, including Citigroup Global Markets Asia Ltd., HSBC Holdings Plc and Standard Chartered Plc, Kingboard said in a faxed statement today.

The company will use the loan to refinance existing debt and finance “general corporate requirements”, it said.

To contact the reporter on this story: Wendy Leung in Hong Kong at wleung12@bloomberg.net

To contact the editor responsible for this story: Paul Tighe at ptighe@bloomberg.net

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