Tessera Technologies and Micron Technology Announce Execution of New Technology and Patent License Agreements

  Tessera Technologies and Micron Technology Announce Execution of New
  Technology and Patent License Agreements

Business Wire

SAN JOSE, Calif. & BOISE, Idaho -- July 30, 2014

Tessera Technologies, Inc. (NASDAQ: TSRA) ("Tessera" or the “Company") and
Micron Technology, Inc. (“Micron”) (NASDAQ: MU) announced today the execution
of new, multiyear technology and patent license agreements. In addition to the
new patent license agreement, Tessera’s wholly-owned subsidiary Invensas
Corporation will license its Multi-Die Face-Down (xFD^TM) semiconductor
packaging technology to Micron and cooperate with Micron on the manufacturing
of Micron products that incorporate xFD technology. As part of the agreements,
Tessera and Micron will also explore other possible joint development efforts.

Tessera’s Chief Executive Officer Tom Lacey praised the agreements. “We are
delighted to reach new long-term agreements with Micron that build on our
existing relationship. We are thrilled to be working closely with one of the
most successful and innovative semiconductor companies on the planet,” Lacey
said. “We have continued to develop innovative, next-generation technologies
that we seek to commercialize with world-class partners like Micron. We look
forward to working with Micron to commercialize high performance multi-chip
xFD DRAM and other products.”

“We are pleased to reach agreement with Tessera, including a patent license
and a technology agreement relating to Tessera’s xFD packaging technology,”
said Mark Durcan, Micron’s Chief Executive Officer. “We look forward to
discussing further joint development opportunities with Tessera.”

The specific terms and conditions of the agreements are confidential and have
not been disclosed by the companies.

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to
the safe harbor provisions of the Private Securities Litigation Reform Act of
1995. Forward-looking statements involve risks and uncertainties that could
cause actual results to differ significantly from those projected,
particularly with respect to the new technology and patent license agreements
with Micron, the xFD manufacturing cooperation with Micron, possible joint
development efforts with Micron, the commercialization of xFD products, and
the Company’s development of next-generation technologies. Material factors
that may cause results to differ from the statements made include the plans or
operations relating to the businesses of the Company; any need to spend more
cash and/or incur greater charges than anticipated in connection with the DOC
restructuring, workforce reduction, facility closures and related activities;
any need to undertake further restructuring activities; market or industry
conditions; changes in patent laws, regulation or enforcement, or other
factors that might affect the Company's ability to protect or realize the
value of its intellectual property; the expiration of license agreements and
the cessation of related royalty income; the failure, inability or refusal of
licensees to pay royalties; initiation, delays, setbacks or losses relating to
the Company's intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; fluctuations in operating results
due to the timing of new license agreements and royalties, or due to legal
costs; the risk of a decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the industry to use technologies
covered by the Company's patents; the expiration of the Company's patents; the
Company's ability to successfully complete and integrate acquisitions of
businesses; the risk of loss of, or decreases in production orders from,
customers of acquired businesses; financial and regulatory risks associated
with the international nature of the Company's businesses; failure of the
Company's products to achieve technological feasibility or profitability;
failure to successfully commercialize the Company's products; changes in
demand for the products of the Company's customers; limited opportunities to
license technologies due to high concentration in the markets for
semiconductors and related products and smartphone imaging; and the impact of
competing technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking statements, which
speak only as of the date of this release. The Company's filings with the
Securities and Exchange Commission, including its Annual Report on Form 10-K
for the year ended Dec. 31, 2013, and its Quarterly Report on Form 10-Q for
the quarter ended Mar. 31, 2014, include more information about factors that
could affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release. Although
this release may remain available on the Company's website or elsewhere, its
continued availability does not indicate that the Company is reaffirming or
confirming any of the information contained herein.

About Tessera Technologies, Inc.

Tessera Technologies, Inc. and its subsidiaries generate revenue from
licensing to manufacturers and other implementers that use the Company's
technology in areas such as mobile computing and communications, memory and
data storage, and 3-D Integrated Circuit technologies. For more information
call 1.408.321.6000 or visit www.tessera.com.

Tessera, the Tessera logo, FotoNation, the FotoNation logo and Invensas
Corporation are trademarks or registered trademarks of affiliated companies of
Tessera Technologies, Inc. in the United States and other countries. All other
company, brand and product names may be trademarks or registered trademarks of
their respective companies.

About Micron Technology, Inc.

Micron Technology, Inc., is a global leader in advanced semiconductor systems.
Micron's broad portfolio of high-performance memory technologies—including
DRAM, NAND and NOR Flash—is the basis for solid state drives, modules,
multichip packages and other system solutions. Backed by more than 35 years of
technology leadership, Micron's memory solutions enable the world's most
innovative computing, consumer, enterprise storage, networking, mobile,
embedded and automotive applications. Micron's common stock is traded on the
NASDAQ under the MU symbol. To learn more about Micron Technology, Inc. visit
www.micron.com.

TSRA-I

Contact:

Media Contacts
Tessera Technologies, Inc.
Robert Andersen, 408-321-6779
Executive Vice President and Chief Financial Officer
or
The Piacente Group | Investor Relations
Don Markley, 212-481-2050
Glenn Garmont, 212-481-2050
Investor Relations
tessera@tpg-ir.com
or
Micron Technology
Daniel Francisco, 208-368-5584
dfrancisco@micron.com
 
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