STMicroelectronics: STMicroelectronics Hails Success of Advanced Single-Chip
Integration in New Wireless Modules from SenseAnywhere
Tiny single-chip balun, together with ultra-efficient sensor and memory, helps
boost performance and shrink dimensions of new AiroSensor and AssetSensor
active-RFID modules from SenseAnywhere
Geneva, June 16, 2014 - STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, has
announced that SenseAnywhere, a leader in tags and modules for wireless
sensing and location, has qualified the world's first wireless devices
incorporating ST's new single-chip balun, which integrates essential circuitry
for radio systems in a footprint of only 2.1mm^2.
The SenseAnywhere AiroSensor and AssetSensor active-RFID modules combine
advanced RF transceiver technology with a low-power processor, low-voltage
EEPROM, and miniature temperature, humidity, and ultra-efficient motion
sensors to enhance performance and save cost in Internet of Things (IoT)
applications such as environmental monitoring, cold-chain compliance, theft
protection, and asset tracking.
"The cooperation with ST made it possible to realize significant improvements
in the output performance, sensitivity and impedance matching of our RF
modules and sensors, as well as minimizing unwanted harmonics," said Tom
Heijnen, Founder and Managing Director of SenseAnywhere. "At the same time, we
have seriously reduced overall application size as well as savings in
bill-of-materials costs and reduced assembly and test costs."
Inside the SenseAnywhere modules, ST's BAL-CC1101-01D3 balun balances the
connection between the radio and antenna, replacing discrete components that
would occupy up to 30mm^2 of pc-board space with a single 2.1mm^2 integrated
circuit. Moreover, single-chip integration enables closer impedance matching,
greater stability, and reduced device-to-device spread by minimizing
variations between circuit features on the same silicon substrate.
The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST,
which are matched to specific RF-transceiver chipsets. Optimized for
ultra-low-power applications in sub-GHz Industrial, Scientific and Medical
(ISM), and Short-Range Device (SRD) frequency bands, the ETSI^- and
FCC^-compliant BAL-CC1101-01D3 delivers advantages including an integrated
harmonic filter delivering improved harmonic attenuation, low insertion loss,
and operation up to 85°C, in addition to its tiny footprint.
"The advanced single-chip integration of our new balun family helps customers
overcome significant RF-system design challenges to deliver higher-performing
products while reducing cost and time to market," said Richard Renard, Senior
Product Marketing Engineer, STMicroelectronics. "SenseAnywhere's AiroSensor
and AssetSensor using the ST balun are genuinely advanced products that offer
unique benefits to integrators of sensing and location systems."
Beyond the new balun, ST contributed its compact, flexible, and lowest-power
LIS2DH accelerometer, and low-power EEPROMs to the SenseAnywhere IoT modules,
ensuring long-lasting and accurate performance.
The BAL-CC1101-01D3 is now available for production orders, in the 2.1mm^2
flip-chip package, priced from $0.26 for orders of 5000 pieces.
SenseAnywhere develops and markets wireless transceiver modules,
sensor-enabled active RFID tags, wireless sensors and data loggers that easily
connect to any application through the Internet.
The company's technology and devices enable customers to realize real-time
location systems using Active RFIDs, sensor-enabled active RFIDs and wireless
data loggers for amongst others motion, temperature and humidity.
Years of RF, analog and digital engineering has led to an ultra-low-power RF
transceiver platform that is extremely easy to use. The complete RF-protocol
handling and network management is integrated on the modules and AccessPoints.
No pairing or key management are required, and all network components are plug
and play. The ultra-low-power technology enables SenseAnywhere to create
active RFID devices, sensors and data loggers like the AssetSensor and the
AiroSensor that will operate autonomously in the field for 10 years.
With more than 15 years of experience in developing wirelessly networked
products and communication protocols for business to business customers,
SenseAnywhere's network technology has been proven in tens of thousands of
products, and will be at the heart of numerous innovative products and
equipment joining the Internet of Things.
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.
In 2013, the Company's net revenues were $8.08 billion. Further information on
ST can be found at www.st.com.
For Press Information Contact:
+31 165 560088
Director Technical Media Relations
+1 781 591 0354
 European Telecommunications Standards Institute
 The US Federal Communications Commission
ST SenseAnywhere PR_IMAGE
ST SenseAnywhere PR
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Source: STMicroelectronics via Globenewswire
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