FlipChip International and Fujikura Limited Participating in the Packaging and Assembly Considerations in Wearable Electronics

FlipChip International and Fujikura Limited Participating in the Packaging and
           Assembly Considerations in Wearable Electronics Workshop

PR Newswire

PHOENIX, June 9, 2014

PHOENIX, June 9, 2014 /PRNewswire/ --FlipChip International - (FCI), the
global technology leader in flip chip bumping and wafer level packaging,
announced that their CTO, Ted Tessier, will be presenting a collaborative
paper with Fujikura Limited entitled "Enabling Wearable Electronics:
Innovation Through Miniaturization" at the TechSearch International Packaging
and Assembly Considerations in Wearable Electronics Workshop to be held in
Austin, Texas on June 11^th and 12^th, 2014.

FlipChip International.

At the workshop, FCI and Fujikura will be presenting a unique perspective on
medical and consumer wearable electronics from the vantage points of both a
wafer level packaging solutions provider and a flex circuit manufacturing and
assembly technology provider. This forward looking process technology and
application vision is validated by more than 15 years of experience in
supporting a large number of portable computing and communication product
applications including smart phones and tablets. The successful development
relationship with Fujikura in the area of embedded active and passive
components in multilayer flexible circuit substrates and the miniaturized
System in Package (SiP) solutions that they enable called WABE^TM and
ChipsetT^TM will be highlighted. The integrated suite of SIP packaging
options enabled by Fujikura's global footprint of flex circuit manufacturing
and assembly factories and FCI's dramatically increased capabilities in high
volume IC Assembly and Test, following the acquisition of Millenium Microtech
Shanghai, positions both of our companies to continue to make major
technological strides in the wearable space. We are currently working
closely with a number of the world's leading OEM's, integrated circuit
foundries and fabless semiconductor companies on technical innovations that
will enable the next generation of ubiquitous electronic applications.

Ted Tessier, FlipChip's CTO said, "FCI is pleased to participate in this
workshop highlighting wearable electronics. FlipChip's technology leadership
in advanced wafer level packaging supports a number of new customer
developments in the emerging Wearable space. Fujikura has more than a decade
of experience in supporting the ultra-high volume interconnection requirements
and expectations of portable electronic product applications. This is a
powerful combination of core competencies that will be key to successes in
this growing market segment."

About FCI:
FlipChip International – (FCI) supplies turnkey semiconductor assembly and
test services to the consumer, automotive, aerospace and medical industries
through our leadership in high volume wafer level packaging and advanced
packaging technologies. FCI was an early developer of Wafer-Level Chip Scale
Packaging and remains the technology leader in this field with many patented
technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™
Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a
wide range of customers from each industry, frequently partnering with them to
engineer customized solutions. FCI has a global footprint, offering high
volume advanced packaging services from ISO/TS 16949-certified factories
located in Phoenix, AZ, Shanghai, China and at Nanium S.A. located in Porto,
Portugal.

For information contact:
Dawn Cuevas
FlipChip International
#602-431-6637
dawn.cuevas@flipchip.com
website: www.flipchip.com

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SOURCE FlipChip International

Website: http://www.flipchip.com
 
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