FlipChip International attending the MagnaChip Semiconductor Corporation Foundry Technology Symposium

   FlipChip International attending the MagnaChip Semiconductor Corporation
                         Foundry Technology Symposium

PR Newswire

PHOENIX, May 12, 2014

PHOENIX, May 12, 2014 /PRNewswire/ --FlipChip International - (FCI), the
global technology leader in Flip Chip bumping and Wafer Level Packaging
announced they will sponsor the MagnaChip Semiconductor Corporation's 4^th
Annual Foundry Technology Symposium in Hsinchu, Taiwan on Wednesday, May 21^st
and in Santa Clara California on Thursday, June 12^th.

FlipChip International.

At the symposium, FlipChip will provide information and support on a broad
range of advanced wafer level packaging technologies, highlighting world-class
service and reliability. FlipChip will also be promoting its increasing
capabilities in high volume IC Assembly and Test, following the acquisition of
Millennium Microtech Shanghai. FlipChip is a technology leader in Wafer Level
Packaging and provides global support through a worldwide sales and
manufacturing structure. FlipChip International will be located in the front
lobby to provide customer support and to promote quick turn engineering
projects, MPW wafers and collaborating with customers on their special
packaging needs. FlipChip works closely with all the world's leading
semiconductor foundries, including MagnaChip. MagnaChip's broad technology
capability and emphasis on specialty processes matches well with FlipChip's
advanced packaging solutions and high volume production facilities.

David Wilkie, FlipChip's CEO said, "FCI is very pleased to announce its
sponsorship of the MagnaChip Semiconductor Foundry Technology Symposium this
year. We are proud of our relationship with MagnaChip and our growth will
continue with them over the next few years. FlipChip has a long history of
providing advanced packaging technology solutions to many Magnachip
customers. Like FCI, MagnaChip is a world class manufacturing company
offering many high end and specialty process technologies to their customers."

About FCI:
FlipChip International – (FCI) supplies turnkey semiconductor assembly and
test services to the consumer, automotive, aerospace and medical industries
through our leadership in high volume manufacturing and advanced packaging
technology. FCI was an early developer of Wafer-Level Chip Scale Packaging and
remains the technology leader in this field with many patented technologies
spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die
Packaging, and FlipChip on Lead frame assembly. FCI supports a wide range of
customers from each industry, frequently partnering with them to engineer
customized solutions. FCI has a global footprint, offering high volume
advanced packaging services from ISO/TS 16949-certified factories located in
Phoenix, AZ, Shanghai, China and Porto, Portugal.

For information contact:
Dawn Cuevas
FlipChip International
website: www.flipchip.com

Logo - http://photos.prnewswire.com/prnh/20120306/LA64593LOGO-a

SOURCE FlipChip International

Website: http://www.flipchip.com
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