New TerraWave Wi-Fi Antennas From Ventev Significantly Minimize Interference
in High-Density Venues Like Stadiums, Convention Centers and Campus Lecture
HUNT VALLEY, Md. -- April 7, 2014
Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated
(NASDAQ: TESS), today announced three new antenna products to expand the
TerraWave portfolio of high-density solutions that address the challenges of
Wi-Fi deployments in large venues with many simultaneous users. The two
antennas and co-locating mount feature the latest technology to maximize user
capacity while minimizing interference.
As Wi-Fi-capable devices such as smartphones and tablets become more and more
prevalent in universities, convention centers, airports, manufacturing
facilities and other large venues, network owners must convert their
traditional, coverage-oriented Wi-Fi networks to high-density networks with
sufficient capacity to support numerous individual client devices. Ventev, an
engineering-driven manufacturer and leading provider of high-density Wi-Fi
products, delivers the solutions to help meet the challenge of providing fast
and reliable wireless access.
Challenge: Minimize RF Interference
Minimizing channel interference or “beam bounce” is a critical component of a
high-density network and, until now, a frustrating challenge for network
administrators trying to maximize capacity. To meet that need, two new
High-Density Antennas were developed based on customer feedback and Ventev’s
extensive Wi-Fi deployment experience.
4 dBi High-Density Patch Antenna – The lower gain of the TerraWave 4 dBi
Antenna limits RF interference making it an ideal solution for facilities with
lower ceilings and multi-levels like classrooms and lecture halls, where
floor-to-floor interference exists and signal bounce must be minimized.
6 dBi High-Density Patch Antenna with Narrower Beamwidth – With narrow
beamwidths of 55 degrees at 2.4 GHz and 35 degrees at 5 GHz, the new 6dBi
antenna complements the portfolio of 6dBi TerraWave antennas. Boasting the
latest advanced technology in high-density antennas, it reduces the number of
users per access point (AP), increasing capacity and improving the individual
Wi-Fi user experience.
Challenge: Simplify Installation of the Access Point and the High-Density
Antenna in Challenging Environments
Co-locating Mount – This new, easy-to-install mount allows both the
high-density antenna and the AP to be co-located in one décor-friendly unit.
The aesthetically pleasing unit conceals equipment and wires but is rugged
enough to be used in tough environments like warehouses and manufacturing
plants, or other high-ceiling facilities.
“Our experience deploying high-performance Wi-Fi networks in large venues has
enabled us to identify the key interference and co-location issues that needed
to be solved,” said Jeff Lime, Vice President of Ventev Wireless
Infrastructure. “These new additions to the TerraWave product line are the
result of our working closely with campuses and stadiums, among others, to
solve these issues with innovative new products.”
The new antennas and mount support access points from most industry-leading
manufacturers. TerraWave’s full product line of Wi-Fi antennas feature a broad
range of technical specifications (gain, beamwidth, number of ports) and offer
a variety of mounting options (ceiling, wall, mast/pole, under the seat) to
ensure the right product is selected for the right application. For detailed
product information, please visit www.terrawave.com/hdantennas. To order a
TerraWave High-Density Antenna or another Ventev solution, wireless
professionals should contact TESSCO, Your Total Source^® (www.tessco.com).
About Ventev Wireless Infrastructure
Ventev Wireless Infrastructure, a division of TESSCO Technologies Inc.,
designs and manufactures solutions that deploy, protect, power, and improve
the performance of every type of wireless network: Wi-Fi, DAS (distributed
antenna systems), cellular, mesh and two-way. The extensive line of products
such as antennas, enclosures, cable, and solar-powered base stations support
these networks and their applications both indoors and outdoors. Ventev
Wireless Infrastructure's (www.ventev.com) three product lines are: TerraWave
Solutions (Wi-Fi enclosures, antennas and cable assemblies); Ventev
(integrated power and outdoor enclosure solutions); and Wireless Solutions
(base station infrastructure including towers, site hardware and grounding).
TESSCO Technologies Inc. (NASDAQ: TESS), Hunt Valley, Maryland, is Your Total
Source^® for making wireless work. The convergence of wireless and the
Internet is revolutionizing the way we live, work and play. New systems and
applications are creating opportunities and challenges at an unprecedented
rate. TESSCO is there, thinking in new ways for exceptional outcomes. TESSCO
(www.tessco.com) architects and delivers, with innovation, productivity and
speed, the product and value chain solutions to organizations responsible for
building, using and maintaining wireless broadband systems. The Company is a
component of the Russell 2000^® index.
TK\PR Public Relations, Inc.
Mary Lou DiNardo, 212-909-0340
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