[TodayIR] SMIC: CEVA, SMIC and Brite Semiconductor Partner to

  [TodayIR] SMIC: CEVA, SMIC and Brite Semiconductor Partner to Provide Hard
                Macro Versions of CEVA DSP Cores and Platforms

Agreement aimed at expediting customer designs utilizing CEVA DSP cores for a
range of applications, including communications, connectivity, imaging,
vision, audio and voice

MOUNTAIN VIEW, Calif. and SHANGHAI, March 19, 2014 /PRNewswire/ -- CEVA, Inc.
(NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP)
platform solutions and DSP cores, Brite Semiconductor (Shanghai) Corporation,
a leading IC design and turnkey service provider, and Semiconductor
Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), today
jointly announced a collaboration to provide hard macro versions of CEVA's DSP
cores for customers wishing to reduce the risk and design cycle time for their
SoC projects. Under the agreement, Brite Semiconductor has licensed a range of
CEVA DSP core technologies solely to develop fully optimized
application-specific hard macros that will be manufactured at SMIC's foundry.

"CEVA's DSP cores and platforms lead the industry in terms of performance and
power efficiency, and we are delighted to partner with them and SMIC to offer
our customers fully optimized designs that reduce risk and expedite
time-to-market for a wide range of applications," said Dr. Charlie Zhi,
President & CEO of Brite Semiconductor. "Through the close collaboration with
CEVA and SMIC, we are bringing significant value and expertise to our
customers who seek to take advantage of CEVA's industry-leading DSP core

"Partnering with CEVA and Brite to deliver fully integrated platforms using
our advanced processes and technologies will enable us to better serve our
customers seeking increased performance and more energy-efficient solutions,"
said Dr. Tianshen Tang, senior vice president of SMIC Design Service. "Our
foundry is the most advanced in mainland China and the addition of support for
CEVA's latest DSP cores further extends our capabilities and leadership in
China's burgeoning semiconductor industry."

"China is a highly strategic market for CEVA, with a rapidly expanding
semiconductor industry developing some of the most innovative technologies in
mobile and consumer electronics industries," said Gideon Wertheizer, CEO of
CEVA. "Our DSPs for communications, connectivity, imaging, vision, audio and
voice lead the industry in terms of performance and power efficiency and now
our customers can gain access to them easier than ever. This collaboration
between CEVA, SMIC and Brite aims to help companies to truly differentiate
their SoCs with minimal design risk."

Under the agreement, Brite and SMIC will provide complete design and
manufacturing services - including the incorporation of the CEVA DSP core hard
macros into SMIC's design databases. The hard macro solutions resulting from
the collaboration will enable SMIC customers to utilize their foundry process
with minimum integration cost, accelerated integration time and reduced risk.
Press spacebar to pause and continue. Press esc to stop.