Toshiba Develops TransferJet(TM)-Compatible 3D-Integrated Ultra-Small Module and Ultra-Thin FPC Coupler

  Toshiba Develops TransferJet(TM)-Compatible 3D-Integrated Ultra-Small Module
  and Ultra-Thin FPC Coupler

2014 IEEE Radio Wireless Week

Business Wire

TOKYO -- March 2, 2014

Toshiba (TOKYO:6502) has developed the world’s smallest wireless communication
module and thinnest flexible printed circuit (FPC) coupler compatible with
TransferJet^TM, the close-proximity wireless transfer technology. In
combination and applied to mobile devices, such as smartphones, they achieve a
maximum data transfer rate of 375Mbps. Toshiba demonstrated the devices on
January 20 at 2014 IEEE Radio Wireless Week (RWW), in Newport Beach,
California, USA.

TransferJet^TM continues to win attention as a low-power, high-speed
communication standard, and is expected to find wide acceptance because of its
uniquely simple approach to connectivity. Since the already high data volumes
handled by individuals are expected increase explosively in the near future,
TransferJet^TM is a highly promising solution for high-speed communications
between electronic devices in close proximity. This will fuel demand for
TransferJet^TM, modules and couplers that can be easily implemented in
consumer products.

Toshiba’s small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC
coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate
of 522Mbps (effective data transfer rate of 375Mbps). Module miniaturization
was realized by employing 3D integration technology to embed a
TransferJet^TM-compatible LSI in the module substrate. Such embedding usually
requires a higher module to maintain performance, but Toshiba’s advanced
design capabilities enabled it to secure a low module with excellent
performance. The new thin FPC coupler is fabricated with an innovative process
that uses molecular bonding technology.

A potential problem with small, thin modules formed with 3D integration
technology is a parasitic capacitance increase that often degrades
performance. The frequency response of TransferJet^TM is particularly
sensitive to this, as has a wide signal bandwidth, 560MHz. Toshiba identified
potential problems with parasitic capacitance, and solved them with the design
of the module structure and tuning transmission signals’ waveforms inside the
LSI.

The new FPC coupler is fabricated with molecular bonding technology, which
secures enough adhesion of FPC by covalent bond of a thin molecular layer. The
coupler is electrically evaluated with the module and excellent transmission
RF signals have been observed. It has quarter thickness of conventional
couplers.

This module and coupler are ideal for small, thin mobile devices, and Toshiba
expects them to be widely adopted. The module is now ready for sample
production and the coupler will be ready for sample production this month.

*: TransferJet^TM is licensed by the TransferJet Consortium.

About Toshiba

Toshiba is a world-leading diversified manufacturer, solutions provider and
marketer of advanced electronic and electrical products and systems. Toshiba
Group brings innovation and imagination to a wide range of businesses: digital
products, including LCD TVs, notebook PCs, retail solutions and MFPs;
electronic devices, including semiconductors, storage products and materials;
industrial and social infrastructure systems, including power generation
systems, smart community solutions, medical systems and escalators &
elevators; and home appliances.

Toshiba was founded in 1875, and today operates a global network of more than
590 consolidated companies, with 206,000 employees worldwide and annual sales
surpassing 5.8 trillion yen (US$61 billion). Visit Toshiba's web site at
www.toshiba.co.jp/index.htm

Contact:

Toshiba Corporation
Semiconductor & Storage Products Company
Megumi Genchi / Kota Yamaji, +81-3-3457-3576
Communication IR Promotion Group
Business Planning Division
semicon-NR-mailbox@ml.toshiba.co.jp
 
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