eBeam Initiative Announces Key Educational Themes for Photomask and Lithography Community for 2014

     eBeam Initiative Announces Key Educational Themes for Photomask and
                        Lithography Community for 2014

Sage Design Automation becomes latest company to join eBeam Initiative

PR Newswire

SAN JOSE, Calif., Feb. 25, 2014

SAN JOSE, Calif., Feb. 25, 2014 /PRNewswire/ --The eBeam Initiative, a forum
dedicated to the education and promotion of new semiconductor manufacturing
approaches based on electron beam (eBeam) technologies, today announced the
top educational themes that it will highlight in 2014. These themes, which
were identified based on member company feedback to the Initiative's most
recent annual survey completed late last year, include: the growing risks
associated with mask hotspots; new developments in multibeam solutions for
both maskless and mask-based lithography; and new developments in general
purpose graphics processing unit (GPGPU) solutions for simulation-intensive
electronic design automation (EDA) applications. The eBeam Initiative will
encourage its members to foster greater development and cooperation in these
areas to address emerging photomask and lithography challenges at the 20-nm
node and beyond.

In related news, Sage Design Automation (Sage-DA) has joined the eBeam
Initiative to support its educational goals and bring Sage-DA's perspective to
the eBeam community.

Entering its sixth year, the eBeam Initiative has grown to more than 40 member
companies and advisors who participate in the educational goals surrounding
eBeam-based technologies. The eBeam Initiative is kicking off its 2014
educational theme campaign at its annual members meeting being held today at
the SPIE Advanced Lithography Conference in San Jose, Calif., with talks from
industry luminaries on why mask hotspots matter, new approaches to addressing
rising mask complexity including GPGPU solutions, and mask synthesis for
directed self assembly (DSA) applications.

Mask hotspots, which are wafer-level production issues that occur when the
shapes specified by optical proximity correction (OPC) are not faithfully
reproduced on the mask, are of particular concern as the semiconductor
industry migrates from the 28-nm node to the 20-nm node and beyond. As part
of its educational efforts, the eBeam Initiative commissioned a white paper on
the causes of mask hotspots, how they are different from lithography (wafer)
hotspots, and solutions to address mask hotspots before they impact mask
yields and cycle times, as well as wafer yields. The white paper is now
available on the eBeam Initiative website at
www.ebeam.org/mask_hotspots_whitepaper.

"eBeam technology provides a crucial link in every semiconductor design to
manufacturing chain, regardless of which advanced lithography approach is
being considered. After more than five years, the eBeam Initiative continues
to serve a vital role in providing a forum for the mask and lithography
community to explore new challenges that can be solved by eBeam based
solutions," stated
Aki Fujimura, CEO of D2S, the managing company sponsor of the eBeam
Initiative. "Many of our members have indicated that mask hotspots are now an
increasingly important issue that the industry must come together to address,
making this a natural theme for the eBeam Initiative this year. Better mask
making leads to better wafer making. By working together to solve the mask
hotspot issue, we can enable more complex shapes to be reliably manufactured
on the mask, which then addresses the lithography hotspot problem through
better masks."

Added Fujimura, "I'd like to welcome Sage-DA to the eBeam Initiative.
Design-to-manufacturing collaboration is a critical part of pushing Moore's
Law forward. The innovations in design rule expression that Sage-DA brings
can help make that collaboration tighter."

About The eBeam Initiative
The eBeam Initiative provides a forum for educational and promotional
activities regarding new semiconductor manufacturing approaches based on
electron beam (eBeam) technologies. The goals of the Initiative are to reduce
the barriers to adoption to enable more integrated circuit (IC) design starts
and faster time-to-market while increasing the investment in eBeam
technologies throughout the semiconductor ecosystem. Members and advisors,
which span the semiconductor ecosystem, include: Abeam Technologies,
Advantest, Alchip Technologies, AMTC, Applied Materials, Artwork Conversion,
Aselta Nanographics, Cadence Design Systems, CEA-Leti, D2S, Dai Nippon
Printing, EQUIcon Software GmbH Jena, eSilicon Corporation, Fastrack Design,
Fraunhofer CNT, Fujitsu Semiconductor Limited, GenISys GmbH, GLOBALFOUNDRIES,
Grenon Consulting, Hitachi High-Technologies, HOYA Corporation, IMS CHIPS, IMS
Nanofabrication AG, JEOL, KLA-Tencor, Mentor Graphics Corporation, Multibeam
Corporation, NCS, NuFlare Technology, John Chen from NVIDIA, Petersen Advanced
Lithography, Colin Harris from PMC-Sierra, Riko Radojcic from Qualcomm, Sage
Design Automation, Samsung Electronics, STMicroelectronics, Synopsys,
tau-Metrix, Tela Innovations, TOOL Corporation, Toppan Printing, Vistec
Electron Beam Lithography Group, and Hugh Durdan from Xilinx. Membership is
open to all companies and institutions throughout the electronics industry.
To find out more, please visit www.ebeam.org.

SOURCE The eBeam Initiative

Website: http://www.ebeam.org
Contact: Agency Contact, David Moreno, MCA, Tel: +1-650-968-8900, ext. 125,
E-mail: dmoreno@mcapr.com
 
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