Yamaha Selects CEVA-TeakLite-4 Audio/Voice DSP
Industry's most trusted DSP architecture now powers audio/voice pre and post
processing in Yamaha chips for mobile devices
BARCELONA, Spain, Feb. 24, 2014
BARCELONA, Spain, Feb. 24, 2014 /PRNewswire/ --Mobile World Congress 2014--
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual
property (SIP) platform solutions and DSP cores, today announced that Yamaha
has licensed multiple members of the CEVA-TeakLite-4 DSP family of cores.
The fully synthesizable CEVA-TeakLite-4 DSP design addresses the need to run
increasingly complex voice pre-processing algorithms, advanced audio
post-processing, and always-on voice activation, a must-have feature in
today's high-end smartphones, all at extremely lower power. The
CEVA-TeakLite-4 DSP architecture, its instructions specific to audio/voice
processing, and its cutting-edge power management and reduction technology
offer Yamaha an indispensable platform to run ultra-low power audio and voice
"Our comprehensive selection process has led us to understand clearly that the
CEVA-TeakLite-4 cores have the industry-leading audio/voice DSP architecture,
the smallest footprint, and the best power efficiency for mobile product ICs,"
said Nobukazu Nakamura, Manager of Strategic Marketing Department,
Semiconductor Division, Yamaha Corporation. "We continue to work together with
CEVA for the continual advancement of our audio/voice product roadmap,
integrating leading-edge technologies, yet achieving better performance and
greater power efficiency at the same time."
"We are delighted to announce Yamaha Corporation as the latest company to
choose our CEVA-TeakLite-4 DSP architecture for their audio/voice product
lines," said Gideon Wertheizer, CEO of CEVA. "Yamaha is a recognized leader in
high-quality audio and voice processing technology and our DSP provides them
with a fully programmable platform featuring ample processing horsepower to
implement even the most sophisticated audio and voice use-cases."
The CEVA-TeakLite-4 is the fourth generation DSP based on CEVA-TeakLite, the
most successful licensable DSP architecture in the history of the
semiconductor industry, with more than 3 billion audio/voice chips shipped,
over 100 licensees, 30 active ecosystem partners and more than 100 audio and
voice software packages available. The CEVA-TeakLite-4 is offered as a
scalable and extensible architecture framework, allowing customers to choose
the optimal family member core to address their specific audio/voice
application needs. By taking advantage of the unified software ecosystem, a
set of optimized software libraries and the integrated development
environment, customers can easily reduce software development costs
significantly while leveraging their software investment in future products.
For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP)
DSP cores and platform solutions for the mobile, digital home and networking
markets. CEVA's IP portfolio includes comprehensive technologies for cellular
baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice
processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In
2013, CEVA's IP was shipped in over 1 billion devices, powering smartphones
from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG,
Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets
shipped worldwide are powered by a CEVA DSP core. For more information, visit
www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.
Contact: Richard Kingston, CEVA, Inc., +1-650-417-7976,
firstname.lastname@example.org or Mike Sottak, Wired Island, Ltd.,
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