Peregrine Semiconductor Introduces UltraCMOS® Global 1, the Industry’s First Reconfigurable RF Front-End System

  Peregrine Semiconductor Introduces UltraCMOS® Global 1, the Industry’s First
  Reconfigurable RF Front-End System

    Global 1 Features the First CMOS Power Amplifier to Deliver GaAs-Level
                         Performance for LTE Devices

Mobile World Congress 2014

Business Wire

SAN DIEGO -- February 4, 2014

Peregrine Semiconductor Corp. (NASDAQ:PSMI), founder of RF SOI (silicon on
insulator) and pioneer of advanced RF solutions, today announces UltraCMOS
Global 1, the first reconfigurable RF front end (RFFE). For the first time, 4G
LTE platform providers and OEMs will be able to save time and money by
creating a single-SKU design for global markets.

To support over 40 frequency bands and a more than 5,000-fold increase in the
number of possible operating states, a truly reconfigurable RFFE is now a
requirement. This level of reconfigurability is only feasible with a CMOS
process. Global 1’s entire system – multimode, multiband (MMMB) power
amplifier (PA); post-PA switch; antenna switch; and antenna tuner – is based
on Peregrine’s UltraCMOS 10 technology platform. This platform leverages 25
years of RF expertise with proven performance demonstrated by more than 2
billion RF SOI units shipped. In addition, Global 1 features the industry’s
first LTE CMOS PA with the same raw performance as the leading gallium
arsenide (GaAs) PAs and has a 33-percent efficiency increase over other CMOS

“For years RF engineers have been looking for an integrated, CMOS RF front-end
offering that performs as well as GaAs for mobile devices,” says Joe Madden,
founder and principal analyst at Mobile Experts. “Peregrine’s UltraCMOS
technology has demonstrated GaAs-level efficiency performance at high power,
which could be a game-changer.”

Global 1 RFFE System

On a single chip, Peregrine’s Global 1 RFFE system delivers the scalability to
easily support higher band counts through low-loss switching and tunability;
high isolation to solve interoperability issues; simple, digitally-controlled
adaptation across modes and bands; and, most importantly, PA performance
equivalent to GaAs.

The UltraCMOS Global 1 system’s reconfigurable RFFE delivers:

  *3-path MMMB PA, post-PA switching, antenna switch and antenna tuner
  *Support for envelope tracking
  *Common RFFE MIPI interface

“Creating a global, single-SKU design for LTE devices is currently the
toughest, unmet challenge in RF,” says Jim Cable, CEO at Peregrine
Semiconductor. “Peregrine was founded with a vision for integration, and,
after shipping 2 billion switches and tuners, we are proud to announce a truly
integrated RF front-end system that enables a single, global SKU.”

UltraCMOS Global 1 PA Performance

Before now, no vendor has been able to deliver GaAs-level PA performance in a
CMOS PA, which prevented CMOS PAs from competing in the performance-driven LTE
handset market. The Global 1 system integrates Peregrine’s established,
best-in-class RF switches and tuners seamlessly with the first CMOS PA to
match the performance of GaAs PAs. This level of performance is reached
without enhancements from envelope tracking or digital predistortion, which is
often used when benchmarking CMOS PAs with GaAs PAs.

A standard industry benchmark for PA performance is PAE (power-added
efficiency) using a WCDMA (voice) waveform at an ACLR (adjacent channel
leakage ratio) of -38 dBc. Under these conditions, the performance of the
UltraCMOS Global 1 PA approaches 50-percent PAE. This is on par with the
leading GaAs PAs and exceeds the performance of other CMOS PAs by 10
percentage points, which represents a 33-percent efficiency increase. Further,
the UltraCMOS Global 1 PA maintains GaAs-equivalent PAE for LTE waveforms with
varying resource-block allocations.

While the UltraCMOS Global 1 PA reaches GaAs-competitive performance levels
without the use of envelope tracking, the system natively supports all major
envelope tracking solutions currently on the market. The PAE at saturated
power (P[SAT]) provides a good indication on what PAE is possible using an
envelope tracking modulator; however, the efficiency enhancements that
envelope tracking brings are very band specific. With an envelope tracker, the
system efficiency of UltraCMOS Global 1 typically increases 10 percentage
points, depending on band.

UltraCMOS Global 1 Benefits Everyone

According to Mobile Experts, the RFFE market is projected to grow from $6.1
billion in 2013 to $12.2 billion in 2018. Much of this growth stems from
demand in the LTE market and the impact the RFFE has on the overall
performance in mobile devices. The benefits of Global 1 extend far beyond RF
engineers to affect the entire wireless ecosystem:

  *Platform providers can develop a single reference platform, reducing
    reference design development costs and validation time.
  *OEMs can design a single, global SKU, cutting R&D costs, accelerating time
    to market, streamlining supply chains and improving inventory management.
  *Consumers can enjoy longer battery life, better reception, faster data
    rates and wider roaming range.
  *Wireless operators can reduce capital investments in their network with
    improved RFFE performance, resulting in better coverage and reductions in
    dropped calls.

UltraCMOS Global 1 Availability

The UltraCMOS Global 1 PA will be demonstrated by appointment at Mobile World
Congress (MWC) in Barcelona, Feb. 24-27, in Hospitality Suite Meeting Room
2A20MR. The UltraCMOS Global 1 system will complete platform integration in
2014 and will be in volume production in late 2015. For more detail, view the
press kit.


This press release contains forward-looking statements regarding our
management's future expectations, beliefs, intentions, goals, strategies,
plans and prospects. Such statements constitute “forward-looking” statements
which are subject to the safe harbor provisions of the Private Securities
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and introduce new and enhanced products on a timely basis and achieve market
acceptance of those products; consumer acceptance of our customers’ products
that incorporate our solutions; our lack of long-term supply contracts and
dependence on limited sources of supply; and potential decreases in average
selling prices for our products.

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ended December 29, 2012 and additional information that will be set forth in
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Peregrine Semiconductor (NASDAQ:PSMI), founder of RF SOI (silicon on
insulator), is a leading fabless provider of high-performance, integrated RF
solutions. Since 1988 Peregrine and its founding team have been perfecting
UltraCMOS® technology – a patented, advanced form of SOI – to deliver the
performance edge needed to solve the RF market’s biggest challenges, such as
linearity. With products that deliver best-in-class performance and monolithic
integration, Peregrine is the trusted choice for market leaders in automotive,
broadband, industrial, Internet of Things, military, mobile devices,
smartphones, space, test-and-measurement equipment and wireless
infrastructure. Peregrine holds more than 150 filed and pending patents and
has shipped more than 2 billion UltraCMOS units. For more information, visit

The Peregrine Semiconductor name, logo, and UltraCMOS are registered
trademarks of Peregrine Semiconductor Corporation in the U.S.A., and other
countries. All other trademarks mentioned herein are the property of their
respective owners.

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Peregrine Semiconductor
Editorial Contact:
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