Cabot Microelectronics to Present at the 12th Annual Stifel Technology, Internet & Media Conference Aurora, IL, Feb. 3, 2014 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing CMP pad supplier to the semiconductor industry, announced today that it is scheduled to present at the 12^th Annual Stifel Technology, Internet & Media Conference in San Francisco at 9:45 a.m. Pacific Time on Monday, February 10, 2014. Forward looking and other material information may be discussed during the presentation. A live webcast and replay of the presentation will be available in the Investor Relations section of the company's website at www.cabotcmp.com. For more information, please contact Trisha Tuntland of Cabot Microelectronics at firstname.lastname@example.org. ABOUT CABOT MICROELECTRONICS CORPORATION Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP polishing slurries and a growing CMP pad supplier to the semiconductor industry. The company's products play a critical role in the production of advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. The company's mission is to create value by developing reliable and innovative solutions, through close customer collaboration, that solve today's challenges and help enable tomorrow's technology. Since becoming an independent public company in 2000, the company has grown to approximately 1,050 employees on a global basis. For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com or contact Trisha Tuntland, Manager of Investor Relations at 630-499-2600. CONTACT: Trisha Tuntland Manager, Investor Relations (630) 499-2600 Cabot Microelectronics Corporation Logo
Cabot Microelectronics to Present at the 12th Annual Stifel Technology, Internet & Media Conference
Press spacebar to pause and continue. Press esc to stop.