Rambus Engineers and Scientists to Present New Research and Training at DesignCon 2014

  Rambus Engineers and Scientists to Present New Research and Training at
  DesignCon 2014

DesignCon 2014

Business Wire

SANTA CLARA, Calif. -- January 28, 2014

Rambus Inc. (NASDAQ:RMBS):


Who:      Rambus Inc. (NASDAQ:RMBS)
             
Where:       DesignCon
            Santa Clara Convention Center – Booth #301
            5001 Great America Parkway, Santa Clara, Calif.
            DesignCon.com
             
When:        January 28 ^ - 31, 2014


At DesignCon 2014, Rambus engineers and scientists will present two papers on
the latest research in ultra-high speed interface design and deliver training
on the latest low-power, high-performance memory solutions.

Additionally, Rambus will be demonstrating various IP cores, tools and
emerging architectures designed to deliver robust and easy to integrate
solutions in its booth (#301), including: the LabStation™ validation platform,
R+™ LPDDR3, and R+ technologies for extending main memory beyond DDR4.

Click to Tweet:  @rambusincwill be exhibiting, speaking and demonstrating
at@UBMDesignCon2014 on 1/28-31 #Innovation

Paper Presentations:

Title: “An Implementer’s Guide to Low-Power and High-Performance Memory
Solutions”
Rambus Speakers/Authors: Scott Best, Wendem Beyene, Ming Li
Date: Tuesday, January 28, 2014
Time: 9:00 a.m.-12:00 p.m.

This session provides an in-depth analysis of standard DRAM memory solutions
for low-power and high-performance applications. Specifically, the session
will cover the interactions between signaling, clocking and packaging
technology of a memory interface, and how this knowledge can be used to
analyze and compare different popular memory interfaces for different
applications including mobile, compute, graphics, and server.

Title: “Lessons Learned: How to Make Predictable PCB Interconnects for Data
Rates of 50 Gbps and Beyond”
Rambus Speakers/Authors: Wendem Beyene
Date: Wednesday, January 29, 2014
Time: 9:20 a.m.-10:00 a.m.

Rambus joins colleagues from the industry to discuss elements for 50 Gbps
interconnect design success. The discussion will address practical methodology
for dielectric and conductor roughness model identification for accurate
analysis of 50 Gbps interconnects, understanding the importance of loss
separation in conductor roughness and dielectric models, and the impact of
fiber weave effects on signal propagation at higher frequencies.

Title: “Package-PCB Interface Discontinuity Optimization for 50 GB/S SerDes
Applications”
Rambus Speakers/Authors: Wendem Beyene, Kevin Cai, Gnanadeep Kollipara,
Keisuke Saito
Date: Wednesday, January 29, 2014
Time: 11:05 a.m.-11:45 a.m.

This session is focused on system design optimization techniques for the
package-PCB interface of a 50Gb/s medium-reach SerDes channel. A summary of
optimized design features and relative performance results are presented for
conventional and high-density interconnect (HDI) PCB designs.

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division moves data. MID develops products
and services that solve the power, performance, and capacity challenges of the
mobile, cloud computing and connected device markets. Rambus enhanced
standards-compatible and custom memory and serial link solutions include
architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools,
and system and IC design services. Developed through our system-aware design
methodology, Rambus’ products deliver improved time-to-market and
first-time-right quality.

About Rambus

Rambus brings invention to market. Our customizable IP cores, architecture
licenses, tools, services, and training improve the competitive advantage of
our customers’ products while accelerating their time-to-market. Rambus
products and innovations capture, secure and move data. For more information,
visit rambus.com.

RMBSTN

Contact:

MSLGROUP for Rambus
Darah Roslyn, 415-512-0770
Anna Vaverka, 415-512-0770
rambus@schwartzmsl.com