Anritsu VectorStar Part of Technical Workshop Conducted by DuPont Circuit & Packaging Materials and Rogers Corporation at

 Anritsu VectorStar Part of Technical Workshop Conducted by DuPont Circuit &
         Packaging Materials and Rogers Corporation at DesignCon 2014

-- Technical Program to Help Engineers Gain Better Understanding of
Measurements to Determine Properties of Low-loss Materials in High-frequency
Applications --

PR Newswire

SANTA CLARA, Calif., Jan. 28, 2014

SANTA CLARA, Calif., Jan. 28, 2014 /PRNewswire/ --Anritsu Company (DesignCon
booth #501) announces its VectorStar™ Vector Network Analyzer (VNA) will be
part of a workshop conducted by DuPont Circuit & Packaging Materials (DuPont)
(booth #719) and Rogers Corporation (booth #720), as part of the DesignCon
Technical program. The workshop on understanding the properties of low-loss
materials in high-frequency applications will include live demonstrations in
which the VectorStar will conduct various tests on thin, flexible materials
from DuPont and thick, rigid materials from Rogers.


Workshop presenters are Glenn Oliver, Senior Engineer, DuPont Circuit &
Packaging Materials, and John Coonrod, Market Development Manager, Rogers
Corporation. The two engineers are the Chair and Vice-Chair, respectively, of
the IPC D-24C Task Group for IPC, which is focused on developing and
standardizing high-frequency measurement methods for printed circuit board
(PCB) materials. The workshop will be from 1:30-4:30 p.m. today in Grand
Ballroom F of the Santa Clara Convention Center, site of DesignCon 2014.

"We are happy to support this interactive workshop and look forward to the
live demonstrations that focus on the microwave properties of materials. This
is a very important subject in the signal integrity field and the unique
design of the VectorStar makes the VNA platform well suited for this type of
demonstration," said Wade Hulon, General Manager and Vice President of Anritsu

At DesignCon 2014, DuPont will highlight DuPont™ Pyralux^® flexible circuit
materials as part of its innovative product portfolio that enables
next-generation designs for computers, handheld devices and the infrastructure
that connects the cloud. DuPont Circuit & Packaging Materials offers a broad
and growing portfolio of products, including dry film photoresists and
phototooling films for Printed Circuit Board (PCB) imaging, polyimide films,
flexible circuit materials, embedded passive materials and thermal substrates
for LED lighting.

About Anritsu Company
Anritsu Company is the United States subsidiary of Anritsu Corporation, a
global provider of innovative communications test and measurement solutions
for more than 110 years. Anritsu provides solutions for existing and
next-generation wired and wireless communication systems and operators.
Anritsu products include wireless, optical, microwave/RF, and digital
instruments, as well as operations support systems for R&D, manufacturing,
installation, and maintenance. Anritsu also provides precision microwave/RF
components, optical devices, and high-speed electrical devices for
communication products and systems. With offices throughout the world, Anritsu
sells in over 90 countries with approximately 4,000 employees.

To learn more visit

SOURCE Anritsu Company

Contact: Anritsu Contact: Kim Collins, Director, Americas Marketing,, 972.761.4625; Anritsu Agency Contact: Patrick
Brightman, 3E Public Relations,, 973.263.5475
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