Industry's First Wi-SUN Alliance Certified Products Now Available

      Industry's First Wi-SUN Alliance Certified Products Now Available

LAPIS Semiconductor Co., NICT and Silver Spring Networks Complete Global
Certification Program and Successful Testing

PR Newswire

TOKYO, Jan. 23, 2014

TOKYO, Jan. 23, 2014 /PRNewswire/ --The Wi-SUN® Alliance, a global ecosystem
of organizations creating interoperable wireless solutions for use in energy
management and smart-utility network applications, today announced the first
Wi-SUN Alliance certified products. Wi-SUN members LAPIS Semiconductor Co.,
Ltd, NICT (Japan's National Institute of Information and Communications
Technology) and Silver Spring Networks (NYSE: SSNI) completed testing to
achieve Wi-SUN PHY certification according to the Alliance's recently
announced Global Certification Program.

(Logo: http://photos.prnewswire.com/prnh/20120904/SF66824LOGO)

The industry's first certified products include:

  oLAPIS Semiconductor ML7396B evaluation system
  oNICT Hyper Wi-SUN 3
  oSilver Spring Networks Gen4 product portfolio

These three members completed the Wi-SUN Alliance Global Certification
Program, which consists of:

  oPHY Conformance Testing based on specifications from IEEE802.15.4g. Test
    plans were developed through a rigorous, phased process, and approved by
    Wi-SUN Alliance membership.
  oPHY Interoperability of Smart Utility Network systems based on products
    from multiple silicon vendors. Products are verified for operation in
    international regulatory bands including Asia, North America, and South
    America.
  oTesting and Supervision by TUV Rheinland Group, a leading provider of
    technical services with a global network of qualified test facilities with
    locations in 65 countries.

"Today's announcement is significant not only for the companies involved, but
also for the Alliance," said Phil Beecher, Chairman of the Wi-SUN Alliance.
"Having three different companies complete stringent testing of multiple
products, based on silicon from both LAPIS Semiconductor and Analog Devices,
Inc., and performed in multiple geographical locations, should afford the
industry great confidence in the global, inclusive, and rigorous nature of the
specifications and processes included in our Global Certification Program."

Numerous Wi-SUN members were actively engaged in creating the formal Wi-SUN
PHY test plan, a key element of the complete certification process.
Additionally, Wi-SUN Alliance members continue interoperability testing of the
Wi-SUN Echonet and Field Area Network (FAN) profiles, both of which are
underpinned by the Wi-SUN PHY specification and its related Certification
Program.

For more information on the Wi-SUN Alliance Global Certification Program,
please visit: www.wi-sun.org.

About the Wi-SUN Alliance

The Wi-SUN Alliance is an association of companies working together to enable
reliable, cost-effective, low-power wireless Utility products based on open
global standard IEEE 802.15.4g. The Wi-SUN Alliance comprises solutions from
original equipment manufacturers worldwide. Membership is open to all
corporations. Additional information may be found at www.wi-sun.org.

CONTACT:
Bhupender Virk
Media@wi-sun.org

SOURCE Wi-SUN Alliance

Website: http://www.wi-sun.org
 
Press spacebar to pause and continue. Press esc to stop.