Invensas Shows New xFD-Based Customer Products with Etron Technology at CES, Las Vegas

  Invensas Shows New xFD-Based Customer Products with Etron Technology at CES,
  Las Vegas

2014 International CES

Business Wire

SAN JOSE, Calif. -- January 7, 2014

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA), will display its latest xFD^TM products solutions at CES Las
Vegas, Jan. 7 - 10, 2014, including cloud server module solutions featuring
advanced Registered Dual Inline Memory Modules (R-DIMMs) in collaboration with
semiconductor manufacturer, Etron Technology, Inc., and memory module
provider, ADATA Technology.

“Invensas xFD technology plays a vital role in minimizing manufacturing cost,
while enhancing electrical and thermal performance versus conventional
technology,” said Dr. James Sung, president of Etron Technology. “We see
significant pull from semiconductor users with Invensas xFD technology.”

xFD technology connects multiple memory chips in a face-down shingle-stack
configuration using ultra-short wirebonds. The solution significantly reduces
the cost of server and datacenter operation by providing superior data access
performance with significantly lower cooling costs and power usage.

“We are delighted to be at CES with Etron and ADATA,” said Simon McElrea,
president of Invensas Corporation. “Semiconductor packaging, or
Interconnectology as we call it at Invensas, is growing to become a vital and
highly valuable element of the mobile and cloud storage landscape. Our
intellectual property and technology solutions continue to gain traction with
key customers and supply chain partners in this exciting space.”

Invensas will display the products with Etron Technology, Inc. in Etron’s
Booth #35116 LVCC, South Hall 4, Las Vegas, NV, on Jan. 7 - 10, 2014. More
details and additional Invensas xFD solutions can be found at

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to
the safe harbor provisions of the Private Securities Litigation Reform Act of
1995. Forward-looking statements involve risks and uncertainties that could
cause actual results to differ significantly from those projected,
particularly with respect to Invensas’s participation at CES Las Vegas and the
characteristics, features, benefits and market adoption of Invensas’s
intellectual property and technology, including xFD. Material factors that may
cause results to differ from the statements made include the plans or
operations relating to the businesses of Tessera Technologies, Inc. (the
“Company”); market or industry conditions; changes in patent laws, regulation
or enforcement, or other factors that might affect the Company's ability to
protect or realize the value of its intellectual property; the expiration of
license agreements and the cessation of related royalty income; the failure,
inability or refusal of licensees to pay royalties; initiation, delays,
setbacks or losses relating to the Company's intellectual property or
intellectual property litigations, or invalidation or limitation of key
patents; the timing and results, which are not predictable and may vary in any
individual proceeding, of any ICC ruling or award, including in the Amkor
arbitration; fluctuations in operating results due to the timing of new
license agreements and royalties, or due to legal costs; the risk of a decline
in demand for semiconductor and camera module products; failure by the
industry to use technologies covered by the Company's patents; the expiration
of the Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases in
production orders from, customers of acquired businesses; financial and
regulatory risks associated with the international nature of the Company's
businesses; failure of the Company's products to achieve technological
feasibility or profitability; failure to successfully commercialize the
Company's products; changes in demand for the products of the Company's
customers; limited opportunities to license technologies and sell products due
to high concentration in the markets for semiconductors and related products
and camera modules; the impact of competing technologies on the demand for the
Company's technologies and products; and the reliance on a limited number of
suppliers for the components used in the manufacture of DOC products. You are
cautioned not to place undue reliance on the forward-looking statements, which
speak only as of the date of this release. The Company's filings with the
Securities and Exchange Commission, including its Annual Report on Form 10-K
for the year ended Dec. 31, 2012, and its Quarterly Report on Form 10-Q for
the quarter ended Sept. 30, 2013, include more information about factors that
could affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release. Although
this release may remain available on the Company's website or elsewhere, its
continued availability does not indicate that the Company is reaffirming or
confirming any of the information contained herein.

About Etron Technology, Inc.

Etron Technology, Inc. (Taiwan GTSM: 5351) is a world-class fabless integrated
circuits design and product company founded in 1991 and specializing in
semiconductor memories and system chips. In Taiwan’s “National Sub-micron
Project” from the early 1990s, Etron participated in architecting, pioneering,
and developing Taiwan’s first 8-inch sub-micron wafer, thus establishing a
solid foundation for the fabless, foundry, SRAM, and DRAM industries which
have transformed Taiwan into a major semiconductor powerhouse. As a publicly
traded company headquartered in Taiwan and focused on bridging the
Asia-Pacific and the global markets, Etron is producing a variety of IC
products, including buffer memories, USB3.0 host controllers and flash memory
controllers, USB power delivery controllers, gesture control ICs, and

About Invensas

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA - News), is a global leader in semiconductor interconnect
solutions and intellectual property. Invensas innovates in areas such as
mobile computing and communications, memory and data storage, and 3-D
Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California,
Invensas licenses these solutions to Original Equipment Makers, Original
Design Manufacturers, and Integrated Device Manufactures and delivers the
products to market through collaborative engineering partnerships and
strategic business alliances. Learn more at or, or contact Invensas PR at +1 408 324 5105.


For Etron:
Ms. Justine Tsai, +1-408-823-8368 or +1-702-426-3102
For Invensas:
Impress Labs
Ms. Amy Smith, +1-401-369-9266
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