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Invensas and Tezzaron Partner to Deliver Commercial 3D-IC Products



  Invensas and Tezzaron Partner to Deliver Commercial 3D-IC Products

Business Wire

SAN JOSE, Calif. -- December 12, 2013

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA), announced today that it is partnering with Tezzaron
Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit
(3D-IC) semiconductor devices, in order to build a wide range of 3D-IC
customer products.

"Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D
silicon devices, but the final packaging flows are lacking,” stated Robert
Patti, CTO of Tezzaron. “Invensas’ 3D-IC packaging expertise and existing
pilot assembly line capability will enable us to ramp our unique products into
full production. The Invensas combination of technology development and low
volume manufacturing capabilities are unlike anything else available."

3D-IC technology involves the stacking of multiple Integrated Circuits with
Through Silicon Vias (TSVs) into ultra dense, ultra high-performance,
low-power products, using advanced semiconductor and semiconductor packaging
processes. 3D-IC architecture is the fundamental building block of a broad
range of next generation silicon solutions in Memory, Mobile SOC (System on
Chip), RF (Radio Frequency), Image Sensor, MEMS, and Microprocessor products.

“We are delighted to take this next step in 3D-IC commercialization with
Tezzaron,” said Simon McElrea, president of Invensas. “3D-IC is finally at its
strategic inflection point. We have developed unique assembly capability in
our pilot line in San Jose, and have built a corresponding 3D-IC patent
portfolio of over 500 assets to date. Tezzaron put 3D-IC on the map, and we
are excited to work with them now to deliver commercial 3D-IC products to key
customers.”

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to
the safe harbor provisions of the Private Securities Litigation Reform Act of
1995. Forward-looking statements involve risks and uncertainties that could
cause actual results to differ significantly from those projected,
particularly with respect to Invensas partnering with Tezzaron, 3D-IC
commercialization and the features, characteristics and benefits of Invensas
products and technology. Material factors that may cause results to differ
from the statements made include the plans or operations relating to the
businesses of Tessera Technology, Inc. (the “Company”); market or industry
conditions; changes in patent laws, regulation or enforcement, or other
factors that might affect the Company's ability to protect or realize the
value of its intellectual property; the expiration of license agreements and
the cessation of related royalty income; the failure, inability or refusal of
licensees to pay royalties; initiation, delays, setbacks or losses relating to
the Company's intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; the timing and results, which are
not predictable and may vary in any individual proceeding, of any ICC ruling
or award, including in the Amkor arbitration; fluctuations in operating
results due to the timing of new license agreements and royalties, or due to
legal costs; the risk of a decline in demand for semiconductor and camera
module products; failure by the industry to use technologies covered by the
Company's patents; the expiration of the Company's patents; the Company's
ability to successfully complete and integrate acquisitions of businesses; the
risk of loss of, or decreases in production orders from, customers of acquired
businesses; financial and regulatory risks associated with the international
nature of the Company's businesses; failure of the Company's products to
achieve technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products of
the Company's customers; limited opportunities to license technologies and
sell products due to high concentration in the markets for semiconductors and
related products and camera modules; the impact of competing technologies on
the demand for the Company's technologies and products; and the reliance on a
limited number of suppliers for the components used in the manufacture of DOC
products. You are cautioned not to place undue reliance on the forward-looking
statements, which speak only as of the date of this release. The Company's
filings with the Securities and Exchange Commission, including its Annual
Report on Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report
on Form 10-Q for the quarter ended Sept. 30, 2013, include more information
about factors that could affect the Company's financial results. The Company
assumes no obligation to update information contained in this press release.
Although this release may remain available on the Company's website or
elsewhere, its continued availability does not indicate that the Company is
reaffirming or confirming any of the information contained herein.

About Tezzaron

Tezzaron Semiconductor Corporation is a world leader in the design and
production of 3D-ICs including high-performance memory and sensor arrays.
Tezzaron's unique device architecture and assembly methodology allows
unrivaled performance and unprecedented low power. Tezzaron is the world's
only turnkey 2.5D and 3D SOC supplier offering both design and fabrication
services. Corporate headquarters are located at 1415 Bond St., Suite 111,
Naperville, Ill. 60563. For more information, visit http://www.tezzaron.com.

About Invensas

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA - News), is a global leader in semiconductor interconnect
solutions and intellectual property. Invensas innovates in areas such as
mobile computing and communications, memory and data storage, and 3D
Integrated Circuit (3D-IC) technologies. Headquartered in San Jose,
California, Invensas licenses these solutions to Original Equipment Makers,
Original Design Manufacturers, and Integrated Device Manufacturers and
delivers the products to market through collaborative engineering partnerships
and strategic business alliances. Learn more at www.interconnectology.com or
www.invensas.com, or contact Invensas PR at +1 408 324 5105.

TSRA-G

Contact:

Company Contact:
Tessera Technologies, Inc.
Moriah Shilton, 408-321-6713
Sr. Director, Communications & Investor Relations
or
PR Contact:
Impress Labs
Amy Smith, 401-369-9266
amy@impresslabs.com
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