Aehr Test Systems Announces Follow-On Order for Its FOX-15(TM) Wafer-Level Burn-In and Test System

Aehr Test Systems Announces Follow-On Order for Its FOX-15(TM) Wafer-Level
Burn-In and Test System

FREMONT, Calif., Dec. 9, 2013 (GLOBE NEWSWIRE) -- Aehr Test Systems
(Nasdaq:AEHR), a leading supplier of semiconductor test and burn-in equipment,
today announced it has received over $1 million in a follow-on order for its
FOX-15 wafer-level burn-in and test system and WaferPak full-wafer contactors
from a leading supplier of automotive and industrial integrated circuits.

The FOX-15 system will be used in production and has a capacity of up to 15
WaferPak single-touchdown full-wafer contactors for production burn-in and
test of state-of-the-art integrated circuits. As each wafer contains thousands
of ICs, the throughput and capacity of the system are quite large, adding to
the millions of devices that have already been processed by the FOX-15 systems
at this customer's facility.

"Doing burn-in at the wafer level, before the die are packaged, allows our
customers to collect reliability data much earlier in their production process
so that they can monitor and continuously improve their wafer fabrication
process and yields," said Carl Buck, vice president of marketing at Aehr Test
Systems. "We are pleased to see that our automotive customers are increasing
capacity, an indication both of their success and the strength that we are
seeing in the automotive market."

"We continue to feel that our intellectual property and products that address
functional test, burn-in, cycling,process development and process monitoring
at the wafer level are key differentiators for our company and for our
customers that use them," said Gayn Erickson, president and chief executive
officer of Aehr Test Systems."We are pleased that one of our key customers
continues to see significant improvement in cost of test and cost of
manufacturing by their implementation of wafer level test and burn-in in
production.This is achieved not only through an overall lower capital cost
through massive parallel test solutions, but also by finding device defects
prior to packaging, allowing our customers to deliver a highly reliable
product without the significant cost of finding those defects after the
device, or in the case of stacked packages, multiple devices are in final
package form."

As usage of electronics in automobiles grows, high-density packaging holding
multiple die becomes increasingly important. With stacked or multi-die
packaging, each of the die in the package must be highly reliable, enabling
the multi-die package to meet the stringent reliability demands of the
automotive manufacturers. Aehr Test's FOX system provides full wafer contact
parallel test and burn-in solutions for the die before they are assembled into
the package. This enables the reliability screening to be done on the die
before the assembly of the multi-die package, avoiding the costly scrapping of
entire stacked or multi-chip packages when only one of the die fails the
reliability screen.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a worldwide
provider of test systems for burning-in and testing logic and memory
integrated circuits and has an installed base of more than 2,500 systems
worldwide. Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test requirements,
capacity needs and opportunities for Aehr Test products in package and wafer
level test. Aehr Test has developed and introduced several innovative
products, including the ABTS^TM and FOX families of test and burn-in systems
and the DiePak^® carrier. The ABTS system is used in production and
qualification testing of packaged parts for both lower-power and higher-power
logic as well as all common types of memory devices. The FOX system is a full
wafer contact test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is
a reusable, temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of bare die. For more information,
please visit the Company's website at

Safe Harbor Statement

This release contains forward-looking statements that involve risks and
uncertainties relating to projections regarding customer demand and acceptance
of Aehr Test's products.Actual results may vary from projected results.These
risks and uncertainties include, without limitation, acceptance by customers
of the FOX and WaferPak contactor technologies, acceptance by customers of the
WaferPak contactors shipped upon receipt of a purchase order and the ability
of new products to meet customer needs or perform as described.See Aehr
Test's recent 10-K, 10-Q and other reports from time to time filed with the
Securities and Exchange Commission for a more detailed description of the
risks facing our business.Aehr Test disclaims any obligation to update
information contained in any forward-looking statement to reflect events or
circumstances occurring after the date of this press release.

CONTACT: Aehr Test Systems
         Carl Buck
         V.P. of Marketing
         (510) 623-9400 x381
         Financial Relations Board
         Marilynn Meek
         Analyst/Investor Contact
         (212) 827-3773
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