CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC

 CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES
           2014 with Range of Platform IP Solutions for SoC Design

Technologies on display include comprehensive solutions for advanced
computational photography and embedded vision, Bluetooth and Wi-Fi
connectivity, low-power audio offloading and 'always-on' voice activation, all
optimized for power, cost and performance

PR Newswire

MOUNTAIN VIEW, Calif., Dec. 5, 2013

MOUNTAIN VIEW, Calif., Dec. 5, 2013 /PRNewswire/ --CEVA, Inc. (NASDAQ: CEVA),
the leading licensor of silicon intellectual property (SIP) platform solutions
and DSP cores, today announced that it will showcase a range of comprehensive
platform IP solutions at CES 2014 designed to enable the next technology
trends in the mobile, digital home and automotive markets. At the show, taking
place in Las Vegas from January 7-10^th, CEVA will host a private meeting
suite in the Las Vegas Hotel where invitees can interact with the
demonstrations and meet with CEVA engineers, partners and members of the
executive team. 

(Logo: http://photos.prnewswire.com/prnh/20120808/SF53702LOGO)

CEVA's platform IP solutions allow customers to simplify their SoC design
effort and significantly reduce both the power consumption and cost of
implementing the most advanced technology requirements across a broad range of
end markets. These solutions include:

  oThe industry's most advanced and lowest power computational photography
    and embedded vision platform IP designed to enable true product
    differentiation to any camera-enabled device, including all-in-focus
    imaging, smart zoom, multi-exposure, object recognition, gesture
    recognition, image stabilization and much more.
  oThe industry's first universal communications platform IP, addressing LTE,
    LTE-Advanced, Wi-Fi, satellite communications, DTV demodulation, wired
    access and much more. The platform is scalable to meet any design
    requirements, from the Internet of Things (IoT) through smartphones and
    tablets to Wi-Fi access points and base stations.
  oThe industry's lowest power platform IP for advanced voice and audio
    applications, offering extended battery life and enhanced feature sets
    such as always-listening voice trigger, noise reduction, speaker
    protection, and high-resolution audio.

To request a meeting with CEVA at CES and view the latest advancements in
high-performance DSPs and platform IPs, please email events@ceva-dsp.com or
contact your local CEVA sales office.

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP)
DSP cores and platform solutions for the mobile, portable and consumer
electronics markets. CEVA's IP portfolio includes comprehensive technologies
for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD
audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA
(SATA). In 2012, CEVA's IP was shipped in over 1.1 billion devices, powering
smartphones from many of the world's leading OEMs, including HTC, Huawei, LG,
Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets
shipped worldwide are powered by a CEVA DSP core. For more information, visit
www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.


Website: http://www.ceva-dsp.com
Contact: CEVA, Richard Kingston, CEVA, Inc., 650-417-7976,
richard.kingston@ceva-dsp.com; or Mike Sottak, Wired Island, Ltd.,
408-876-4418, mike@wiredislandpr.com
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