Axcelis Introduces Next Generation Purion H™ High Current Implanter

     Axcelis Introduces Next Generation Purion H™ High Current Implanter

Industry's Most Powerful Platform Delivers Unmatched Purity, Precision and
Productivity for the 16nm Era and Beyond

PR Newswire

BEVERLY, Mass., Dec. 3, 2013

BEVERLY, Mass., Dec. 3, 2013 /PRNewswire/ --Axcelis Technologies, Inc.
(Nasdaq: ACLS) today announced the introduction of the Purion H next
generation, single wafer high current implanter, the third member of its
innovative Purion platform. With the addition of the Purion H, the Purion
Platform now provides chipmakers with a full common platform of the industry's
most advanced implant solutions to optimize device performance and enable high
yield manufacture of sub 16nm planar and 3-D devices.

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The Purion H ushers in a revolutionary new era of high performing implant
technology, elevating what customers will come to expect from high current
implanters. A few of its many new and innovative features include:

  oNext generation scanned spot beam technology with precision implant angle
    and dose control to enhance device performance and yield.
  oEnabling process control technology to minimize all forms of contaminants
    to ensure absolute beam purity.
  oCommon Purion cross-platform architecture designed to drive manufacturing
    flexibility and lower the total cost of fab operations.

Bill Bintz, executive vice president of product development, engineering and
marketing said, "The Purion H is a modern high current implanter that
incorporates enhanced spot beam technology, and is designed to provide
customers with an unprecedented level of process flexibility to support the
manufacturing challenges of the industry's next generation devices, planar or
three dimensional. Due to its unique design, its enabling process control, and
Purion platform commonality, we expect the Purion H will become the industry
standard in high current, single wafer implant."

The Purion Platform
The Purion platform is redefining implanter technology and performance, with
each product setting a new benchmark in its respective market. The powerful
common platform enables the efficient production of all existing and emerging
implant applications across the medium current, high current and high energy
space. The scanned spot beam architecture used on all Purion products assures
that customers can take full advantage of all current and future advanced
process enabling implants, including materials modification techniques
required in leading edge device processes. All Purion implanters incorporate
Axcelis' industry leading contamination defense system, for unsurpassed
implant quality, so even the most sensitive devices can realize optimized
device performance. The common platform's proprietary dose and angle control
system, and constant focal length scanning deliver the most precise and
repeatable dopant placement available today. The Purion platform includes the
Purion M™ medium current implanter, the Purion H™ high current implanter, and
the Purion XE™ high energy implanter.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe
harbor provisions. These statements, which include our expectations for market
acceptance of our Purion H ion implanter, are based on management's current
expectations and should be viewed with caution. They are subject to various
risks and uncertainties, many of which are outside the control of the Company,
including the timing of orders and shipments, the continuing demand for
semiconductor equipment, relative market growth, continuity of business
relationships with and purchases by major customers, competitive pressure on
sales and pricing, increases in material and other production costs that
cannot be recouped in product pricing and global economic, political and
financial conditions. These risks and other risk factors relating to Axcelis
are described more fully in the most recent Form 10-K filed by Axcelis and in
other documents filed from time to time with the Securities and Exchange

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing
innovative, high-productivity solutions for the semiconductor industry for
over 35 years. Axcelis is dedicated to developing enabling process
applications through the design, manufacture and complete life cycle support
of ion implantation systems, one of the most critical and enabling steps in
the IC manufacturing process. Learn more about Axcelis at

Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552

SOURCE Axcelis Technologies, Inc.

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