Soitec and SunEdison Enter Into Patent License Agreement
BERNIN (GRENOBLE), France and ST. PETERS, Mo., Nov. 26, 2013
BERNIN (GRENOBLE), France and ST. PETERS, Mo., Nov. 26, 2013 /PRNewswire/ --
Soitec (Euronext) and SunEdison, Inc. (NYSE: SUNE) announced today that they
have entered into a patent cross-license agreement relating to
silicon-on-insulator (SOI) wafer products. The agreement provides each
company with access to the other's patent portfolio for SOI technologies and
ends all outstanding legal disputes between the companies.
"This agreement represents a key milestone in the continuing development of a
strong supply chain in the SOI ecosystem," said Christophe Maleville, Senior
Vice President of Digital Electronics Division of Soitec. It also demonstrates
the key role of SOI substrate technology for the current and future CMOS
"SunEdison has been a leading silicon substrate innovator for over 50 years
with a strong patent portfolio," added Horacio Mendez, Vice President of
Semiconductor Advanced Solutions, SunEdison. "This cooperation adds to
SunEdison's current SOI product capability and enhances the ability of both
companies to provide more compelling SOI solutions to our customers."
This agreement provides access to a portfolio of patents from both companies
and covers the manufacturing of existing engineered unpatterned
handle-substrates such as partially depleted SOI (PD-SOI), fully depleted SOI
(FD-SOI) and radio-frequency SOI (RF-SOI) as well as advanced FinFETs.
In addition to the current technologies covered by the agreement, including
applications beyond the 10 nm node, Soitec and SunEdison have agreed to grant
each other the right to use their respective wholly owned patents for research
and development purposes. This will allow the companies to develop products in
which the device layer is made of a semiconductor material other than plain,
non-strained silicon, such as a silicon-germanium compound, germanium or III-V
materials. These advanced semiconductor materials enable the fabrication of
high-mobility channels for advanced generation digital applications.
Additional conditions of the agreement have not been disclosed.
About Soitec: Soitec is an international manufacturing company, a world leader
in generating and manufacturing revolutionary semiconductor materials at the
frontier of the most exciting energy and electronic challenges. Soitec's
products include substrates for microelectronics (most notably SOI:
Silicon-on-Insulator) and concentrator photovoltaic systems (CPV). The
company's core technologies are Smart Cut™, Smart Stacking™ and Concentrix™,
as well as expertise in epitaxy. Applications include consumer and mobile
electronics, microelectronics-driven IT, telecommunications, automotive
electronics, lighting products and large-scale solar power plants. Soitec has
manufacturing plants and R&D centers in France, Singapore, Germany and the
United States. For more information, visit: www.soitec.com.
SunEdison is a global leader in semiconductor and solar technology.
SunEdison's semiconductor business has been a pioneer in the design and
development of silicon wafer technologies for over 50 years. With R&D and
manufacturing facilities in the U.S., Europe and Asia, SunEdison enables the
next generation of high performance semiconductor devices. SunEdison's solar
business develops, finances, installs and operates distributed power plants,
delivering fully managed, predictably priced solar energy services for its
commercial, government and utility customers. SunEdison's common stock is
listed on the New York Stock Exchange under the symbol "SUNE." For more
information, visit: www.sunedisonsilicon.com.
SOURCE SunEdison, Inc.
Contact: Media Contacts (trade press), Camille Darnaud-Dufour, Soitec, +33
(0)6 79 49 51 43 , firstname.lastname@example.org, (business press) Marylen
Schmidt, Soitec, +33 (0) 4 76 92 87 83, email@example.com, or Bill
Michalek, SunEdison, (636) 474-5443; Investor Relations, Olivier Brice,
Soitec, +33 (0)4 76 92 93 80, firstname.lastname@example.org or Chris Chaney,
SunEdison, (636) 474-5226
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