Aehr Test Systems Announces Upcoming Investor Event

Aehr Test Systems Announces Upcoming Investor Event

FREMONT, Calif., Nov. 18, 2013 (GLOBE NEWSWIRE) -- Aehr Test Systems
(Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in
equipment, today announced that the Company's President and CEO, Gayn
Erickson, is scheduled to participate in the following investor event:

2nd Annual Midtown CAP Summit
Marriott Marquis, New York, NY
December 11, 2013

About the Midtown CAP Summit

The Midtown CAP Summit is hosted by executive management from the following
participating companies: Aehr Test Systems (AEHR), Axcelis, Brooks Automation,
Camtek, Cascade Micro, Cohu, Electro Scientific, Entegris, FormFactor, inTEST,
Intevac, LTX-Credence, Mattson Technology, Nanometrics, Nova Measuring,
Rudolph Technologies, Tessera, Ultra Clean Technology, Ultratech and Veeco
Instruments, and will feature a "round-robin" format consisting of a series of
small group meetings.

The Midtown CAP Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please RSVP
early. Hosts reserve the right to limit attendance as necessary. Last day for
registration is November 30. To RSVP for the Midtown CAP Summit, please
contact the event's co-chairs:

Laura J. Guerrant-Oiye          Claire E. McAdams
Guerrant Associates             Headgate Partners LLC
Phone:(808) 882-1467          Phone: (530) 265-9899 Email:

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a worldwide
provider of test systems for burning-in and testing logic and memory
integrated circuits and has an installed base of more than 2,500 systems
worldwide. Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test requirements,
capacity needs and opportunities for Aehr Test products in package and wafer
level test. Aehr Test has developed and introduced several innovative
products, including the ABTS^TM and FOX^TM families of test and burn-in
systems and the DiePakĀ® carrier. The ABTS system is used in production and
qualification testing of packaged parts for both low-power and high-power
logic as well as all common types of memory devices. The FOX system is a full
wafer contact test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is
a reusable, temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of bare die. For more information,
please visit the Company's website at

CONTACT: Gary Larson
         Chief Financial Officer
         (510) 623-9400 x321
Press spacebar to pause and continue. Press esc to stop.