ams Schedules Multi-Project Wafer Starts for Analog Foundry Customers in 2014

  ams Schedules Multi-Project Wafer Starts for Analog Foundry Customers in

Multi-project prototyping service offers large cost savings as manufacturing
costs are shared between multiple users

Business Wire

UNTERPREMSTAETTEN, Austria -- November 13, 2013

The Full Service Foundry business unit of ams AG (SIX: AMS) today announced
its fast and cost-efficient IC prototyping service, known as Multi-Project
Wafer (MPW) or shuttle run, with an updated schedule in 2014. The prototyping
service, which combines several designs from different customers onto a single
wafer, offers significant cost advantages for foundry customers as the costs
for wafers and masks are shared among a number of different shuttle

ams’ best in class MPW service includes the whole range of 0.18µm and 0.35µm
specialty processes. In order to provide leading analog semiconductor process
technologies, manufacturing and services, ams offers four MPW runs in 0.18µm
CMOS (C18) process as well as four MPW runs in its advanced 0.18µm
High-Voltage CMOS (H18) technology. The H18 process technology is based on
IBM’s industry-proven 0.18µm CMOS process CMOS7RF and offers industry-first RF
(Radio Frequency) integration and high density SoC (System on a Chip)
capability. It is perfectly suited for applications such as smart sensors,
sensor interface devices, smart meters, industrial and building controls, and
LED lighting control in the automotive, industrial and medical markets.

For the 0.35µm specialty processes, which are based on the 0.35µm CMOS process
transferred from TSMC (Taiwan Semiconductor Manufacturing Company), a total of
14 runs are offered in 2014: ams' 0.35µm High-Voltage CMOS process family with
a 20V CMOS option, which is ideally suited for power management products and
display drivers; a 50V CMOS option, which has been optimized for automotive
and industrial applications; and a 120V module, which meets the requirements
of sensor and sensor interface chips in high-voltage applications. The
advanced High-Voltage CMOS process with Embedded Flash functionality adds to
ams’ MPW service portfolio. The CMOS compatible 0.35µm SiGe-BiCMOS technology
S35 enables RF circuit designs with an operating frequency of up to 7 GHz
combined with high-density digital parts on one single ASIC.

Overall, ams will offer almost 150 MPW start dates in 2014, enabled by long
lasting co-operations with partner organizations such as CMP-TIMA,
Europractice, Fraunhofer IIS and Mosis. Japanese customers may also
participate via our local MPW program partners Toppan Technical Design Center
Co., Ltd (TDC) and Dai Nippon LSI Design Co, Ltd.

The complete schedule for 2014 has now been released and detailed start dates
per process are available on the web at

To take advantage of the MPW service, ams’ foundry customers deliver their
completed GDSII-data on specific dates and receive untested packaged samples
or dies within a short lead-time of typically 8 weeks for CMOS and 12 weeks
for High-Voltage CMOS, SiGe-BiCMOS and Embedded Flash processes.

All process technologies are supported by the well-known hitkit, the ams
industry benchmark process design kit based on Cadence, Mentor Graphics or
Agilent ADS design environments. The hitkit comes complete with fully
silicon-qualified standard cells, periphery cells and general purpose analog
cells such as comparators, operational amplifiers, low power A/D and D/A
converters. Custom analog and RF devices, physical verification rule sets for
Assura and Calibre, as well as precisely characterized circuit simulation
models, enable rapid design starts of complex high performance mixed-signal
ICs. In addition to standard prototype services, ams also offers advanced
analog IP blocks, a memory (RAM/ROM) generation service and packaging services
in ceramic or plastic.

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ams AG
Patricia Moosburger
Media Relations
phone: +43 (0) 3136 500 31235
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