DGAP-News: Micron's Hybrid Memory Cube Earns High Praise in Next-Generation Supercomputer

DGAP-News: Micron's Hybrid Memory Cube Earns High Praise in Next-Generation 
Supercomputer

Micron Technology, Inc. 

07.11.2013 14:00
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New Micron Device Supports Petascale Supercomputing, Breaks Through the Memory
Wall to Solve Industry's Biggest Supercomputer Challenges 

BOISE, Idaho, 2013-11-07 14:00 CET (GLOBE NEWSWIRE) --
Micron Technology, Inc., (Nasdaq:MU) announced today it is planning to adapt
its Hybrid Memory Cube (HMC) for petascale supercomputer systems, representing
a dramatic step forward in memory technology. HMC is designed for applications
requiring low-energy, high-bandwidth access to memory, which is the most
important requirement for supercomputers. Other applications include data
packet processing, data packet buffering or storage, and processor
acceleration. 

Micron and Fujitsu, a global leader in supercomputing, will each exhibit a
display board that features HMC devices in Fujitsu's next-generation
supercomputer prototype at the Supercomputing '13 Conference in Denver,
November 19-21. 

Supercomputing is an essential technology that enables scientists and engineers
to address complex simulations that drive research and development and enables
them to explore fundamental questions about the organization of our universe.
Addressing topics of this magnitude requires tremendous data movement
capability. Using HMC to unlock the potential of a supercomputer's multicore
processor architecture will enable exceptional performance efficiency. 

'The designers and engineers at Fujitsu saw early on the value of raising their
system to the next level with the help of Hybrid Memory Cubes,' said Brian
Shirley, vice president of Micron's DRAM Solutions Group. 'We anticipate
helping Fujitsu to immediately grow their capabilities for the most advanced
computing challenges.' 

'Our system designers are highly impressed with HMC because it enables new
memory system designs that support our increased demand for bandwidth,
super-compact form factor, and optimized energy per bit,' said Yuji Oinaga,
head of Fujitsu's Next Generation Technical Computing Unit. 'For optimal
performance efficiency of the application software, it is essential to improve
the B(Bytes)/F(Flops) ratio, and HMC represents the new standard in memory
performance for supercomputing.' 

An industry breakthrough, HMC uses advanced through-silicon vias
(TSVs)--vertical conduits that electrically connect a stack of individual
chips--to combine high-performance logic with Micron's state-of-the-art DRAM.
Micron's HMC delivers an unprecedented 160 GB/s of memory bandwidth while using
up to 70 percent less energy per bit than existing technologies, which
dramatically lowers customers' total cost of ownership (TCO). 

HMC has been recognized by industry leaders and influencers as the long-awaited
answer to the growing gap between the performance improvement rate of DRAM and
processor data consumption rates. Micron's HMC was recently named Memory
Product of the Year by leading electronics publications, EDN and EE Times. 

Micron expects volume production of both the 2GB and 4GB HMC devices later in
2014. 

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR Flash memory, as well as other
innovative memory technologies, packaging solutions, and semiconductor systems,
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron's common stock is traded on the NASDAQ under the MU symbol. To
learn more about Micron Technology, Inc., visit www.micron.com. 

(c)2013 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice.  Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners. This news release contains forward-looking statements
regarding the sample availability and volume production of Hybrid Memory Cube.
Actual events or results may differ materially from those contained in the
forward-looking statements. Please refer to the documents Micron files on a
consolidated basis from time to time with the Securities and Exchange
Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These
documents contain and identify important factors that could cause the actual
results for Micron on a consolidated basis to differ materially from those
contained in our forward-looking statements (see Certain Factors). Although we
believe that the expectations reflected in the forward-looking statements are
reasonable, we cannot guarantee future results, levels of activity, performance
or achievements. 


         CONTACT: Micron Media Contact:
         Scott Stevens
         +1-512-288-4050
         sstevens@micron.com
News Source: NASDAQ OMX



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Language:     English
Company:      Micron Technology, Inc.
              
               
              United States
Phone:        
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ISIN:         US5951121038
WKN:          
 
End of Announcement                             DGAP News-Service
 
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