ASE Announces Joint Development and Production Collaboration with Infineon for Assembly of Automotive Products

  ASE Announces Joint Development and Production Collaboration with Infineon
  for Assembly of Automotive Products

Business Wire

TAIPEI, Taiwan -- November 7, 2013

Advanced Semiconductor Engineering, Inc (ASE, NYSE: ASX, TAIEX: 2311)
announced today a joint development and production agreement for assembly
services of automotive products with Infineon Technologies AG (FSE: IFX /
OTCQX: IFNNY). The collaboration will focus on enabling copper wire bonding
for QFP packages in automotive microcontrollers and manufacturing.

“Enabling copper wire bonding for QFP packages in microcontrollers will
further enhance our competitive strength in the automotive market,” said Peter
Schaefer, VP and GM of the Automotive Microcontroller business unit at
Infineon Technologies. “We trust in ASE with their strong manufacturing
background to fulfill the stringent automotive market quality requirements and
build on the long existing partnership to enlarge our current QFP portfolio
for future microcontrollers.”

One of the major drivers in the semiconductor industry’s use of copper was the
rising cost of gold. Copper wire bonding has made IC assembly more competitive
in terms of cost. Copper also has excellent performance in thermal and
electrical conductivity. The ASE Group has been a forerunner in copper wire
bonding assembly manufacturing services since 2008 and has shipped more than
25 billion units of copper wire IC packages to date.

“This announcement marks another milestone in ASE’s technology roadmap. The
use of copper wire bonding in packages for the automotive market requires
adherence to a higher threshold of quality assurance standards,” said Dr Tien
Wu, COO of the ASE Group. “Our collaboration with Infineon will enable ASE to
learn and adopt world class standards from a leading automotive semiconductor

About ASE Group

The ASE Group is the world's largest provider of independent semiconductor
manufacturing services in assembly, test, materials and design manufacturing.
As a global leader geared towards meeting the industry’s ever growing needs
for faster, smaller and higher performance chips, the Group develops and
offers a wide portfolio of technology and solutions including IC test program
design, front-end engineering test, wafer probe, wafer bump, substrate design
and supply, wafer level package, flip chip, system-in-package, final test and
electronic manufacturing services through Universal Scientific Industrial Co
Ltd, a member of the ASE Group. The Group generated sales revenues of US$6.5
billion in 2012 and employs over 57,000 people worldwide. For more information
about the ASE Group, visit


ASE Group
Patricia MacLeod, +1-408-986-6572
Asia Pacific
Jennifer Yuen, +65-6631-4499
Charles Chiu, +43-664-1411201
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