BeSang and SK Hynix Sign Patent License Agreement
BEAVERTON, Ore., Oct. 29, 2013
BEAVERTON,Ore., Oct. 29, 2013 /PRNewswire/ -- BeSang Inc., the pioneer in
TRUE 3D^TM IC solutions, announced today it has signed a patent license
agreement with SK hynix Inc. This license agreement covers the use of BeSang's
patented innovations to be implemented in a broad range of 3D IC products
offered by SK hynix Inc.
"SK hynix is a top global semiconductor industry leader. Therefore, SK hynix
is an important customer and this agreement validates the strength of BeSang's
TRUE 3D^TM IC solutions," said Dr. Sang-Yun Lee, CEO of BeSang Inc. "We look
forward to the opportunity to expand our customer relationships beyond patent
license agreements to showcase our technical contributions and know-how with
BeSang's TRUE 3D^TM IC technology enables vertical stacking of multiple device
layers, and offerslow cost and high-performance solutions to CPU, DSP, GPU,
ASIC, FPGA, SoC, DRAM,SRAM, flash, image sensor, and SSD applications. BeSang
has successfully demonstrated its disruptive TRUE 3D^TM IC technologies in
About BeSang Inc.
BeSang is a pioneer in the design, development, and delivery of unsurpassed
three-dimensional (3D) IC solutions, providing unmatched process and design
technologies for TRUE 3D^TM IC as well as technology licenses to customers.
BeSang provides high-value intellectualproperties related to its proprietary
TRUE 3D^TM ICs. The fabless semiconductor company is headquartered in
Beaverton,Oregon, USA. Additional information is available at www.besang.com.
SOURCE BeSang Inc.
Contact: GT Kim, email@example.com, 503-567-7301
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