Triton Microtechnologies Receives Funding to Ramp up Manufacturing of Glass Interposers for Next-Generation Semiconductor

  Triton Microtechnologies Receives Funding to Ramp up Manufacturing of Glass
  Interposers for Next-Generation Semiconductor Packaging

Company Invests $3.2 Million in U.S. Manufacturing Facility to Address Gap in
                     Semiconductor Industry Supply Chain

Business Wire

ORO VALLEY, Ariz. -- October 28, 2013

Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin
glass interposers that enable advanced semiconductor-packaging solutions, has
met six-month production milestones that have triggered an additional $3.2
million in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo
and nMode Solutions Inc. in Oro Valley, Arizona. Triton will invest the
capital to further develop and equip its established manufacturing facility in
Carlsbad, California, where the company is producing its through-glass-via
(TGV) interposers for high-density ICs.

“We are using this new funding to address a critical gap in the supply chain
for semiconductor packaging,” said Tim Mobley, CEO of Triton. “To this point,
glass interposers have not been readily available, but with silicon
interposers now nearing their performance limits, Triton is leveraging its TGV
technology to provide the global semiconductor industry with smaller, more
efficient and more cost-effective packaging solutions for next-generation
ICs.”

Founded in December 2012, Triton combines nMode’s interposer technology with
AGC’s glass technology and via-hole drilling techniques to produce
2.5-dimensional (2.5D) and three-dimensional (3D) TGV interposers. These
products, capable of forming thousands of electrical connections between a
silicon chip and a printed circuit board, are needed to create advanced,
high-density semiconductor devices in the smallest form factors.

Triton’s manufacturing facility in Carlsbad, California, employs a highly
efficient, continuous process capable of producing ultra-thin TGV interposers
in high volumes at low cost. High-aspect-ratio via holes are drilled through
glass substrates, then filled with a thermally stable copper paste to form
high-quality interconnects within the glass wafers. Triton makes interposers
with via-hole diameters from 70 microns to 150 microns and thicknesses of 0.7
mm and below. The company also designs and produces customized solutions to
meet customers’ specific applications.

About Triton Microtechnologies

Triton Microtechnologies is a leading designer and manufacturer of
high-performance 2.5D and 3D through-glass-via interposers, which allow
semiconductor manufacturers to fit more components into smaller package areas
to produce advanced, high-density integrated circuits. The company’s
proprietary technology offers faster cycle times, known-good-die (KGD) testing
at higher packaging integration levels and the lowest cost per unit in the
marketplace. For more information, visit www.tritonmicrotech.com.

Contact:

Triton Microtechnologies
Tim Mobley, 520-209-1556
CEO
or
PR contact:
Bruce Hokanson, 360-258-1260
brucehokanson@comcast.net
 
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