STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis Dublin, Oct. 21, 2013 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis" report to their offering. System Plus Consulting is proud to publish the reverse costing report of the new 9-DOF IMU supplied by STMicroelectronics. The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope, a 3-axis accelerometer and a 3-axismagnetometer. ST achieves to obtain this package footprint by combining the 3-axis gyroscope and the 3-axis accelerometer function on the same die. This new structure, combined with an Au-Au hermetic bonding process allow ST's to shrink the 6-axis function by more than 35%. The LSM333D is targeted for portable applications: indoor navigation, smart user interface, advanced gesture recognition, gaming and virtual reality input device It provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic field). This report provides complete teardown of the 9-Axis IMU with: *Detailed photos *Material analysis *Schematic assembly description *Manufacturing Process Flow *In-depth economical analysis *Manufacturing cost breakdown *Selling price estimation Key Topics Covered: Overview / Introduction Executive Summary Reverse Costing Methodology Companies Profile Physical Analysis *Package X-Ray *Package Opening *Package Cross-Section *ASICs Dimensions *ASICs Delayering *ASICs Cross-Section *MEMS Gyro/Accelero Dimensions *MEMS Gyro/Accelero Cap Opening *MEMS Gyro/Accelero Sensing Areas *MEMS Gyro/Accelero Cross-sections *X/Y-Axis Magnetometer Dimensions *X/Y-Axis Magnetometer Delayering *X/Y-Axis Magnetometer Cross-section *Z-Axis Magnetometer Dimensions *Z-Axis Magnetometer Delayering *Z-Axis Magnetometer Cross-section Manufacturing Process Flow *Front-End Manufacturing Process Flows *Description of the Wafers Fabrication Units *Back-End Packaging Process Flow *Back-End Packaging Assembly Unit Cost Analysis *Yields Hypotheses *ASICs Wafer Cost *ASICs Die Cost *MEMS Gyro/Accelero Wafer Cost *MEMS Gyro/Accelero Die Cost *X/Y-Axis Magnetometer Wafer Cost *X/Y-Axis Magnetometer Die Cost *Z-Axis Magnetometer Wafer Cost *Z-Axis Magnetometer Die Cost *Back-End: Packaging Cost *Back-End: Final test & Calibration Cost *LSM333D Component Cost (FE + BE 0 + BE 1) Estimated Price Analysis *Manufacturer Financial Ratios *LSM333D Estimated Selling Price For more information visit http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics Research and Markets Laura Wood, Senior Manager. firstname.lastname@example.org U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 Sector: Telecommunications and Networks Research and Markets logo
STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis
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