STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis

STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis

Dublin, Oct. 21, 2013 (GLOBE NEWSWIRE) -- Research and Markets
(http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics) has
announced the addition of the "STMicroelectronics LSM333D 4x4mm 9-Axis IMU
Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the
new 9-DOF IMU supplied by STMicroelectronics.

The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope, a 3-axis
accelerometer and a 3-axismagnetometer.

ST achieves to obtain this package footprint by combining the 3-axis gyroscope
and the 3-axis accelerometer function on the same die. This new structure,
combined with an Au-Au hermetic bonding process allow ST's to shrink the
6-axis function by more than 35%.

The LSM333D is targeted for portable applications: indoor navigation, smart
user interface, advanced gesture recognition, gaming and virtual reality input
device It provides accurate output across full-scale ranges up to ±2000dps
(rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic
field).

This report provides complete teardown of the 9-Axis IMU with:

  *Detailed photos
  *Material analysis
  *Schematic assembly description
  *Manufacturing Process Flow
  *In-depth economical analysis
  *Manufacturing cost breakdown
  *Selling price estimation

Key Topics Covered:

Overview / Introduction
Executive Summary
Reverse Costing Methodology

Companies Profile

Physical Analysis

  *Package X-Ray
  *Package Opening
  *Package Cross-Section
  *ASICs Dimensions
  *ASICs Delayering
  *ASICs Cross-Section
  *MEMS Gyro/Accelero Dimensions
  *MEMS Gyro/Accelero Cap Opening
  *MEMS Gyro/Accelero Sensing Areas
  *MEMS Gyro/Accelero Cross-sections
  *X/Y-Axis Magnetometer Dimensions
  *X/Y-Axis Magnetometer Delayering
  *X/Y-Axis Magnetometer Cross-section
  *Z-Axis Magnetometer Dimensions
  *Z-Axis Magnetometer Delayering
  *Z-Axis Magnetometer Cross-section

Manufacturing Process Flow

  *Front-End Manufacturing Process Flows
  *Description of the Wafers Fabrication Units
  *Back-End Packaging Process Flow
  *Back-End Packaging Assembly Unit

Cost Analysis

  *Yields Hypotheses
  *ASICs Wafer Cost
  *ASICs Die Cost
  *MEMS Gyro/Accelero Wafer Cost
  *MEMS Gyro/Accelero Die Cost
  *X/Y-Axis Magnetometer Wafer Cost
  *X/Y-Axis Magnetometer Die Cost
  *Z-Axis Magnetometer Wafer Cost
  *Z-Axis Magnetometer Die Cost
  *Back-End: Packaging Cost
  *Back-End: Final test & Calibration Cost
  *LSM333D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

  *Manufacturer Financial Ratios
  *LSM333D Estimated Selling Price

For more information visit
http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks

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