Market Snapshot
  • U.S.
  • Europe
  • Asia
Ticker Volume Price Price Delta
DJIA 16,408.54 -16.31 -0.10%
S&P 500 1,864.85 2.54 0.14%
NASDAQ 4,095.52 9.29 0.23%
Ticker Volume Price Price Delta
STOXX 50 3,155.81 16.55 0.53%
FTSE 100 6,625.25 41.08 0.62%
DAX 9,409.71 91.89 0.99%
Ticker Volume Price Price Delta
NIKKEI 14,516.27 98.74 0.68%
TOPIX 1,173.37 6.78 0.58%
HANG SENG 22,760.24 64.23 0.28%

NXP Delivers First RoadLINK Product


NXP Delivers First RoadLINK Product

First Car-to-X Communications Product, SAF5100, Now Sampling With Major Automotive OEMs and Tier 1 Suppliers

EINDHOVEN, THE NETHERLANDS and TOKYO, JAPAN -- (Marketwired) -- 10/11/13 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that the SAF5100, the first product from the RoadLINK(TM) range, is now available for automotive customer design-in. The SAF5100 is a flexible software-defined radio processor for car-to-car (C2C) and car-to-infrastructure (C2I) communication, helping to realize NXP's vision for a complete C2X (C2C+C2I) solution. Scheduled for mass production in the second half of 2014, the SAF5100 is also the first product to become generally available from the MK4 reference design for connected vehicles, following its unveiling in July by NXP and Cohda Wireless, a leading specialist in wireless communication for automotive safety applications.

The product introduction follows successful C2X field trials worldwide with an earlier version of the SAF5100, such as the simTD trial in Germany; the ongoing Safety Pilot Model Deployment conducted by the University of Michigan Transportation Research Institute (UMTRI) in the US; and the SCORE@F trial in France.

"With proven success in major car-to-X communications trials, our chips have already set important benchmarks in terms of mobility performance and flexibility. By making the SAF5100 chip available for evaluation by major car manufacturers and Tier 1 suppliers, we are now one step closer in realizing the vision of enabling a complete C2X infrastructure -- with the goal of bringing the first C2C and C2I solutions to vehicles from 2015/2016 onwards," said Torsten Lehmann, senior vice president and general manager, car entertainment solutions, NXP Semiconductors. "NXP is committed to connecting the car to reduce CO2 emissions, reduce traffic congestion, avoid accidents, and ultimately save lives."

The SAF5100 processor is fully programmable and can support unique algorithms to improve reception in wireless communication. The SAF5100 can support multiple wireless standards as well as different OEM antenna configurations like 802.11p antenna diversity, providing OEMs with the flexibility to support emerging standards across multiple regions via firmware updates. It also provides best-in-class wireless link performance via the 802.11p firmware from Cohda Wireless, which is a fully integrated part of the solution. With a 12-mm x 12-mm LFBGA package, the SAF5100 has a very small PCB footprint which allows the 802.11p receiver to fit into confined spaces, and significantly reduces bill of materials (BOM) costs. The unique software-defined radio approach allows OEMs to deploy a global C2X solution based on a single hardware platform with end-of-line configurability by firmware download.

NXP's "connected car" technology allows cars to communicate wirelessly with each other and with traffic infrastructure, exchanging data including location, speed and direction. This allows for 360-degree driver awareness to improve road safety by reducing collisions, warning of potential hazards, and avoiding traffics jams. In April, NXP and Cohda Wireless became the first automotive electronics suppliers to join leading car manufacturers in signing the landmark CAR 2 CAR Communication Consortium Memorandum of Understanding (MoU), aimed at implementing harmonized technology for wireless communication between cars, or between cars and infrastructure, in Europe.

Key Features of the SAF5100


 
--  Software-Defined Radio processor for global C2X standards, covering
    Europe, US and Japan
--  Support for different OEM antenna configurations and different
    diversity schemes
--  Best-in-class 802.11p reception performance and communication range
    for mobility use cases even in non-line-of-sight conditions
--  Flexible use case management allowing field updates -- to adapt to
    existing standards as they evolve, and to support new regional
    standards if and when they are introduced
--  AEC-Q100 qualification available in 2014

Links:


 
--  VIDEO: Car-to-X communications: NXP connects the car to the Internet
    of Things: http://youtu.be/LGykjQZoQ4c
--  VIDEO: Connecting the in-car experience: http://youtu.be/CLcnhGb1aHI
--  NXP connects the car: http://www.nxp.com/connected-mobility

About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.36 billion in 2012. Find out more at www.nxp.com.

Forward-looking Statements This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2428425

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2428427

Embedded Video Available: http://www2.marketwire.com/mw/frame_mw?attachid=2428430

Embedded Video Available: http://www2.marketwire.com/mw/frame_mw?attachid=2428431

For further press information, please contact:

NXP Semiconductors

Global/Europe: Eureka Endo +44 795 828 7483 eureka.endo@nxp.com

North America: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Japan: Chie Kyo +81 3 6732 7929 chie.kyo@nxp.com

Greater China: Korie Jiang +86 21 2205 2629 korie.jiang@nxp.com

Sponsored Links
Advertisement
Advertisements
Sponsored Links
Advertisement