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CEATEC JAPAN 2013 – TDK Booth Information

  CEATEC JAPAN 2013 – TDK Booth Information

      Magnetic materials are the core of TDK's next generation solutions

CEATEC JAPAN 2013

Business Wire

TOKYO -- September 30, 2013

TDK Corporation (President: Takehiro Kamigama) announces that it will
participate in the ‘CEATEC JAPAN 2013’ exhibition from October 1st (Tue) to
October 5th (Sat), 2013 at Makuhari Messe.

Image of TDK booth. (Photo: Business Wire)

Image of TDK booth. (Photo: Business Wire)

This year the message from our booth is: 'Magnetic materials are the core of
TDK's next generation solutions'. Our demonstrations will focus on new
products and technologies, categorized into anticipated future growth segments
of 'energy-related markets', and 'next-generation telecommunications markets'.
We encourage you to take this opportunity to drop by the TDK booth this year.

TDK booth overview, including major product and technological exhibits

[Booth Overview]

Following a presentation on the main stage presenting the highlights of this
year's exhibit, which focuses on magnetic products, there will be an
engineer-led product presentation of our key products.

  *‘Energy-related market area
    Our Energy-related market area is comprised of a car-mounted product
    corner, and a smart-grid corner. On display will be a full-scale model car
    loaded with our products and technologies, in addition to exhibits of our
    power conditioning electronic components. In the car-mounted corner you
    will find our 'on-board vehicle DC-DC converter', which boasts twice the
    output power per unit volume compared to existing products while achieving
    the world's leading standard output of 2W/cc. Also on display will be an
    'automotive contact-free power supply system', consisting of a power
    reception coil miniaturized to A4 paper size.
    The smart-grid corner showcases a high-efficiency 'isolated bi-directional
    DC-DC converter' that enables seamless step-up or step-down functionality
    with one converter.

  *‘Next-generation telecommunications market area
    The ‘Next-generation telecommunications market area is comprised of a
    data-center corner and a smartphone corner. This area features live
    demonstrations of solutions that contribute to the further evolution of
    next-gen telecommunications.
    An explosive increase of information volume has accompanied the growth of
    cloud computing. In the data-center corner you will find 'thermally
    assisted heads' for high density recording, which will make HDD high
    capacity storage achievable. The smartphone corner showcases compact,
    thin-film passive components, as well as the industry’s thinnest flexible
    and impact-resistant 'Qi standards-compliant contact-free power supply
    coil unit'.

Photos/Multimedia Gallery Available:
http://www.businesswire.com/multimedia/home/20130930005506/en/

Multimedia
Available:http://www.businesswire.com/cgi-bin/mmg.cgi?eid=50716934&lang=en

Contact:

TDK Corporation
Yoichi Osuga / Mari Konishi, +81-3-6852-7102
pr@jp.tdk.com
 
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