CEATEC JAPAN 2013 – TDK Booth Information Magnetic materials are the core of TDK's next generation solutions CEATEC JAPAN 2013 Business Wire TOKYO -- September 30, 2013 TDK Corporation (President: Takehiro Kamigama) announces that it will participate in the ‘CEATEC JAPAN 2013’ exhibition from October 1st (Tue) to October 5th (Sat), 2013 at Makuhari Messe. Image of TDK booth. (Photo: Business Wire) Image of TDK booth. (Photo: Business Wire) This year the message from our booth is: 'Magnetic materials are the core of TDK's next generation solutions'. Our demonstrations will focus on new products and technologies, categorized into anticipated future growth segments of 'energy-related markets', and 'next-generation telecommunications markets'. We encourage you to take this opportunity to drop by the TDK booth this year. TDK booth overview, including major product and technological exhibits [Booth Overview] Following a presentation on the main stage presenting the highlights of this year's exhibit, which focuses on magnetic products, there will be an engineer-led product presentation of our key products. *‘Energy-related market area Our Energy-related market area is comprised of a car-mounted product corner, and a smart-grid corner. On display will be a full-scale model car loaded with our products and technologies, in addition to exhibits of our power conditioning electronic components. In the car-mounted corner you will find our 'on-board vehicle DC-DC converter', which boasts twice the output power per unit volume compared to existing products while achieving the world's leading standard output of 2W/cc. Also on display will be an 'automotive contact-free power supply system', consisting of a power reception coil miniaturized to A4 paper size. The smart-grid corner showcases a high-efficiency 'isolated bi-directional DC-DC converter' that enables seamless step-up or step-down functionality with one converter. *‘Next-generation telecommunications market area The ‘Next-generation telecommunications market area is comprised of a data-center corner and a smartphone corner. This area features live demonstrations of solutions that contribute to the further evolution of next-gen telecommunications. An explosive increase of information volume has accompanied the growth of cloud computing. In the data-center corner you will find 'thermally assisted heads' for high density recording, which will make HDD high capacity storage achievable. The smartphone corner showcases compact, thin-film passive components, as well as the industry’s thinnest flexible and impact-resistant 'Qi standards-compliant contact-free power supply coil unit'. Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20130930005506/en/ Multimedia Available:http://www.businesswire.com/cgi-bin/mmg.cgi?eid=50716934&lang=en Contact: TDK Corporation Yoichi Osuga / Mari Konishi, +81-3-6852-7102 email@example.com
CEATEC JAPAN 2013 – TDK Booth Information
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