DGAP-News: Micron Technology Ships First Samples of Hybrid Memory Cube

DGAP-News: Micron Technology Ships First Samples of Hybrid Memory Cube

Micron Technology, Inc. 

25.09.2013 14:00

Volume Production Planned for 2014

BOISE, Idaho, 2013-09-25 14:00 CEST (GLOBE NEWSWIRE) --
Micron Technology, Inc. (Nasdaq:MU), announced today that it is shipping 2GB
Hybrid Memory Cube (HMC) engineering samples. HMC represents a dramatic step
forward in memory technology, and these engineering samples are the world's
first HMC devices to be shared broadly with lead customers. HMC is designed for
applications requiring high-bandwidth access to memory, including data packet
processing, data packet buffering or storage, and computing applications such
as processor accelerators. Micron expects future generations of HMC to migrate
to consumer applications within three to five years. 

A photo accompanying this release is available at

An industry breakthrough, HMC uses advanced through-silicon vias
(TSVs)--vertical conduits that electrically connect a stack of individual
chips--to combine high-performance logic with Micron's state-of-the-art DRAM.
Micron's HMC features a 2GB memory cube that is composed of a stack of four 4Gb
DRAM die. The solution provides an unprecedented 160 GB/s of memory bandwidth
while using up to 70 percent less energy per bit than existing technologies,
which dramatically lowers customers' total cost of ownership (TCO). 

'The Hybrid Memory Cube is a smart fix that breaks with the industry's past
approaches and opens up new possibilities,' said Jim Handy, a memory analyst at
Objective Analysis. 'Although DRAM internal bandwidth has been increasing
exponentially, along with logic's thirst for data, current options offer
limited processor-to-memory bandwidth and consume significant power. HMC is an
exciting alternative.' 

HMC's abstracted memory enables designers to devote more time to leveraging
HMC's revolutionary features and performance and less time to navigating the
multitude of memory parameters required to implement basic functions. It also
manages error correction, resiliency, refresh, and other parameters exacerbated
by memory process variation. 

 'System designers are looking for new memory system designs to support
increased demand for bandwidth, density, and power efficiency,' said Brian
Shirley, vice president of Micron's DRAM Solutions Group. 'HMC represents the
new standard in memory performance; it's the breakthrough our customers have
been waiting for.' 

HMC has been recognized by industry leaders and influencers as the long-awaited
answer to the growing gap between the performance improvement rate of DRAM and
processor data consumption rates. Micron's HMC was recently named Memory
Product of the Year by leading electronics publications, EDN and EE Times. 

Micron expects 4GB HMC engineering samples to be available in early 2014 with
volume production of both the 2GB and 4GB HMC devices beginning later in 2014. 

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR Flash memory, as well as other
innovative memory technologies, packaging solutions, and semiconductor systems,
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron's common stock is traded on the NASDAQ under the MU symbol. To
learn more about Micron Technology, Inc., visit www.micron.com. 

(c)2013 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners. This news release contains forward-looking statements
regarding the sample availability and volume production of Hybrid Memory Cube.
Actual events or results may differ materially from those contained in the
forward-looking statements. Please refer to the documents Micron files on a
consolidated basis from time to time with the Securities and Exchange
Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These
documents contain and identify important factors that could cause the actual
results for Micron on a consolidated basis to differ materially from those
contained in our forward-looking statements (see Certain Factors). Although we
believe that the expectations reflected in the forward-looking statements are
reasonable, we cannot guarantee future results, levels of activity, performance
or achievements. 

The photo is also available via AP PhotoExpress.

         CONTACT: Micron Media Contact:
         Scott Stevens
         Micron Technology, Inc.
News Source: NASDAQ OMX

25.09.2013 Dissemination of a Corporate News, transmitted by DGAP - 
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Language:     English
Company:      Micron Technology, Inc.
              United States
ISIN:         US5951121038
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