Rudolph to Participate in the Credit Suisse 4th Annual Small & Mid Cap
Credit Suisse Small & Mid Cap Conference 2013
FLANDERS, N.J. -- September 16, 2013
Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s
management will participate in the Credit Suisse 4th Annual Small & Mid Cap
Conference September 18, 2013 in New York City, New York.
Paul McLaughlin, Chairman and CEO will provide an overview of the Company and
will discuss its competitive position and future prospects.
For more information about the conference or to schedule a one-on-one meeting
with Rudolph Technologies’ management, please contact your Credit Suisse
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.
For Rudolph Technologies, Inc.
Laura Guerrant-Oiye, 808-882-1467
Amy Pauling, 952-259-1794
Press spacebar to pause and continue. Press esc to stop.