OIF To Showcase Record Number of Interoperability Demonstrations at ECOC 2013

  OIF To Showcase Record Number of Interoperability Demonstrations at ECOC
  2013

   Wide Range of Technologies Support Next-Gen 100G and 400G Architectures

ECOC 2013

Business Wire

FREMONT, Calif. -- September 11, 2013

The Optical Internetworking Forum will host a record number of multi-vendor
interoperability demonstrations at ECOC 2013 in London, September 23-25 at the
OIF Booth #360. Addressing a wide range of technologies that support 100G and
400G architectures, 11 companies will verify the interoperability of their
products in nine separate and diverse demonstrations. The demonstrations will
illustrate the feasibility of building and implementing next-generation 100G
and 400G capabilities into products today.

OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures
addresses a variety of OIF supported technologies including: CEI-28G-VSR
chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors,
CEI-25G-LR backplane applications, module thermal specifications, and SerDes
interconnect solutions.

“The OIF has defined a robust 25G channel technology that the industry is now
adopting for 25G, 50G, 100G and 400G applications,” said Ed Frlan of Semtech
and the OIF Physical and Link Layer Interoperability Working Group chair. “By
showing that the technology interoperates with multiple vendors in hardware
that is available today, the industry can now leverage the investments made in
25G technology for future 100G and 400G applications.”

The following companies are participating in the OIF Interoperability 2013:
Amphenol, Applied Micro, Cisco, Finisar, Fujitsu Optical Components, Inphi,
Molex, MoSys, Semtech, TE Connectivity, and Xilinx. Technologies demonstrated
during the testing include host ICs with VSR SerDes capability, host PCB
traces, optical module connectors, high-speed electrical I/O and backplane
connectors, module retimers, heat sinks and optical transceivers all operating
with 28G electrical interfaces. Agilent Technologies Inc. and Tektronix, Inc.
will supply test equipment used in the demonstration.

OIF Leadership to Speak at ECOC 2013

OIF leadership has been invited to speak to ECOC attendees on OIF activities
and work efforts. Both presentations will take place in the Market Focus
Theater on the show floor.

• “Evolution of System Electrical Interfaces Towards 400G Transport”

Monday, September 23^rd at 1:55 – 2:25 pm

Ed Frlan, Semtech, and the OIF PLL Interoperability Working Group chair

Nathan Tracy, TE Connectivity and the OIF Technical Committee vice chair

• “Requirements and Technologies for Transport SDN”

Tuesday, Sept. 24^th at 1:15 – 1:45 pm

Vishnu Shukla, Verizon, and the OIF president

Hans-Martin Foisel, Deutsche Telekom, and the OIF Carrier Working Group chair
and board member

About the OIF

Launched in 1998, the OIF is the first industry group to unite representatives
from data and optical networking disciplines, including many of the world's
leading carriers, component manufacturers and system vendors. The OIF promotes
the development and deployment of interoperable networking solutions and
services through the creation of Implementation Agreements (IAs) for optical,
interconnect, network processing, component and networking systems
technologies. The OIF actively supports and extends the work of standards
bodies and industry forums with the goal of promoting worldwide compatibility
of optical internetworking products. Information on the OIF can be found at
http://www.oiforum.com.

Contact:

Porchivina & Associates Public Relations
Deborah Porchivina, 415-272-0943 (Mobile)
deborah@papr.com
 
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