Rudolph Adds NSX 220 System to Macro Defect Inspection Family

  Rudolph Adds NSX 220 System to Macro Defect Inspection Family

  The new NSX tool is designed for semiconductor, MEMS and LED packaging and
         test facilities to achieve productivity at a low price point

SEMICON Taiwan 2013

Business Wire

FLANDERS, N.J. -- September 3, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced the availability of
its new NSX^® 220 Automated Macro Defect Inspection System. The system
provides fast, easy defect inspection for traditional back-end processes in
the semiconductor, MEMS and LED market at a reduced price point. The NSX 220
System joins the established NSX 320 System in the NSX family of automated
macro defect inspection and metrology systems for final manufacturing
facilities. The first NSX 220 System was installed in July at a major
outsourced assembly and test (OSAT) facility in Asia.

“The NSX 220 System is a streamlined version of our NSX 320 System,” said Mike
Jost, vice president and general manager of Rudolph’s Inspection Business
Unit. “The NSX 220 System is designed for traditional macro defect inspection
of wafers up to 300mm at conventional semiconductor, MEMS and LED final
manufacturing facilities, while the NSX 320 System serves next-generation
advanced packaging processes with defect inspection and three-dimensional
metrology for wafers up to 450mm. The NSX 220 System benefits from many of the
hardware and software innovations that made the NSX 320 System the market
leader in advanced packaging, but is targeted for back-end facilities that do
not need the full suite of capabilities offered by the NSX 320 System. Adding
the NSX 220 System to the NSX family gives our customers a choice of
best-in-class capabilities.”

The NSX 220 is an automated macro defect inspection system that uses
gray-scale image analysis (with color image capture) to provide fast, accurate
inspection and metrology in final manufacturing applications for wafers up to
300mm in size. It can detect traditional advanced macro defects such as
scratches, mechanical damage, foreign materials, voids and probe damage, while
also performing two-dimensional measurements on bumps, probe marks and edge
trim processes. The system operates over a range of resolutions (10µm - 0.5µm)
with both brightfield and optional darkfield illumination. The software
platform, leveraged from the NSX 320 System’s success, uses host-based image
processing and delivers significant improvements in usability and productivity
over older-generation NSX Series equipment. Using centrally-managed recipe
creation and editing, multiple NSX 220 tools can share a single recipe and be
matched across the fab.

An optional suite of yield management software optimizes the productivity of
both the NSX 220 and 320 Systems and minimizes the need for operator
assistance. Discover^® Software is designed for use with Rudolph inspection
systems to allow real-time analysis for faster solutions and intelligent
defect sampling for reduced offline review.

For more information about the NSX 220 Inspection System, visit
www.rudolphtech.com or the Rudolph booth at SEMICON^® Taiwan September 4-6,
2013.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995 (the “Act”) which include
the benefits to customers of Rudolph’s products, Rudolph’s existing market
position and its ability to maintain and advance such position relative to its
competitors and Rudolph’s ability to meet the expectations and needs of our
customers as well as other matters that are not purely historical data.
Rudolph wishes to take advantage of the “safe harbor” provided for by the Act
and cautions that actual results may differ materially from those projected as
a result of various factors, including risks and uncertainties, many of which
are beyond Rudolph’s control. Such factors include, but are not limited to,
delays in shipping products for technical performance, component supply or
other reasons, the company’s ability to leverage its resources to improve its
positions in its core markets and fluctuations in customer capital spending.
Additional information and considerations regarding the risks faced by Rudolph
are available in Rudolph’s Form 10-K report for the year ended December 31,
2012 and other filings with the Securities and Exchange Commission. As the
forward-looking statements are based on Rudolph’s current expectations, the
company cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to update
the forward-looking information contained in this press release.

Contact:

Rudolph Technologies, Inc.
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com
 
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