Kulicke & Soffa Launches New IConnPS ProCu PLUSTM And IConnPS ProCu PLUSTM
LA Copper Wire Bonders
For Copper Today, PLUS Tomorrow
SEMICON Taiwan 2013
SINGAPORE -- August 29, 2013
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S") today announced
another extension of its highly successful K&S Power Series^TM. The Company’s
new Copper Wire Bonders, IConn^PS ProCu PLUS[TM ]and ^ IConn^PS ProCu PLUS[TM
]LA, with proprietary upgraded and enhanced subsystems, is engineered to
handle even the most challenging, leading edge copper bonding demands.
The new IConn^PS ProCu PLUS[TM] and ^ IConn^PS ProCu PLUS[TM] ^ LA Copper
Wire Bonders come with the new ProCu5 process, which offers the highest level
of Copper Process capability. The ProCu5 process enables robust copper wire
bonding production for advanced wafer nodes below 28 nanometer.
The IConn^PS ProCu PLUS[TM ]Copper Wire Bonder offers the standard 80mm
bondable area with field upgradeability to an 87mm option. The IConn^PS ProCu
PLUS[TM ]LA model comes with a factory configured bondable area of 87mm.
Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business
Unit, remarked, “Customers can rely on K&S in helping meet the process
challenges of copper wire bonding at advanced silicon nodes. As the global
leader of the wire bond industry, K&S is committed to providing our customers
with reliable, cutting-edge technology solutions that add value to their
businesses. Our R&D team continues to innovate and develop new process
techniques to improve portability, stability and reliability, offering our
customers a cost of ownership advantage and high confidence in our products."
The IConn^PS ProCu PLUS[TM ]LA Copper Wire Bonder will debut at the Semicon
Taiwan show at the Taipei World Trade Center Nangang Exhibition Hall from
September 4-6, 2013.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor and LED assembly equipment. As a pioneer in this
industry, K&S has provided customers with market leading packaging solutions
for decades. In recent years, K&S has expanded its product offerings through
strategic acquisitions, adding wedge bonding and a broader range of expendable
tools to its core ball bonding products. Combined with its extensive expertise
in process technology, K&S is well positioned to help customers meet the
challenges of assembling the next-generation semiconductor and LED devices.
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Planning
Global IR Partners
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