FormFactor to Display Next-Generation 40um Pitch Probe Technologies at 2013 3D-TEST Workshop

FormFactor to Display Next-Generation 40um Pitch Probe Technologies at 2013 3D-TEST Workshop 
LIVERMORE, CA -- (Marketwired) -- 08/29/13 --  FormFactor Inc.
(NASDAQ: FORM) will present products from its portfolio of fine-pitch
40um grid-array pitch probe solutions at the annual 3D-TEST Workshop,
taking place September 12-13 at the Disneyland Hotel in Anaheim,
Calif. FormFactor is a corporate sponsor of this year's 3D-TEST
Workshop, which follows the September 10-12 International Test
Conference (ITC), the world's largest single exposition of
semiconductor test products, systems and services.  
At the 3D-TEST Workshop, FormFactor will feature its 40um grid-array
pitch contactor technology for direct testing of Through-Silicon-Vias
(TSVs), as well as grid-array micro-bumps or copper pillars for
2.5D/3D IC integration. This proprietary contactor technology is
being evaluated by leading memory semiconductor manufacturers in
their TSV development programs. The company will discuss certain new
developments achieved with the contactor technology in a formal
presentation and table-top demonstration at the 3D-TEST Workshop. The
company's contactor technology was honored earlier this year at the
IEEE VLSI Test Symposium in Berkeley when a presentation titled
"Direct Connection and Testing of TSV and Micro-bump Devices using
NanoPierce(TM)" captured the "Best Paper Award" for FormFactor
authors Dr. Onnik Yaglioglu and Ben Eldridge, the company's CTO.  
On Friday, September 13, FormFactor executives and technologists will
participate in the following events at the 3D-TEST Workshop: 
Session 7: 3D Wafer Probing
10:55am 
"Very Low Damage Direct Testing of Micro-bumps for 3D IC
Integration".
 Co-presentation by technologists from Elpida Memory,
Inc. and FormFactor. 
Session 10: Special Session on 2013 3DInCites Awards
3:00pm-4:00pm 
A panel discussion featuring the nominees and the
winner of the 2013 3DInCites Awards' Test and Reliability Tools and
Equipment category.
 FormFactor will be represented on the panel by
Mike Slessor, SVP & General Manager, MicroProbe Product Group. 
In addition to the presentations, FormFactor executives will be on
hand throughout the week to meet with customers. To schedule a
briefing, please contact Amy Leong at aleong@formfactor.com.  
Further information on the 2013 3D-TEST Workshop and ITC can be found
at www.itctestweek.org. 
About FormFactor: 
FormFactor Inc. (NASDAQ: FORM) is a leader in advanced wafer test
solutions. The company's advanced wafer probe cards enable
semiconductor manufacturers to lower their overall production costs,
improve yields, and bring next-generation devices to market.
FormFactor's acquisition of MicroProbe creates the leading wafer test
solution provider for both memory and non-memory semiconductor
manufacturers. FormFactor is headquartered in Livermore, California
with operations in Europe, Asia and North America. For more
information, visit the company's website at www.formfactor.com. 
FormFactor, MicroProbe and the FormFactor and MicroProbe logos are
registered or unregistered trademarks of FormFactor, Inc. All other
product, trademark, company or service names mentioned herein are the
property of their respective owners. 
Forward-looking Statements:
 Statements in this press release that
are not strictly historical in nature are forward-looking statements
within the meaning of the federal securities laws, including
statements regarding anticipated results, market conditions,
expectations and operating plans. These forward-looking statements
are based on current information and expectations that are inherently
subject to change and involve a number of risks and uncertainties.
Actual events or results might differ materially from those in any
forward-looking statement due to various factors, including, but not
limited to: risks that the company's 40um grid-array pitch contactor
technology for direct testing of Through-Silicon-Vias (TSVs), as well
as grid-array micro-bumps or copper pillars for 2.5D/3D IC
integration, does not meet customer requirements or demands; and
risks that the company's contactor technology does not successfully
complete qualification at leading memory semiconductor manufacturers.
Additional information concerning factors that could cause actual
events or results to differ materially from those in any
forward-looking statement is contained in the company's Form 10-K for
the fiscal year ended December 29, 2012, as filed with the SEC, and
subsequent SEC filings, including the company's Quarterly Reports on
Forms 10-Q. Copies of the company's SEC filings are available at
http://investors.formfactor.com/edgar.cfm. The company assumes no
obligation to update the information in this press release, to revise
any forward-looking statements or to update the reasons actual
results could differ materially from those anticipated in
forward-looking statements. 
FORM-F 
Trade Contact:
Amy Leong
Marketing 
(408) 457-3900 ext. 253
aleong@formfactor.com 
Investor Contact:
Stan Finkelstein
Investor Relations
(925) 290-4321
ir@formfactor.com 
 
 
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