STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies

STATS ChipPAC and Nanyang Technological University Collaborate on New 
Innovative Packaging Technologies 
Partnership to Advance Breakthrough Solutions for Next Generation
Semiconductor Packaging Technologies 
SINGAPORE -- 13 AUGUST 2013, UNITED STATES -- (Marketwired) --
08/12/13 --  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company")
(SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced
semiconductor packaging and test services, today announced a
collaborative partnership with Nanyang Technological University (NTU)
focused on generating breakthrough innovations in next generation
packaging technologies.  
STATS ChipPAC and NTU will collaboratively focus on further
advancement in wafer level packaging and interconnect technologies,
and the acceleration of research on new materials and manufacturing
processes. The partnership leverages the depth of resources in NTU's
academicians and researchers, and STATS ChipPAC's experience in
advanced semiconductor packaging technologies. 
Based in Singapore, NTU is one of the world's fastest-rising
universities, with globally acknowledged strengths in science and
engineering. NTU recently ranked No. 2 amongst the world's top young
universities aged 50 years and below by higher education information
provider Quacquarelli Symonds (QS). NTU is also ranked among Asia's
top 10 universities by QS. The university has made substantial
contributions to Singapore's drive for research and innovation, as
well as attracting top students and some of the world's best
professors. The partnership is in full alignment with STATS ChipPAC's
ongoing commitment to Singapore as the Company's global hub for
advanced wafer level technology research and development (R&D), and
Post Wafer fab Process (PWfP) for advanced mobile convergence
"The semiconductor industry is evolving rapidly to meet the
increasing device complexity and connectivity experience of today's
electronic consumers. We are constantly seeking to expand our
technology and manufacturing innovations in order to deliver
differentiated solutions for our customers' next generation mobile
convergence devices. We are excited to collaborate with NTU to
harness semiconductor technologies that will drive the next
generation of electronic devices," said Dr. Han Byung Joon, Executive
Vice President and Chief Technology Officer, STATS ChipPAC. 
"NTU continues to be the choice partner for industry leading
companies, a key trait of a world-class, research-intensive
university. NTU has an established track record in research and
development with key industry players and through such partnerships,
we turn fundamental research into innovation, leading to
commercialisation. NTU's collaboration with STATS ChipPAC provides a
great opportunity for NTU faculty and post graduates to leverage on
our strong research culture and expertise to develop advanced
packaging solutions. By continuing to work in tandem with industry
leaders such as STATS ChipPAC, we can continue to be an important
engine for innovation in Singapore," said Dr Lim Jui, Chief Executive
Officer, NTU Innovation. 
Forward-Looking Statements
 Certain statements in this release are
forward-looking statements that involve a number of risks and
uncertainties that could cause actual results to differ materially
from those described in this release. Factors that could cause actual
results to differ include, but are not limited to, general business
and economic conditions and the state of the semiconductor industry;
prevailing market conditions; demand for end-use applications
products such as communications equipment, consumer and
multi-applications and personal computers; decisions by customers to
discontinue outsourcing of test and packaging services; level of
competition; our reliance on a small group of principal customers;
our continued success in technological innovations; pricing
pressures, including declines in average selling prices; intellectual
property rights disputes and litigation; our ability to control
operating expenses; our substantial level of indebtedness and access
to credit markets; potential impairment charges; availability of
financing; changes in our product mix; our capacity utilisation;
delays in acquiring or installing new equipment; limitations imposed
by our financing arrangements which may limit our ability to maintain
and grow our business; returns from research and development
investments; changes in customer order patterns; customer credit
risks; disruption of our operations; shortages in supply of key
components and disruption in supply chain; inability to consolidate
our Malaysia operations into our China operations and uncertainty as
to whether such plan will achieve the expected objectives and
results; the amount of the business interruption insurance claim due
to flooding of the Thailand Plant; loss of key management or other
personnel; defects or malfunctions in our testing equipment or
packages; rescheduling or cancelling of customer orders; adverse tax
and other financial consequences if the taxing authorities do not
agree with our interpretation of the applicable tax laws;
classification of our Company as a passive foreign investment
company; our ability to develop and protect our intellectual
property; changes in environmental laws and regulations; exchange
rate fluctuations; regulatory approvals for further investments in
our subsidiaries; majority ownership by Temasek Holdings (Private)
Limited ("Temasek") that may result in conflicting interests with
Temasek and our affiliates; unsuccessful acquisitions and investments
in other companies and businesses; labour union problems in South
Korea; uncertainties of conducting business in China and changes in
laws, currency policy and political instability in other countries in
Asia; natural calamities and disasters, including outbreaks of
epidemics and communicable diseases; the continued trading and
listing of our ordinary shares on the Singapore Exchange Securities
Trading Limited ("SGX-ST"). You should not unduly rely on such
statements. We do not intend, and do not assume any obligation, to
update any forward-looking statements to reflect subsequent events or
About STATS ChipPAC Ltd. 
 STATS ChipPAC Ltd. (SGX-ST Code: S24) is a
leading service provider of semiconductor packaging design, assembly,
test and distribution solutions in diverse end market applications
including communications, digital consumer and computing. With global
headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout
Asia, the United States and Europe. STATS ChipPAC is listed on the
SGX-ST. Further information is available at
Information contained in this website does not constitute a part of
this release.  
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance 
Tel: (65) 6824 7788
Fax: (65) 6720 7826
Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
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