STMicroelectronics : STMicroelectronics Unveils New Pressure Sensor Technology

STMicroelectronics : STMicroelectronics Unveils New Pressure Sensor Technology

    Fully molded package incorporating an isolated sensing element offers
         industry-leading precision for absolute pressure measurement

Geneva, July 30, 2013 - STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, the
world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer, and the
leading supplier of MEMS sensors for consumer and portable applications^[1],
has announced a new, ST-patented technology that isolates the pressure-sensing
element within a fully molded package to meet the ultra-small form factor
requirements and design creativity for the next generation of portable
consumer devices.

Integrating the isolated pressure-sensing element in a fully molded package,
this unique technology enables fully encapsulated wire bonding with zero risk
of corrosion, elimination of wire bonding damage during pick and place
assembly, zero risk of cap detachment or cap damage while the device is being
mounted, and no impact on the sensor from the soldering process to ensure a
more robust packaging solution.

According to market analysts Yole Développement^[2], the MEMS pressure sensor
market will grow from $1.9B in 2012 to $3B in 2018. MEMS pressure sensors for
consumer applications, especially for smartphones and tablets, will represent
1.7 billion units and will overtake automotive as the leading target
application for MEMS, adding 8% CAGR to the global MEMS pressure sensor
market. ST has over 800 MEMS-related patents and patent applications worldwide
and as the world's top MEMS manufacturer, has a production capacity of 4
million devices per day and has shipped more than three billion MEMS devices.

"This technology represents a revolution in the enhancement of performance and
quality for pressure sensors. STMicroelectronics pioneered the use of fully
molded packages without gel for high volume manufacturing for Accelerometers
and Gyroscopes," said Benedetto Vigna, Executive Vice President, General
Manager, Analog, MEMS & Sensors Group, STMicroelectronics. "We are now
leveraging this knowledge to revolutionize the packaging in the emerging field
of pressure sensors where STMicroelectronics is the first to use a fully
molded package without gel for a high performance pressure sensor with
enhanced accuracy."

The new technology enhances accuracy (± 0.2 mbar) while continuing to offer
zero drift, low noise (0.010 mbar RMS) and a simplified calibration system,
making it ideal for a broad range of consumer, automotive and industrial
applications including indoor/outdoor navigation, location-based services,
enhanced GPS dead-reckoning, altimeter and barometer functions, weather
station equipment, and healthcare applications.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.

In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com.

For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations

+1 781 591 0354
michael.markowitz@st.com

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[1] IHS: MEMS H2 2012 Special Report

[2] Yole Développement: MEMS Pressure Sensor 2013

STMicroelectronics Pressure Sensor Technology

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Source: STMicroelectronics via Thomson Reuters ONE
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